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HGT1S7N60B3DS9A

Onsemi

HGT1S7N60B3DS9A by Onsemi

HGT1S7N60B3DS9A by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and a collector-emitter voltage of 600V. Ideal for power control applications, it has a built-in diode, can handle up to 14A collector current, and operates b/w -55 °C to 150°C temperature range.

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Digiode

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USA . 1,428 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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SupplyDigital Components

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TANS Electronics

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Overview

Discover the power of the HGT1S7N60B3DS9A by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor designed for superior performance in power control applications. Manufactured by Onsemi, known for their high-quality components, this N-CHANNEL transistor offers a single configuration with a built-in diode for added convenience. With a maximum collector-emitter voltage of 600V and a maximum gate-emitter voltage of 20V, this transistor ensures reliable operation even in challenging conditions. Trust in Onsemi's expertise to deliver exceptional value and benefits with the HGT1S7N60B3DS9A, your go-to choice for power control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the IGBT, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the IGBT from voltage spikes and reverse currents, enhancing its overall performance and reliability.

Transistor Application: POWER CONTROL

This IGBT is specifically designed for power control applications, offering high power dissipation and efficiency.

Maximum VCEsat: 2.1 V

The low VCEsat value of 2.1 V indicates minimal voltage drop across the collector-emitter junction, resulting in lower power losses and improved efficiency.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum collector-emitter voltage of 600 V, this IGBT is suitable for high voltage power control applications.

Maximum Power Dissipation (Abs): 60 W

The high maximum power dissipation of 60 W allows the IGBT to handle high power loads without overheating, ensuring reliable operation.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 to 150 °C makes this IGBT suitable for use in a variety of environmental conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S7N60B3DS9A attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

175 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

470 ns

Nominal Turn Off Time (toff):

350 ns

Nominal Turn On Time (ton):

46 ns

Maximum VCEsat:

2.1 V

Trade Compliance

HGT1S7N60B3DS9A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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