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LB1867M-TLM-H

Onsemi

LB1867M-TLM-H by Onsemi

LB1867M-TLM-H by Onsemi is a Motion Control IC with 12/24V power supplies, 14 terminals, and operating temperatures from -30 to 80°C. It features a small outline package style for surface mount applications. This bipolar technology IC is ideal for commercial extended temperature grade applications requiring precise motion control.

Median Price

$0.693

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,930 parts In-Stock

1+ parts

$0.693

100+ parts

$0.651

1k+ parts

$0.589

10k+ parts

-

3,930

$0.693

$0.651

$0.589

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,366 parts In-Stock

1+ parts

$0.658

100+ parts

-

1k+ parts

-

10k+ parts

-

2,366

$0.658

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.748

100+ parts

-

1k+ parts

-

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450

$0.748

-

-

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Vyrian

USA . 4,618 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,618

-

-

-

-

Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

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4,500

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-

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

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2,000

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-

-

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ACDS - Activité Composants Distribution Service

France . 969 parts In-Stock

1+ parts

-

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969

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-

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Bristol Electronics

USA . 969 parts In-Stock

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969

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,791 parts In-Stock

1+ parts

$0.590

100+ parts

-

1k+ parts

-

10k+ parts

-

3,791

$0.590

-

-

-

Semicontronic

India . 3,749 parts In-Stock

1+ parts

$0.590

100+ parts

$0.575

1k+ parts

$0.572

10k+ parts

-

3,749

$0.590

$0.575

$0.572

-

Corphita

USA . 1,661 parts In-Stock

1+ parts

$0.624

100+ parts

-

1k+ parts

-

10k+ parts

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1,661

$0.624

-

-

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Corohmni

South Africa . 81 parts In-Stock

1+ parts

$0.693

100+ parts

-

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10k+ parts

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81

$0.693

-

-

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Argo Parts USA

USA . 2,380 parts In-Stock

1+ parts

$0.728

100+ parts

-

1k+ parts

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10k+ parts

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2,380

$0.728

-

-

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

$1.100

100+ parts

$0.642

1k+ parts

-

10k+ parts

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1,000

$1.100

$0.642

-

-

Aztec Data Supply Inc.

USA . 2,546 parts In-Stock

1+ parts

$2.250

100+ parts

-

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-

10k+ parts

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2,546

$2.250

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$14.226

100+ parts

$13.515

1k+ parts

$13.515

10k+ parts

-

500

$14.226

$13.515

$13.515

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AZTECH Wire

Italy . 1,013 parts In-Stock

1+ parts

$19.290

100+ parts

-

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10k+ parts

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1,013

$19.290

-

-

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Component Stockers USA

USA . 452 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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452

$99.990

-

-

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TANS Electronics

Latvia . 6,939 parts In-Stock

1+ parts

-

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6,939

-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Kulean Microsystems

USA . 3,523 parts In-Stock

1+ parts

-

100+ parts

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3,523

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-

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Problanco Electronics

Mexico . 2,663 parts In-Stock

1+ parts

-

100+ parts

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2,663

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Futuretech Components

Singapore . 2,535 parts In-Stock

1+ parts

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2,535

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-

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SupplyDigital Components

Austria . 2,247 parts In-Stock

1+ parts

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2,247

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-

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UHIMA Technologies

Türkiye . 801 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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801

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.733

1k+ parts

$0.711

10k+ parts

$0.696

500

-

$0.733

$0.711

$0.696

Microchip USA

USA . 368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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368

-

-

-

-

Overview

Enhance your motion control applications with the LB1867M-TLM-H by Onsemi. Crafted with precision and reliability, this product offers superior performance in a compact package. Designed to operate at a wide range of temperatures, it ensures seamless functionality even in challenging environments. With its advanced technology and user-friendly design, this motion control IC provides exceptional value and efficiency, making it a must-have for customers seeking top-notch quality and innovation. Experience the difference with Onsemi and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications requiring motion control in various industries.

Surface Mount:

YES - The surface mount option allows for easy and convenient installation, making this product suitable for compact and space-constrained designs.

Package Shape:

RECTANGULAR - The rectangular package shape offers a standardized form factor, simplifying integration with existing systems and reducing design complexity.

Power Supplies (V):

12/24 - With support for 12/24 volt power supplies, this product provides flexibility for different voltage requirements in motion control applications.

No. of Terminals:

14 - The 14 terminals offer multiple connection points for enhanced functionality and compatibility with a wide range of systems.

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH - The small outline and shrink pitch package style saves space and allows for higher component density on circuit boards.

Maximum Operating Temperature:

80 °C - The high maximum operating temperature ensures reliable performance in demanding environments, extending the product's operational lifespan.

Minimum Operating Temperature:

30 °C - The low minimum operating temperature enables this product to function effectively in cold conditions, making it versatile for various climates.

Terminal Finish:

TIN BISMUTH - The tin bismuth terminal finish provides excellent solderability and corrosion resistance, ensuring a secure and long-lasting connection.

Terminal Position:

DUAL - The dual terminal position offers flexibility in installation and connection options, accommodating different layout requirements in motion control systems.

Technical Specifications

Motion Control ICs LB1867M-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12/24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LB1867M-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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