Loading...

LE25FW806M

Onsemi

LE25FW806M by Onsemi

The Onsemi LE25FW806M is a NOR type flash memory with 1MX8 organization, 8388608 bit memory density, and SPI serial bus type. It operates at temperatures from 0 to 70 °C and has a max clock frequency of 50 MHz. Ideal for applications requiring high-speed data storage in commercial-grade devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,640

-

-

-

-

Digiode

USA . 592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

592

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 7,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,220

-

-

-

-

SupplyDigital Components

Austria . 1,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,263

-

-

-

-

Kulean Microsystems

USA . 1,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,171

-

-

-

-

UHIMA Technologies

Türkiye . 743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

743

-

-

-

-

Problanco Electronics

Mexico . 432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

432

-

-

-

-

Corphita

USA . 232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

232

-

-

-

-

Corohmni

South Africa . 117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

117

-

-

-

-

Overview

Unlock the power of reliable and high-quality flash memory with the LE25FW806M by Onsemi. As a leading manufacturer in the industry, Onsemi offers a top-of-the-line product that guarantees superior performance and durability. Ideal for a wide range of applications, this flash memory device is designed to provide customers with exceptional value, benefits, and advantages. Say goodbye to data loss and hello to seamless operation with the LE25FW806M - the solution you've been looking for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product durable and resistant to damage, ensuring a longer lifespan.

Power Supplies (V): 3/3.3

The 3/3.3 voltage power supplies provide a stable and efficient power source for the product to operate smoothly.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can function effectively in various environments without overheating.

Memory Density: 8388608 bit

The high memory density of 8388608 bits allows for ample storage capacity, making it suitable for storing large amounts of data efficiently.

Endurance: 10000 Write/Erase Cycles

The endurance of 10000 write/erase cycles ensures the longevity and reliability of the product, making it ideal for repeated use.

Technical Specifications

Flash Memory LE25FW806M attributes and parameters. Explore more Flash Memory devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

10

Endurance:

10000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

LE25FW806M Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20