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LB1837M-MPB-E

Onsemi

LB1837M-MPB-E by Onsemi

LB1837M-MPB-E by Onsemi is a Motion Control IC with 14 terminals, 6V supply voltage, and 9mA max supply current. It operates b/w -20 to 80 °C, suitable for commercial extended temperature applications requiring bipolar technology in a small outline package.

Median Price

$1.190

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,969 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$0.988

10k+ parts

$0.881

1,969

-

$1.190

$0.988

$0.881

DigiKey

USA . 1,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.010

10k+ parts

-

1,969

-

-

$1.010

-

Verical

USA . 1,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.235

10k+ parts

$1.101

1,230

-

-

$1.235

$1.101

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 806 parts In-Stock

1+ parts

$0.860

100+ parts

-

1k+ parts

-

10k+ parts

-

806

$0.860

-

-

-

Digiode

USA . 1,095 parts In-Stock

1+ parts

$0.926

100+ parts

-

1k+ parts

-

10k+ parts

-

1,095

$0.926

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 495 parts In-Stock

1+ parts

$0.860

100+ parts

-

1k+ parts

-

10k+ parts

-

495

$0.860

-

-

-

Corphita

USA . 1,148 parts In-Stock

1+ parts

$0.878

100+ parts

-

1k+ parts

-

10k+ parts

-

1,148

$0.878

-

-

-

Advanced Electronics

New Zealand . 23 parts In-Stock

1+ parts

$28.557

100+ parts

$25.987

1k+ parts

$23.417

10k+ parts

-

23

$28.557

$25.987

$23.417

-

Problanco Electronics

Mexico . 6,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,950

-

-

-

-

TANS Electronics

Latvia . 6,740 parts In-Stock

1+ parts

-

100+ parts

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6,740

-

-

-

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Kulean Microsystems

USA . 6,316 parts In-Stock

1+ parts

-

100+ parts

-

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6,316

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-

-

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SupplyDigital Components

Austria . 2,838 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,838

-

-

-

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Continental Prestige Electronics

USA . 1,969 parts In-Stock

1+ parts

-

100+ parts

$0.833

1k+ parts

-

10k+ parts

-

1,969

-

$0.833

-

-

UHIMA Technologies

Türkiye . 333 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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333

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-

-

-

Microchip USA

USA . 180 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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180

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-

Overview

Enhance your motion control systems with the LB1837M-MPB-E by Onsemi. Crafted with precision and reliability, this motion control IC offers seamless performance in various applications. From robotics to automotive systems, this product ensures smooth operations and precise control. With Onsemi's reputation for quality and innovation, the LB1837M-MPB-E delivers exceptional value and benefits to customers looking to elevate their motion control solutions. Trust in Onsemi for top-tier technology that makes a difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or high-demand applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient PCB assembly, saving time and cost in production.

Nominal Supply Voltage (Vsup): 6 V

The nominal supply voltage of 6V ensures reliable and consistent performance in a variety of operating conditions.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature of 80 °C, this product can withstand harsh environmental conditions and extended use.

Technology: BIPOLAR

The use of bipolar technology provides precise control and efficient power management for optimal performance.

Technical Specifications

Motion Control ICs LB1837M-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

6

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

9 mA

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LB1837M-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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