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LS1043AXE7QQB

NXP Semiconductors

LS1043AXE7QQB by NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$90.725

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 24 parts In-Stock

1+ parts

$112.000

100+ parts

$61.800

1k+ parts

-

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24

$112.000

$61.800

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Rochester

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$69.450

1k+ parts

$62.140

10k+ parts

$58.490

180

-

$69.450

$62.140

$58.490

DigiKey

USA . 149 parts In-Stock

1+ parts

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149

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Verical

USA . 29 parts In-Stock

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29

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Flip Electronics (Authorized)

USA . 29 parts In-Stock

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29

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Distributors (In-Stock)

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Digiode

USA . 1,872 parts In-Stock

1+ parts

$73.321

100+ parts

-

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1,872

$73.321

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Vyrian

USA . 3,511 parts In-Stock

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3,511

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Anansix

USA . 2,499 parts In-Stock

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2,499

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Flip Electronics

USA . 783 parts In-Stock

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783

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NAC Semi

USA . 120 parts In-Stock

1+ parts

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100+ parts

$105.270

1k+ parts

$97.170

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120

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$105.270

$97.170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,737 parts In-Stock

1+ parts

$69.462

100+ parts

-

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2,737

$69.462

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Vigor

Singapore . 1,877 parts In-Stock

1+ parts

$110.740

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1,877

$110.740

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Microchip USA

USA . 1,686 parts In-Stock

1+ parts

$197.286

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1,686

$197.286

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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UNI Independent Distributors

Spain . 688 parts In-Stock

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688

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Infinite Electronics LLP (Excess)

. 189 parts In-Stock

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189

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Technical Specifications

Microprocessors LS1043AXE7QQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 1V NOMINAL SUPPLY

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B621

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

621

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.07 mm

Speed:

1600 rpm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

LS1043AXE7QQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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