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LB1836M-MPB-E

Onsemi

LB1836M-MPB-E by Onsemi

LB1836M-MPB-E by Onsemi is a motion control IC with a supply voltage of 3V and max operating temperature of 85°C. It has 14 terminals, uses bipolar technology, and is suitable for industrial applications requiring small outline packaging.

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.290

10k+ parts

$1.150

20

-

$1.560

$1.290

$1.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,405 parts In-Stock

1+ parts

$1.216

100+ parts

-

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-

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-

2,405

$1.216

-

-

-

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$1.936

100+ parts

-

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-

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-

38

$1.936

-

-

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Vyrian

USA . 7,020 parts In-Stock

1+ parts

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7,020

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 20 parts In-Stock

1+ parts

$1.090

100+ parts

-

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-

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-

20

$1.090

-

-

-

Corphita

USA . 285 parts In-Stock

1+ parts

$1.152

100+ parts

-

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285

$1.152

-

-

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Corohmni

South Africa . 134 parts In-Stock

1+ parts

$1.280

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-

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134

$1.280

-

-

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Continental Prestige Electronics

USA . 6,460 parts In-Stock

1+ parts

$1.936

100+ parts

-

1k+ parts

-

10k+ parts

$1.897

6,460

$1.936

-

-

$1.897

Argo Parts USA

USA . 2,495 parts In-Stock

1+ parts

$1.936

100+ parts

-

1k+ parts

-

10k+ parts

-

2,495

$1.936

-

-

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AZTECH Wire

Italy . 334 parts In-Stock

1+ parts

$8.094

100+ parts

-

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334

$8.094

-

-

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Kulean Microsystems

USA . 5,763 parts In-Stock

1+ parts

-

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5,763

-

-

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TANS Electronics

Latvia . 5,698 parts In-Stock

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5,698

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UHIMA Technologies

Türkiye . 864 parts In-Stock

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864

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Problanco Electronics

Mexico . 597 parts In-Stock

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597

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Microchip USA

USA . 457 parts In-Stock

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457

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SupplyDigital Components

Austria . 201 parts In-Stock

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201

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Overview

Experience precision and reliability with the LB1836M-MPB-E motion control IC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and performance. This versatile IC is perfect for a wide range of applications, from robotics to automotive systems. With its small outline and dual terminal position, it offers easy integration and installation. The LB1836M-MPB-E operates flawlessly in industrial environments, with a temperature range of -40 to 85 °C. Trust in the excellence of Onsemi and unlock the limitless possibilities this motion control IC brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs, making this product ideal for compact designs.

Nominal Supply Voltage (Vsup): 3 V

The low nominal supply voltage makes this product energy-efficient and suitable for applications where power consumption is a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in various settings.

Technology: BIPOLAR

Bipolar technology offers precise control and high speed performance, making this product suitable for demanding motion control applications.

Technical Specifications

Motion Control ICs LB1836M-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

35 mA

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LB1836M-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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