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LB1838M

Onsemi

LB1838M by Onsemi

LB1838M by Onsemi is a Motion Control IC with 14 terminals, operating voltage of 2.5-9V, and temp range of -20 to 75°C. Ideal for stepper motor control applications due to its small outline package and bipolar technology.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 1,644 parts In-Stock

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Digiode

USA . 1,576 parts In-Stock

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Vyrian

USA . 1,406 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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LWI Electronics Inc

India . 60 parts In-Stock

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60

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Sogenti Electronics

Canada . 38 parts In-Stock

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Corohmni

South Africa . 582 parts In-Stock

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$1.098

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Ampacity Inc.

Singapore . 208 parts In-Stock

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$4.500

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Aztec Data Supply Inc.

USA . 3,948 parts In-Stock

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$15.300

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AZTECH Wire

Italy . 670 parts In-Stock

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Problanco Electronics

Mexico . 7,660 parts In-Stock

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Continental Prestige Electronics

USA . 6,971 parts In-Stock

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Kulean Microsystems

USA . 6,784 parts In-Stock

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TANS Electronics

Latvia . 5,921 parts In-Stock

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Infinite Electronics LLP (Excess)

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Argo Parts USA

USA . 3,074 parts In-Stock

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SupplyDigital Components

Austria . 2,967 parts In-Stock

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Corphita

USA . 1,839 parts In-Stock

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UHIMA Technologies

Türkiye . 441 parts In-Stock

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Kepictronics

USA . 254 parts In-Stock

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Bastille Electronics

Australia . 18 parts In-Stock

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Overview

Enhance your motion control applications with the LB1838M by Onsemi. As a leader in manufacturing high-quality ICs, Onsemi delivers reliability and performance you can trust. The LB1838M is designed for stepper motor control, offering precise and efficient operation. With a compact package and wide operating temperature range, this IC provides value and versatility to your projects. Trust Onsemi to deliver innovative solutions for all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration into electronic circuitry, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3 V

Operating at a low supply voltage of 3V allows for energy-efficient performance and compatibility with a wide range of power sources.

Power Supplies (V): 3

Having multiple power supplies ensures stability and reliability in different operating conditions, enhancing overall performance.

No. of Terminals: 14

The high number of terminals provides flexibility in connecting to other components, enabling versatile use in various systems.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature of 75°C, the product can withstand demanding environments and maintain functionality.

Minimum Operating Temperature: -20 °C

The wide temperature range allows for operation in cold conditions, making the product suitable for diverse applications.

Width (mm): 4.4 mm

The compact width facilitates space-saving layout designs and enables integration into small electronic devices.

Technology: BIPOLAR

Bipolar technology offers precise control and high performance, making the product ideal for applications requiring accurate motion control.

Technical Specifications

Motion Control ICs LB1838M attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO REQUIRE 1.8V TO 9V

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

8 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LB1838M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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