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LB1840M

Onsemi

LB1840M by Onsemi

LB1840M by Onsemi is a Motion Control IC with 14 terminals, operating at -20 to 80 °C. It has a supply voltage of 6V and max current of 6.5mA. This bipolar technology IC is ideal for applications requiring precise motion control in commercial extended temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 982 parts In-Stock

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Digiode

USA . 847 parts In-Stock

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847

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Problanco Electronics

Mexico . 6,772 parts In-Stock

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6,772

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SupplyDigital Components

Austria . 3,181 parts In-Stock

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Corphita

USA . 1,531 parts In-Stock

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Kulean Microsystems

USA . 699 parts In-Stock

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699

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UHIMA Technologies

Türkiye . 533 parts In-Stock

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TANS Electronics

Latvia . 151 parts In-Stock

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Corohmni

South Africa . 57 parts In-Stock

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Overview

Enhance your motion control applications with the LB1840M by Onsemi, a high-quality IC designed to optimize performance and efficiency. With Onsemi's reputation for excellence in manufacturing, this product offers unmatched reliability and durability. Whether you're working on robotics, automation, or motor control projects, this versatile component delivers superior value and benefits to customers by streamlining operations and improving overall system functionality. Upgrade your designs today with the LB1840M and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy are durable and lightweight materials, making this product sturdy and easy to handle.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making this product ideal for applications where size is a concern.

Nominal Supply Voltage (Vsup): 6 V

With a nominal supply voltage of 6V, this product is suitable for a variety of applications requiring a low voltage supply.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature of 80 °C, this product is reliable in extreme temperature conditions.

Technology: BIPOLAR

Bipolar technology ensures high performance and efficiency in control applications, making this product a reliable choice.

Technical Specifications

Motion Control ICs LB1840M attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

6

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

6.5 mA

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LB1840M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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