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SAK-TC233LP-32F200FAA

Infineon Technologies

SAK-TC233LP-32F200FAA by Infineon Technologies

SAK-TC233LP-32F200FAA by Infineon: 32-bit microcontroller with 200 MHz clock frequency, ADC and DMA channels. Terminal pitch of 0.4 mm, suitable for applications requiring high-speed processing like automotive control systems. Package style includes flatpack and gull wing terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 933 parts In-Stock

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Digiode

USA . 356 parts In-Stock

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356

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 411 parts In-Stock

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$19.816

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411

$19.816

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Ampacity Inc.

Singapore . 1,071 parts In-Stock

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$22.000

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$22.000

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Modulus Dynamics

Lithuania . 3,081 parts In-Stock

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$25.146

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$24.140

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$23.134

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3,081

$25.146

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$23.134

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Argo Parts USA

USA . 3,442 parts In-Stock

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Continental Prestige Electronics

USA . 995 parts In-Stock

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995

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Corphita

USA . 736 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the potential of your next project with the SAK-TC233LP-32F200FAA by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies guarantees top-notch quality and reliability. This microcontroller offers countless applications in various industries, providing exceptional value and benefits to customers. With its advanced features and impressive specifications, the SAK-TC233LP-32F200FAA is the perfect choice for those looking to elevate their designs to the next level. Experience innovation like never before with this state-of-the-art microcontroller.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a PCB without the need for through-holes, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it ideal for compact designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and processes efficiently.

No. of Terminals: 100

Having a high number of terminals allows for connectivity to various external components, expanding the functionality of the product.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The variety of package styles offered provide flexibility in design and compatibility with different PCB layouts.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Having DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides stability and secure connection points for external components, reducing the risk of signal interference or disconnection.

Width: 12 mm

The compact width of 12 mm contributes to a smaller overall footprint on the PCB, making it suitable for space-constrained designs.

Maximum Clock Frequency: 200 MHz

With a high clock frequency of 200 MHz, this microcontroller can execute instructions quickly, enabling fast processing of data and tasks.

Length: 12 mm

Similar to width, the short length of 12 mm contributes to the overall compact size of the product, suitable for miniaturized electronic devices.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and functions on a single chip, simplifying system design and reducing component count.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability, ensuring secure solder joints and long-term durability.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this microcontroller is compatible with common power sources, making it easier to integrate into existing systems.

PWM Channels: YES

The availability of PWM channels allows for precise control of output signals, making this microcontroller suitable for applications requiring analog signal modulation.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm enables high-density mounting, maximizing the number of components that can be placed on the PCB within a limited area.

Speed: 200 rpm

With a speed of 200 rpm, this microcontroller can quickly execute tasks and respond to external stimuli, making it suitable for real-time control applications.

Technical Specifications

Microcontrollers SAK-TC233LP-32F200FAA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

200 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

12 mm

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Speed:

200 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

SAK-TC233LP-32F200FAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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