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FNA23512A

Onsemi

FNA23512A by Onsemi

AC MOTOR CONTROLLER; No. of Terminals: 34; Package Shape: RECTANGULAR; Surface Mount: NO; JESD-30 Code: R-XDMA-T34; Maximum Output Current: 70 A;

Median Price

$55.063

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Farnell

UK . 5 parts In-Stock

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$51.240

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$50.740

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Newark

USA . 1 parts In-Stock

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$66.480

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$60.190

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$66.480

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Mouser Electronics

USA . 58 parts In-Stock

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$70.990

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$63.440

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$70.990

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Element14

Singapore . 5 parts In-Stock

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$91.600

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$90.720

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Flip Electronics (Authorized)

USA . 1,872 parts In-Stock

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Verical

USA . 504 parts In-Stock

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$55.063

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DigiKey

USA . 408 parts In-Stock

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$42.670

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EBV Elektronik

Germany . 12 parts In-Stock

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Rochester

USA . 7 parts In-Stock

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$54.710

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$48.950

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$46.070

7

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$54.710

$48.950

$46.070

Distributors (In-Stock)

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Digiode

USA . 2,350 parts In-Stock

1+ parts

$48.678

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$48.678

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Nova Conductors

Japan . 700 parts In-Stock

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$63.510

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$63.510

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NAC Semi

USA . 12 parts In-Stock

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$307.180

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$279.250

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Chip Stock

USA . 2,900 parts In-Stock

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IBS Electronics

USA . 1,320 parts In-Stock

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$63.947

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Flip Electronics

USA . 408 parts In-Stock

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Vyrian

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Continental Prestige Electronics

USA . 24 parts In-Stock

1+ parts

$42.360

100+ parts

$36.690

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$42.360

$36.690

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Semicontronic

India . 408 parts In-Stock

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$43.550

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$42.461

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$42.244

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408

$43.550

$42.461

$42.244

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Ampacity Inc.

Singapore . 403 parts In-Stock

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$43.550

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$43.550

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Corphita

USA . 1,448 parts In-Stock

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$46.116

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Corohmni

South Africa . 428 parts In-Stock

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$51.240

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Netroflash

USA . 50 parts In-Stock

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$63.510

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$62.240

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Microchip USA

USA . 2,811 parts In-Stock

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$170.591

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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SupplyDigital Components

Austria . 5,187 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,269 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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Argo Parts USA

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 756 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 596 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Futuretech Components

Singapore . 260 parts In-Stock

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Technical Specifications

Motion Control ICs FNA23512A attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T34

JESD-609 Code:

e3

Length:

80 mm

No. of Functions:

1

No. of Terminals:

34

Maximum Output Current:

70 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

8.1 mm

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

33 mm

Trade Compliance

FNA23512A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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