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FNA25012A

Onsemi

FNA25012A by Onsemi

FNA25012A by Onsemi is a Motion Control IC with 600V nominal voltage, 75A max output current, and -40 to 125°C operating temperature range. Ideal for AC motor control applications in automotive settings due to its hybrid technology and through-hole terminal form.

Median Price

$69.080

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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Mouser Electronics

USA . 12 parts In-Stock

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$62.010

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Arrow

USA . 5 parts In-Stock

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$69.080

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$53.320

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DigiKey

USA . 12 parts In-Stock

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$70.500

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$54.259

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Rochester

USA . 151 parts In-Stock

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$87.280

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$82.040

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$74.190

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$74.190

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Verical

USA . 3,504 parts In-Stock

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$54.600

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Flip Electronics (Authorized)

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Digiode

USA . 2,066 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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$88.845

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Vyrian

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Aztec Data Supply Inc.

USA . 2,260 parts In-Stock

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$14.479

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AZTECH Wire

Italy . 458 parts In-Stock

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$18.059

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Ampacity Inc.

Singapore . 153 parts In-Stock

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$37.700

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Corphita

USA . 994 parts In-Stock

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$39.920

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Corohmni

South Africa . 314 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$87.068

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Continental Prestige Electronics

USA . 1,723 parts In-Stock

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Microchip USA

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SupplyDigital Components

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Problanco Electronics

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GreenTree Electronics

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Overview

Unleash the power of precision with the FNA25012A by Onsemi, a cutting-edge Motion Control IC designed to elevate your applications to new heights. Crafted with the utmost quality and expertise that Onsemi is renowned for, this AC Motor Controller offers unmatched performance and reliability. Whether you're in automotive or industrial automation, this hybrid technology marvel delivers seamless control and efficiency, ensuring optimal results every time. Embrace the future of motion control with the FNA25012A and experience the difference innovation makes.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into existing systems.

Nominal Supply Voltage (Vsup): 600 V

High supply voltage capability provides flexibility in various applications and power requirements.

No. of Terminals: 34

Sufficient number of terminals for connections and control options, enhancing versatility.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures precise manufacturing and reliable performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for operation in demanding environments without performance degradation.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in extreme cold conditions without issues.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connections, improving overall system reliability.

Maximum Seated Height: 9.2 mm

Low seated height enables compact design and efficient use of space in the system.

Width (mm): 33 mm

Compact width makes it suitable for applications with space constraints.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, ensuring optimal performance and efficiency.

Minimum Supply Voltage (Vsup): 300 V

Wide range of supply voltage allows for compatibility with various power sources.

Length: 80 mm

Compact length makes it suitable for applications with limited space availability.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive applications.

Maximum Output Current: 75 A

High output current capability allows for driving high-power applications with ease.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies for enhanced performance and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connections suitable for industrial applications.

Maximum Supply Voltage (Vsup): 800 V

Wide supply voltage range allows for flexibility in different power supply scenarios.

Technical Specifications

Motion Control ICs FNA25012A attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

CONTROL SUPPLY VOLTAGE(VCC)= 15V

Other IC type:

JESD-30 Code:

R-XDMA-T34

JESD-609 Code:

e3

Length:

80 mm

No. of Functions:

1

No. of Terminals:

34

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

75 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

9.2 mm

Maximum Supply Voltage (Vsup):

800 V

Minimum Supply Voltage (Vsup):

300 V

Nominal Supply Voltage (Vsup):

600 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

33 mm

Trade Compliance

FNA25012A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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