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FGH40T120SQDNL4

Onsemi

FGH40T120SQDNL4 by Onsemi

FGH40T120SQDNL4 by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.95V and a max collector-emitter voltage of 1200V. Ideal for power control applications, it has a nominal turn off time of 372ns and can handle a max collector current of 160A.

Median Price

$11.110

Lifecycle Status

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12

In-Stock Inventory

1k+

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Farnell

UK . 207 parts In-Stock

1+ parts

$8.310

100+ parts

$4.550

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$4.370

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207

$8.310

$4.550

$4.370

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Mouser Electronics

USA . 257 parts In-Stock

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$10.010

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$5.340

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$10.010

$5.340

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DigiKey

USA . 205 parts In-Stock

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$10.010

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$5.922

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$4.607

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205

$10.010

$5.922

$4.607

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Newark

USA . 207 parts In-Stock

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$12.210

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$7.470

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207

$12.210

$7.470

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Element14

Singapore . 207 parts In-Stock

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$14.480

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$7.630

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$7.480

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207

$14.480

$7.630

$7.480

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Chip1Stop

Japan . 72 parts In-Stock

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$30.800

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$30.800

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Avnet

USA . 450 parts In-Stock

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EBV Elektronik

Germany . 300 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.358

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-

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10

$5.358

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Digiode

USA . 938 parts In-Stock

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$5.918

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938

$5.918

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Vyrian

USA . 8,677 parts In-Stock

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NAC Semi

USA . 240 parts In-Stock

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$25.950

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$23.590

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240

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$25.950

$23.590

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Corohmni

South Africa . 251 parts In-Stock

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$5.251

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251

$5.251

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Ampacity Inc.

Singapore . 255 parts In-Stock

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$5.300

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$5.300

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Continental Prestige Electronics

USA . 3,763 parts In-Stock

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$5.358

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$5.251

3,763

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$5.251

Netroflash

USA . 2,000 parts In-Stock

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$5.358

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$5.358

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Corphita

USA . 687 parts In-Stock

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$5.607

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Microchip USA

USA . 5,432 parts In-Stock

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$23.632

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QUARKTWIN TECHNOLOGY LTD

USA . 20,911 parts In-Stock

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Kulean Microsystems

USA . 8,048 parts In-Stock

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Problanco Electronics

Mexico . 6,666 parts In-Stock

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Lixinc

USA . 6,189 parts In-Stock

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Argo Parts USA

USA . 3,965 parts In-Stock

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TANS Electronics

Latvia . 3,910 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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SupplyDigital Components

Austria . 2,363 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 286 parts In-Stock

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Authorized Procurement Solutions

USA . 222 parts In-Stock

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Overview

Unleash the power of innovation with the FGH40T120SQDNL4 by Onsemi, a top-tier Insulated Gate Bipolar Transistor that offers unmatched quality and reliability. Manufactured by Onsemi, a leader in semiconductor technology, this N-channel transistor is designed for power control applications, delivering exceptional performance and efficiency. With a maximum VCEsat of 1.95V and a maximum collector current of 160A, this transistor is a game-changer in the industry. Elevate your projects with the FGH40T120SQDNL4 and experience the difference it can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulation for the internal components, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have better performance and efficiency compared to P-channel types, making this product a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier and more efficient circuit design, saving space and cost.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in such scenarios.

Maximum VCEsat: 1.95 V

Low VCEsat results in lower power dissipation and higher efficiency in power control operations.

Maximum Power Dissipation (Abs): 454 W

High power dissipation allows for handling of high power loads, making it suitable for demanding applications.

Maximum Collector-Emitter Voltage: 1200 V

Can handle high voltage levels, making it suitable for high-power applications.

Maximum Collector Current (IC): 160 A

High collector current rating allows for handling large current flows with ease, suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40T120SQDNL4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

372 ns

Nominal Turn On Time (ton):

80 ns

Maximum VCEsat:

1.95 V

Trade Compliance

FGH40T120SQDNL4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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