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CQF25B/D52

NXP Semiconductors

CQF25B/D52 by NXP Semiconductors

CQF25B/D52 by NXP Semiconductors is a high-performance laser diode with a peak wavelength of 850 nm and a max forward current of 0.15 A. It operates b/w -10 °C to 60 °C, making it ideal for various optoelectronic applications. With an ultra-fast response time of 0.5 ns, it's perfect for data communication systems.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Anansix

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Digiode

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One Stop Electronics

USA . 408 parts In-Stock

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Northwest PG Solutions

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UNI Independent Distributors

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Corphita

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Native Components

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Overview

Unlock superior performance with the CQF25B/D52 laser diode from NXP Semiconductors, a leader in innovation and quality. Engineered for reliability, this diode excels in diverse applications, ensuring precise results across industries. Enjoy exceptional longevity and efficiency, all while benefiting from NXP's commitment to excellence. Elevate your projects with a product that not only meets but exceeds expectations—experience the difference today!

Feature Benefit Bullets

Maximum Forward Current: 0.15 A

This low maximum forward current makes the laser diode efficient and suitable for battery-operated devices, ensuring longer operational life.

Peak Wavelength: 850 nm

The 850 nm peak wavelength allows for optimal performance in various applications, particularly in optical communication and sensing, ensuring excellent light transmission.

Optoelectronic Type: LASER DIODE

As a laser diode, this product offers coherent light output, making it ideal for high-precision applications such as laser printing and optical data transfer.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, this laser diode is suitable for use in environments that may experience relatively high temperatures without compromising performance.

Minimum Operating Temperature: -10 °C

The -10 °C minimum operating temperature extends the diode's usability in colder environments, making it versatile for various industrial and outdoor applications.

Maximum Response Time: 0.5 ns

A fast response time of 0.5 ns enables the diode to operate effectively in high-speed communication systems, ensuring quick data transfer and reliable performance.

Semiconductor Material: AlGaAs

Constructed from AlGaAs, this laser diode offers high efficiency and better thermal performance, enhancing reliability and performance in demanding applications.

Spectral Bandwidth: 4.5 nm

A narrow spectral bandwidth of 4.5 nm enhances the diode's performance in applications requiring precise wavelength control, improving the overall quality of optical signals.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides robust mechanical support and stability, making installation easier in PCB applications and enhancing reliability.

Maximum Forward Voltage: 2.5 V

With a maximum forward voltage of 2.5 V, this diode is designed to operate efficiently with minimal power consumption, reducing thermal output and improving overall energy use.

Technical Specifications

Laser Diodes CQF25B/D52 attributes and parameters. Explore more Laser Diodes devices from NXP Semiconductors

Specs

Maximum Forward Current:

.15 A

Maximum Forward Voltage:

2.5 V

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Optoelectronic Type:

Peak Wavelength (nm):

850

Maximum Response Time:

.0000000005 s

Semiconductor Material:

AlGaAs

Spectral Bandwidth:

4.5 m

Sub-Category:

Laser Diodes

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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