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PMCT8316A1TRGFR

Texas Instruments

PMCT8316A1TRGFR by Texas Instruments

PMCT8316A1TRGFR by Texas Instruments is a Motion Control IC with 40 terminals, operating voltage range of 4.5V to 35V, and max output current of 8A. It is used as a Brushless DC Motor Controller in applications requiring precise motion control at temperatures ranging from -40°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,061 parts In-Stock

1+ parts

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8,061

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Digiode

USA . 3,754 parts In-Stock

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3,754

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 449 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

449

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 347 parts In-Stock

1+ parts

$4.500

100+ parts

-

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347

$4.500

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AZTECH Wire

Italy . 285 parts In-Stock

1+ parts

$6.091

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285

$6.091

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Parana Technologies

USA . 2,044 parts In-Stock

1+ parts

$18.495

100+ parts

-

1k+ parts

$18.609

10k+ parts

-

2,044

$18.495

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$18.609

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DigiPath Technology Company

USA . 78 parts In-Stock

1+ parts

$20.365

100+ parts

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78

$20.365

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ChromeModa Solutions

Germany . 864 parts In-Stock

1+ parts

$20.781

100+ parts

$17.040

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864

$20.781

$17.040

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IDEA Electronic Components Group

UK . 489 parts In-Stock

1+ parts

$20.781

100+ parts

$19.742

1k+ parts

$18.703

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489

$20.781

$19.742

$18.703

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Corphita

USA . 532 parts In-Stock

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532

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Corohmni

South Africa . 167 parts In-Stock

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167

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Overview

Enhance your motion control applications with the PMCT8316A1TRGFR by Texas Instruments. Crafted with precision and expertise, this Brushless DC Motor Controller offers unparalleled quality and reliability. Whether you're in robotics, automation, or industrial equipment, this IC is designed to optimize performance and efficiency. With a wide supply voltage range, high output current capability, and durable construction, this product delivers exceptional value and benefits to customers seeking top-notch motion control solutions. Upgrade your systems today with the PMCT8316A1TRGFR and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 24 V

The 24V supply voltage offers a good balance between power efficiency and performance for motion control applications.

Maximum Output Current: 8 A

With a high maximum output current of 8A, this IC can effectively drive motors and other components with demanding power requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable operation even in challenging thermal environments.

Technical Specifications

Motion Control ICs PMCT8316A1TRGFR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

PMCT8316A1TRGFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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