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CQF25B/D24

NXP Semiconductors

CQF25B/D24 by NXP Semiconductors

CQF25B/D24 by NXP Semiconductors is a high-performance laser diode with a peak wavelength of 850 nm and a max forward current of 0.15 A. It operates efficiently b/w -10 °C to 60 °C, making it ideal for various optoelectronic applications. With an ultra-fast response time of 0.5 ns, it's perfect for data communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,433 parts In-Stock

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Vyrian

USA . 2,128 parts In-Stock

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Anansix

USA . 1,292 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 106 parts In-Stock

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$0.419

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$0.402

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Northwest PG Solutions

USA . 384 parts In-Stock

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$0.460

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$0.406

384

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One Stop Electronics

USA . 782 parts In-Stock

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$1.100

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782

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Corphita

USA . 4,657 parts In-Stock

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UNI Independent Distributors

Spain . 2,754 parts In-Stock

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Overview

Unlock unparalleled performance with the CQF25B/D24 laser diode from NXP Semiconductors, a leader in innovation. Engineered for precision and reliability, this cutting-edge component enhances your applications, whether in telecommunications, industrial automation, or medical devices. With exceptional response times and a robust operating range, it delivers superior quality you can trust, driving efficiency and growth in your projects. Experience the NXP advantage today!

Feature Benefit Bullets

Maximum Forward Current: 0.15 A

The high maximum forward current allows for efficient operation and ensures consistent performance, making it suitable for high-power applications.

Peak Wavelength: 850 nm

The peak wavelength of 850 nm is ideal for applications in optical communication and sensing, providing effective light transmission and detection.

Optoelectronic Type: LASER DIODE

As a laser diode, it offers high coherence and directional light output, making it a great choice for precision applications requiring focused beams.

Maximum Operating Temperature: 60 °C

The ability to operate at high temperatures (up to 60 °C) enhances its reliability in demanding environments and minimizes the risk of performance degradation.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10 °C allows this laser diode to function effectively in a wider range of environments, adding to its versatility.

Maximum Response Time: 0.5 ns

With a maximum response time of 0.5 ns, this laser diode is suitable for high-speed applications, facilitating rapid data transfer and efficient signal processing.

Semiconductor Material: AlGaAs

Utilizing AlGaAs semiconductor material provides excellent efficiency and performance, contributing to the overall effectiveness and reliability of the laser diode.

Spectral Bandwidth: 4.5 nm

The spectral bandwidth of 4.5 nm supports a range of applications in telecommunications and sensing by allowing operation across various wavelengths.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mount design facilitates easy integration into various circuit designs, enhancing its adaptability for different applications.

Maximum Forward Voltage: 2.5 V

A maximum forward voltage of 2.5 V ensures low power consumption, making this laser diode energy-efficient while maintaining optimal performance.

Technical Specifications

Laser Diodes CQF25B/D24 attributes and parameters. Explore more Laser Diodes devices from NXP Semiconductors

Specs

Maximum Forward Current:

.15 A

Maximum Forward Voltage:

2.5 V

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Optoelectronic Type:

Peak Wavelength (nm):

850

Maximum Response Time:

.0000000005 s

Semiconductor Material:

AlGaAs

Spectral Bandwidth:

4.5 m

Sub-Category:

Laser Diodes

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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