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M25P16-VMW6G

Micron Technology

M25P16-VMW6G by Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Maximum Seated Height: 2.5 mm;

Median Price

$0.644

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$0.644

100+ parts

-

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32

$0.644

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Cyclops Electronics Ltd

UK . 4,597 parts In-Stock

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4,597

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Digiode

USA . 2,651 parts In-Stock

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2,651

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Anansix

USA . 1,083 parts In-Stock

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1,083

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Vyrian

USA . 388 parts In-Stock

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388

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ComSIT Distribution GmbH

Germany . 238 parts In-Stock

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238

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Martec Srl

Italy . 113 parts In-Stock

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113

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Speed Components Ltd

Israel . 70 parts In-Stock

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70

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LWI Electronics Inc

India . 67 parts In-Stock

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67

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North Shore Components

USA . 42 parts In-Stock

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42

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Inventory MP

USA . 30 parts In-Stock

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30

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Bristol Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,025 parts In-Stock

1+ parts

$0.644

100+ parts

-

1k+ parts

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10k+ parts

$0.631

3,025

$0.644

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-

$0.631

Argo Parts USA

USA . 2,061 parts In-Stock

1+ parts

$0.644

100+ parts

-

1k+ parts

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10k+ parts

$0.625

2,061

$0.644

-

-

$0.625

Component Stockers USA

USA . 1,540 parts In-Stock

1+ parts

$2.930

100+ parts

$2.780

1k+ parts

$2.690

10k+ parts

-

1,540

$2.930

$2.780

$2.690

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Corohmni

South Africa . 429 parts In-Stock

1+ parts

$3.391

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429

$3.391

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IDEA Electronic Components Group

UK . 2,201 parts In-Stock

1+ parts

$4.141

100+ parts

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$3.727

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2,201

$4.141

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$3.727

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Aztec Data Supply Inc.

USA . 306 parts In-Stock

1+ parts

$4.260

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306

$4.260

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$6.204

100+ parts

$5.646

1k+ parts

$5.087

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500

$6.204

$5.646

$5.087

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MKK Technologies

India . 914 parts In-Stock

1+ parts

$7.787

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914

$7.787

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DigiPath Technology Company

USA . 914 parts In-Stock

1+ parts

$7.787

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914

$7.787

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Andel Nordic

Denmark . 2,125 parts In-Stock

1+ parts

$10.268

100+ parts

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$9.857

10k+ parts

$9.857

2,125

$10.268

-

$9.857

$9.857

AZTECH Wire

Italy . 540 parts In-Stock

1+ parts

$13.627

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540

$13.627

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Semicontronic

India . 713 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

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713

$19.000

$18.525

$18.430

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Kepictronics

USA . 13,188 parts In-Stock

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13,188

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Alle Elektronik GmbH

Germany . 3,065 parts In-Stock

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Corphita

USA . 2,748 parts In-Stock

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2,748

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Parana Technologies

USA . 1,627 parts In-Stock

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$4.951

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1,627

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$4.951

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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$0.631

1k+ parts

$0.612

10k+ parts

$0.599

1,000

-

$0.631

$0.612

$0.599

Perfect Parts

USA . 740 parts In-Stock

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740

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Ashlea Components Ltd (Excess)

UK . 113 parts In-Stock

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113

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Component Connect

USA . 113 parts In-Stock

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113

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Technical Specifications

Flash Memory M25P16-VMW6G attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Additional Features:

LG-MAX

Maximum Clock Frequency (fCLK):

25 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

5.62 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

5.62 mm

Maximum Write Cycle Time (tWC):

15 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M25P16-VMW6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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