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LV8968BBUWR2G

Onsemi

LV8968BBUWR2G by Onsemi

LV8968BBUWR2G by Onsemi is a Motion Control IC with 48 terminals, suitable for Brushless DC Motor control. It operates at 8-28V, with a peak reflow temp of 260°C. The package style is flatpack, low profile, and heat sink/slug in a square shape.

Median Price

$5.075

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,178 parts In-Stock

1+ parts

$4.721

100+ parts

-

1k+ parts

-

10k+ parts

-

2,178

$4.721

-

-

-

DigiKey

USA . 2,484 parts In-Stock

1+ parts

$9.530

100+ parts

$6.304

1k+ parts

$6.191

10k+ parts

-

2,484

$9.530

$6.304

$6.191

-

Rochester

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

$5.060

1k+ parts

$4.530

10k+ parts

$4.260

40,000

-

$5.060

$4.530

$4.260

Verical

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.090

35,000

-

-

-

$5.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,598 parts In-Stock

1+ parts

$5.586

100+ parts

-

1k+ parts

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1,598

$5.586

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$6.225

100+ parts

-

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10

$6.225

-

-

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Flip Electronics

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

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30,000

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Chip Stock

USA . 26,000 parts In-Stock

1+ parts

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26,000

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Sensible Micro Corp

USA . 4,759 parts In-Stock

1+ parts

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4,759

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Vyrian

USA . 2,208 parts In-Stock

1+ parts

-

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2,208

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,263 parts In-Stock

1+ parts

$4.450

100+ parts

$4.339

1k+ parts

$4.316

10k+ parts

-

2,263

$4.450

$4.339

$4.316

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Ampacity Inc.

Singapore . 2,258 parts In-Stock

1+ parts

$4.450

100+ parts

-

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2,258

$4.450

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Corohmni

South Africa . 189 parts In-Stock

1+ parts

$5.233

100+ parts

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189

$5.233

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Corphita

USA . 814 parts In-Stock

1+ parts

$5.292

100+ parts

-

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814

$5.292

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Continental Prestige Electronics

USA . 5,340 parts In-Stock

1+ parts

$6.225

100+ parts

-

1k+ parts

-

10k+ parts

$6.101

5,340

$6.225

-

-

$6.101

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.225

100+ parts

$6.101

1k+ parts

-

10k+ parts

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100

$6.225

$6.101

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Aztec Data Supply Inc.

USA . 1,066 parts In-Stock

1+ parts

$7.820

100+ parts

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1,066

$7.820

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Microchip USA

USA . 4,908 parts In-Stock

1+ parts

$15.614

100+ parts

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4,908

$15.614

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Lixinc

USA . 10,884 parts In-Stock

1+ parts

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10,884

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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10,000

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TANS Electronics

Latvia . 8,302 parts In-Stock

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8,302

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iodParts Technologies Inc.

India . 7,258 parts In-Stock

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7,258

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 3,286 parts In-Stock

1+ parts

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3,286

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Problanco Electronics

Mexico . 924 parts In-Stock

1+ parts

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924

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SupplyDigital Components

Austria . 821 parts In-Stock

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821

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UHIMA Technologies

Türkiye . 266 parts In-Stock

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266

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Argo Parts USA

USA . 173 parts In-Stock

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173

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Overview

Elevate your motion control experience with the LV8968BBUWR2G by Onsemi. Crafted with precision and expertise, this Brushless DC Motor Controller offers seamless performance and reliability. Ideal for a variety of applications, this innovative product ensures smooth operation and precise control. With Onsemi's commitment to quality and excellence, you can trust that the LV8968BBUWR2G will exceed your expectations. Upgrade your motion control system today and experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for applications that require portability and longevity.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and costs in production.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V allows for compatibility with a wide range of power sources, making it versatile for different applications.

No. of Terminals: 48

Having a high number of terminals provides ample connectivity options and flexibility in designing the circuitry for the motion control IC.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish offers good solderability and reliability in the connections, ensuring stable performance over time.

Width (mm): 7 mm

The compact width of 7mm allows for space-saving integration in compact electronic devices without compromising on functionality.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the motion control IC is suitable for a variety of environments and conditions, providing stability and performance consistency.

Technical Specifications

Motion Control ICs LV8968BBUWR2G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES FROM 4.5V TO 40V

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e6

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

LV8968BBUWR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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