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AMIS42670ICAH2RG

Onsemi

AMIS42670ICAH2RG by Onsemi

AMIS42670ICAH2RG by Onsemi is a network interface IC with 8 terminals, operating at 5V. It has a data rate of 1 Mbps and is designed for automotive applications. The IC features a small outline package style, matte tin terminal finish, and operates in temperatures ranging from -40 to 125 °C.

Median Price

$0.529

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 18 parts In-Stock

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$0.529

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Chip Stock

USA . 16,000 parts In-Stock

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Vyrian

USA . 12,109 parts In-Stock

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Digiode

USA . 939 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 247 parts In-Stock

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Dan-Mar Components

USA . 199 parts In-Stock

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Bristol Electronics

USA . 40 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 392 parts In-Stock

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$1.473

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Northwest PG Solutions

USA . 666 parts In-Stock

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$1.620

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$12.659

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$11.520

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$10.380

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40

$12.659

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AZTECH Wire

Italy . 662 parts In-Stock

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$16.480

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Kulean Microsystems

USA . 7,239 parts In-Stock

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TANS Electronics

Latvia . 6,758 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,756 parts In-Stock

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Problanco Electronics

Mexico . 4,375 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,837 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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RC Electronics

USA . 3,000 parts In-Stock

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Futuretech Components

Singapore . 2,980 parts In-Stock

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Corphita

USA . 2,260 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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Corohmni

South Africa . 167 parts In-Stock

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Microchip USA

USA . 137 parts In-Stock

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SupplyDigital Components

Austria . 127 parts In-Stock

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Overview

Unlock seamless connectivity and enhanced networking capabilities with the AMIS42670ICAH2RG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality network interfaces that offer unparalleled reliability and performance. Whether you're looking to streamline data transfer, improve communication efficiency, or enhance system integration, this innovative product is designed to meet your needs. Elevate your applications to new heights with the AMIS42670ICAH2RG and experience the value and benefits it brings to your projects. Trust Onsemi for cutting-edge solutions that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and light weight, making the product suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and reducing assembly time.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with most systems and power sources.

No. of Terminals: 8

With 8 terminals available, this network interface supports multiple connections and provides flexibility in connectivity options.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the product to function reliably even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can withstand extreme cold temperatures without losing functionality.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this network interface provides fast and efficient data transmission for smooth communication.

Technical Specifications

Network Interfaces AMIS42670ICAH2RG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9276 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.065 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

AMIS42670ICAH2RG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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