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MT48LC8M16A2P-75IT

Micron Technology

MT48LC8M16A2P-75IT by Micron Technology

MT48LC8M16A2P-75IT by Micron Technology is a 8MX16 Synchronous DRAM with a memory density of 134217728 bit. It operates at a max clock frequency of 133 MHz and has a max access time of 5.4 ns. This memory module is commonly used in industrial applications requiring high-speed data storage and retrieval.

Median Price

$2.780

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.780

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300

$2.780

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Chip Stock

USA . 4,321 parts In-Stock

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4,321

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Digiode

USA . 2,409 parts In-Stock

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2,409

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Vyrian

USA . 1,046 parts In-Stock

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1,046

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Prism Electronics

USA . 72 parts In-Stock

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72

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Cyclops Electronics Ltd

UK . 28 parts In-Stock

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28

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LWI Electronics Inc

India . 5 parts In-Stock

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5

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Semtec, LLC

USA . 1 parts In-Stock

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1

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 8,452 parts In-Stock

1+ parts

$1.253

100+ parts

-

1k+ parts

$1.203

10k+ parts

$1.203

8,452

$1.253

-

$1.203

$1.203

Argo Parts USA

USA . 3,405 parts In-Stock

1+ parts

$2.780

100+ parts

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3,405

$2.780

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.780

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1,000

$2.780

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Continental Prestige Electronics

USA . 699 parts In-Stock

1+ parts

$2.780

100+ parts

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$2.724

699

$2.780

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-

$2.724

Corohmni

South Africa . 354 parts In-Stock

1+ parts

$4.992

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354

$4.992

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Aztec Data Supply Inc.

USA . 273 parts In-Stock

1+ parts

$4.993

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273

$4.993

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Semicontronic

India . 1,533 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

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1,533

$13.000

$12.675

$12.610

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AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$17.734

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386

$17.734

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Ampacity Inc.

Singapore . 1,137 parts In-Stock

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$26.000

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1,137

$26.000

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Corphita

USA . 1,560 parts In-Stock

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1,560

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Futuretech Components

Singapore . 784 parts In-Stock

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784

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Authorized Procurement Solutions

USA . 430 parts In-Stock

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430

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S.R.D Solutions

India . 100 parts In-Stock

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100

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 29 parts In-Stock

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29

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Overview

Elevate your device's performance with the MT48LC8M16A2P-75IT by Micron Technology. As a leading manufacturer in the industry, Micron ensures top-notch quality and reliability. This DRAM module is perfect for a wide range of applications, providing seamless operation and improved efficiency. With a focus on delivering value to customers, this product offers unparalleled benefits and advantages, making it a smart choice for all your memory needs. Experience the difference with Micron Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the DRAM, making it a reliable choice for extended use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making it suitable for various electronic applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is processed efficiently and accurately, enhancing the overall performance of the DRAM.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and widely compatible with many electronic systems, making integration seamless.

Maximum Clock Frequency (fCLK): 133 MHz

The high clock frequency allows for fast data access and processing, improving the overall speed and performance of the DRAM.

Temperature Grade: INDUSTRIAL

With industrial-grade temperature tolerance, this DRAM can operate reliably in harsh environments, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DRAM energy-efficient and reliable in various electronic devices.

Technical Specifications

DRAM MT48LC8M16A2P-75IT attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

133 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.002 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

310 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC8M16A2P-75IT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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