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FNA23060

Onsemi

FNA23060 by Onsemi

FNA23060 by Onsemi is a Motion Control IC with 34 terminals, operating b/w -40 to 125°C. It features a max output current of 60A and supports AC motor control applications. With a package size of 80x33mm and automotive temperature grade, it's ideal for high-power motion control systems.

Median Price

$36.091

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Arrow

USA . 144 parts In-Stock

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$36.091

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Flip Electronics (Authorized)

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Nova Conductors

Japan . 300 parts In-Stock

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$54.459

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Chip Stock

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Vyrian

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Digiode

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Ampacity Inc.

Singapore . 4 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 570 parts In-Stock

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$13.704

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Corohmni

South Africa . 404 parts In-Stock

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$53.370

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Continental Prestige Electronics

USA . 6,504 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$54.459

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$51.736

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$50.647

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$50.647

Microchip USA

USA . 3,894 parts In-Stock

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Kepictronics

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SupplyDigital Components

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Problanco Electronics

Mexico . 3,112 parts In-Stock

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Supply Digital

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Kulean Microsystems

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TANS Electronics

Latvia . 1,380 parts In-Stock

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Argo Parts USA

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Corphita

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UHIMA Technologies

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Overview

Unlock the power of precision with the FNA23060 by Onsemi. As a leader in motion control ICs, Onsemi delivers top-notch quality and innovation, setting the standard for excellence in the industry. Designed for automotive applications, this AC motor controller offers seamless performance and precise control, ensuring optimal functionality and efficiency. Say goodbye to compromise and hello to reliability with the FNA23060 - your go-to solution for superior motion control.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy installation and placement in various systems.

Nominal Supply Voltage (Vsup): 15 V

Optimal voltage supply for efficient and reliable operation of the motion control IC.

No. of Terminals: 34

Sufficient number of terminals for connecting various components and interfaces.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and performance in demanding environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in different climatic conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent conductivity and durability for long-term usage.

Maximum Seated Height: 8.1 mm

Low seated height ensures compact design and space-saving installation.

Width (mm): 33 mm

Moderate width for a balance between space efficiency and accessibility for connections.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, making it a specialized and effective choice for motor control applications.

Minimum Supply Voltage (Vsup): 14 V

Low minimum supply voltage allows for flexibility in power input options.

Length: 80 mm

Sufficient length for accommodating internal components and circuitry for enhanced functionality.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and durability in vehicle applications.

Maximum Output Current: 60 A

High maximum output current capability for powering various motor loads and devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for secure and stable connections to external components.

Maximum Supply Voltage (Vsup): 16.5 V

High maximum supply voltage for compatibility with different power sources and systems.

Technical Specifications

Motion Control ICs FNA23060 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T34

JESD-609 Code:

e3

Length:

80 mm

No. of Functions:

1

No. of Terminals:

34

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

60 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

8.1 mm

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

33 mm

Trade Compliance

FNA23060 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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