Loading...

LE25S20FD-AH

Onsemi

LE25S20FD-AH by Onsemi

LE25S20FD-AH by Onsemi is a 256Kx8 NOR type Flash Memory with SPI serial bus, operating at 40MHz. It has a supply voltage of 1.65V to 1.95V and endurance of 100k cycles. Ideal for industrial applications requiring low power consumption and high-speed data transfer in compact designs.

Median Price

$0.586

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$0.526

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$0.526

-

-

-

Digiode

USA . 801 parts In-Stock

1+ parts

$0.646

100+ parts

-

1k+ parts

-

10k+ parts

-

801

$0.646

-

-

-

Vyrian

USA . 2,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 75 parts In-Stock

1+ parts

$0.580

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$0.580

-

-

-

Corphita

USA . 231 parts In-Stock

1+ parts

$0.612

100+ parts

-

1k+ parts

-

10k+ parts

-

231

$0.612

-

-

-

Corohmni

South Africa . 419 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

-

419

$0.680

-

-

-

AZTECH Wire

Italy . 331 parts In-Stock

1+ parts

$11.519

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$11.519

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Microchip USA

USA . 2,898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,898

-

-

-

-

Problanco Electronics

Mexico . 2,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,649

-

-

-

-

SupplyDigital Components

Austria . 2,402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,402

-

-

-

-

Kulean Microsystems

USA . 2,030 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,030

-

-

-

-

TANS Electronics

Latvia . 1,402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

-

-

-

-

UHIMA Technologies

Türkiye . 245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

245

-

-

-

-

Overview

Looking for high-quality flash memory with top-notch performance? Look no further than the LE25S20FD-AH by Onsemi. With a reputable manufacturer like Onsemi, you can trust in the reliability and durability of this product. Ideal for industrial applications, this small outline, very thin profile memory device offers a wide range of benefits including fast data transfer speeds, low power consumption, and high endurance for up to 100,000 write/erase cycles. Upgrade your system today with the LE25S20FD-AH and experience seamless operation and improved efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material makes the product lightweight and durable, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this flash memory can withstand harsh environmental conditions and maintain performance.

Organization: 256KX8

The 256KX8 organization provides a good balance between storage capacity and data access speed, making it suitable for various applications.

Write Protection: HARDWARE/SOFTWARE

The option for both hardware and software write protection enhances data security by preventing unauthorized write operations on the memory.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and reliability, making it an efficient choice for flash memory storage.

Parallel or Serial: SERIAL

Serial interface simplifies data transfer and communication with other devices, providing flexibility and ease of integration in various systems.

Endurance: 100000 Write/Erase Cycles

With a high endurance of 100,000 write/erase cycles, this flash memory offers reliable performance and longevity for frequent data read/write operations.

Technical Specifications

Flash Memory LE25S20FD-AH attributes and parameters. Explore more Flash Memory devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

40 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Programming Voltage (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

LE25S20FD-AH Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20