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2N490C

Onsemi

2N490C by Onsemi

The Onsemi 2N490C is a Unijunction Transistor (UFT) with max emitter current of 70mA, max inter-base voltage of 65V, and max power dissipation of 0.45W. It is used for switching applications due to its silicon element material and cylindrical package style.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

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Digiode

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Electronics Depot

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Native Components

USA . 969 parts In-Stock

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Northwest PG Solutions

USA . 636 parts In-Stock

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TANS Electronics

Latvia . 3,667 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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Corphita

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Problanco Electronics

Mexico . 1,358 parts In-Stock

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UHIMA Technologies

Türkiye . 809 parts In-Stock

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Corohmni

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Overview

Elevate your electronics with the 2N490C by Onsemi, a high-quality unijunction transistor that delivers unparalleled performance in switching applications. Crafted by industry-leading manufacturer Onsemi, this single configuration transistor boasts a robust construction and reliable operation, making it a valuable asset for your projects. With a maximum emitter current of 70 mA and a wide operating temperature range, the 2N490C offers exceptional value and efficiency. Upgrade your circuits with the 2N490C and experience the benefits of superior quality and unmatched performance.

Feature Benefit Bullets

Maximum Emitter Current: 70 mA

High maximum emitter current allows for efficient switching operations.

Maximum Inter-base Voltage: 65 V

With a high maximum inter-base voltage, this product can handle various voltage levels effectively.

Maximum Power Dissipation (Abs): 0.45 W

Low power dissipation helps in reducing heat generation and energy consumption.

Maximum Operating Temperature: 140 °C

Wide operating temperature range ensures stability and performance in different environments.

Minimum Operating Temperature: -65 °C

The ability to operate in extremely low temperatures makes this product versatile.

Maximum Static Inter-Base Resistance: 9.1 kohm

High static inter-base resistance ensures reliable and consistent performance during operation.

Technical Specifications

Unijunction Transistors (UFT) 2N490C attributes and parameters. Explore more Unijunction Transistors (UFT) devices from Onsemi

Specs

Configuration:

Maximum Emitter Current:

70 mA

Maximum Inter-base Voltage:

65 V

Maximum Intrinsic Stand-off Ratio:

.62

Minimum Intrinsic Stand-off Ratio:

.51

JEDEC-95 Code:

TO-5

JESD-30 Code:

O-MBCY-W3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

140 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Maximum Peak Point Current:

2 mA

Maximum Power Dissipation (Abs):

Maximum Static Inter-Base Resistance:

9.1 kohm

Minimum Static Inter-Base Resistance:

6.2 kohm

Sub-Category:

Unijunction Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Minimum Valley Point Current:

8 mA

Trade Compliance

2N490C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-00-935-4996, 5961009354996, 5961-00-619-1588, 5961006191588

NIIN

009354996, 006191588

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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