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SAK-TC1782N-320F180HR

Infineon Technologies

SAK-TC1782N-320F180HR by Infineon Technologies

Infineon's SAK-TC1782N-320F180HR microcontroller features 32-bit architecture, 176 terminals, and a max clock frequency of 40 MHz. Ideal for automotive applications, it offers integrated cache, ADC channels, and low power mode for efficient performance in various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 884 parts In-Stock

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Vyrian

USA . 837 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 837 parts In-Stock

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$19.232

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Corohmni

South Africa . 164 parts In-Stock

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$28.442

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Ampacity Inc.

Singapore . 1,371 parts In-Stock

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$30.000

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Modulus Dynamics

Lithuania . 400 parts In-Stock

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$42.743

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$41.033

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$39.324

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$41.033

$39.324

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Aztec Data Supply Inc.

USA . 220 parts In-Stock

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$58.439

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Continental Prestige Electronics

USA . 4,347 parts In-Stock

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Argo Parts USA

USA . 1,637 parts In-Stock

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Corphita

USA . 675 parts In-Stock

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675

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Aranea Global

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Overview

Experience the power of innovation with the SAK-TC1782N-320F180HR microcontroller by Infineon Technologies. Designed with high-quality materials and cutting-edge technology, this product offers unmatched performance and reliability. Ideal for automotive applications, this microcontroller provides seamless connectivity, low power consumption, and a wide range of peripherals to meet your specific needs. Trust in Infineon Technologies to deliver superior products that drive success in your projects. Elevate your designs with the SAK-TC1782N-320F180HR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand wear and tear in various environments.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.365 V

Efficient power consumption at lower voltage levels.

Bit Size: 32

Supports 32-bit instructions for enhanced processing capabilities.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without any issues.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and fast data processing.

Maximum Clock Frequency: 40 MHz

Supports high clock frequencies for quick data processing.

Analog To Digital Convertors: 32-Ch 10-Bit

Allows for precise analog to digital conversion with multiple channels.

Connectivity: ASC(2), CAN(3), SSC(3)

Multiple connectivity options for interfacing with different devices.

Low Power Mode: YES

Energy-efficient design that can operate in low power modes to conserve battery life.

Technical Specifications

Microcontrollers SAK-TC1782N-320F180HR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC1782

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

86

No. of Serial I/Os:

5

No. of Terminals:

176

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

2621440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

550 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

131072

Connectivity:

ASC(2), CAN(3), SSC(3)

Peripherals:

DMA(16), POR, TIMER, WDT

Analog To Digital Convertors:

32-Ch 10-Bit

Trade Compliance

SAK-TC1782N-320F180HR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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