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SAK-TC1796-256F150EBC

Infineon Technologies

SAK-TC1796-256F150EBC by Infineon Technologies

Infineon's SAK-TC1796-256F150EBC is a 32-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. It features 127 I/O lines, ADC and DMA channels, and 131072 ROM words. Ideal for automotive applications due to its high clock frequency and extensive I/O capabilities in a compact grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 803 parts In-Stock

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803

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Digiode

USA . 677 parts In-Stock

1+ parts

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677

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

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650

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LIBRA Elektronik GmbH

Germany . 334 parts In-Stock

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334

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,317 parts In-Stock

1+ parts

$10.000

100+ parts

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1,317

$10.000

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AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$15.808

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803

$15.808

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Aztec Data Supply Inc.

USA . 42 parts In-Stock

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$22.110

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42

$22.110

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Modulus Dynamics

Lithuania . 4,707 parts In-Stock

1+ parts

$43.355

100+ parts

$41.621

1k+ parts

$39.887

10k+ parts

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4,707

$43.355

$41.621

$39.887

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Continental Prestige Electronics

USA . 4,962 parts In-Stock

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4,962

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Argo Parts USA

USA . 3,949 parts In-Stock

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3,949

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Microchip USA

USA . 2,759 parts In-Stock

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2,759

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 928 parts In-Stock

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928

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Overview

Unleash the power of innovation with the SAK-TC1796-256F150EBC by Infineon Technologies. This top-of-the-line microcontroller offers unparalleled quality and reliability, making it the go-to choice for a wide range of applications. With its advanced features and cutting-edge technology, this product provides customers with unmatched value and benefits. Trust in Infineon Technologies to deliver superior performance and efficiency for all your microcontroller needs. Experience the difference today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and helps protect the microcontroller from external elements.

Surface Mount

YES - Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage

1.58 V - Ensures safe operation within the specified voltage range, preventing damage to the microcontroller.

Address Bus Width

24 - Supports a large addressable memory space, enabling complex data processing tasks.

Package Shape

SQUARE - Allows for efficient use of space on the PCB, optimizing the design layout.

Bit Size

32 - Offers a high level of processing capability and performance for various applications.

Power Supplies (V)

1.5,2.5/3.3,3.3 - Provides flexibility in power options, accommodating different voltage requirements.

No. of Terminals

416 - Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter)

GRID ARRAY - Enhances thermal performance and reliability, crucial for the longevity of the microcontroller.

Minimum Supply Voltage

1.42 V - Ensures stable operation even under low voltage conditions, improving the reliability of the system.

Maximum Operating Temperature

125 °C - Allows for operation in high-temperature environments without compromising performance.

Minimum Operating Temperature

10 °C - Enables operation in cold temperatures, making it suitable for a wide range of applications.

ADC Channels

YES - Enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels

YES - Facilitates efficient data transfer, reducing CPU overhead and enhancing overall system performance.

Terminal Position

BOTTOM - Facilitates easy and secure connection to the PCB, ensuring a stable electrical connection.

ROM Words

131072 - Offers ample storage capacity for program and data storage, meeting the requirements of complex applications.

Maximum Seated Height

2.5 mm - Allows for low-profile designs, ideal for space-constrained applications.

Width

27 mm - Compact form factor enhances flexibility in PCB layout and integration into various systems.

External Data Bus Width

32 - Supports high-speed data transfer, enabling rapid communication between the microcontroller and external devices.

Maximum Clock Frequency

40 MHz - Provides high-speed processing capabilities, suitable for real-time applications and high-performance computing.

Peak Reflow Temperature °C

250 - Withstands high temperatures during the assembly process, ensuring reliable solder joints.

Length

27 mm - Compact size allows for versatile integration into different devices and systems.

Peripheral IC Type

MICROCONTROLLER - A versatile and essential component for various embedded systems, offering control and processing capabilities.

RAM Bytes

65536 - Provides sufficient memory for temporary data storage and buffer space, essential for multitasking and data-intensive applications.

Technology

CMOS - Low power consumption and high noise immunity make it suitable for battery-operated devices and noise-sensitive applications.

Terminal Form

BALL - Ensures reliable electrical connections with the PCB, minimizing the risk of signal interference or data corruption.

Nominal Supply Voltage

1.5 V - Standard voltage level for stable and efficient operation, widely compatible with various power sources.

ROM Programmability

FLASH - Allows for easy and quick reprogramming of the memory, essential for updating firmware and software without replacing the microcontroller.

Terminal Pitch

1 mm - Provides sufficient spacing between terminals for easy manual or automated assembly, preventing short circuits and ensuring proper alignment.

Moisture Sensitivity Level (MSL)

3 - Indicates the level of protection against moisture damage, ensuring the reliability and longevity of the microcontroller.

Speed

150 rpm - Offers a high clock speed for fast data processing and real-time control applications, enhancing overall system performance.

No. of I/O Lines

127 - Provides ample input and output options, enabling versatile connectivity with external devices and peripherals.

Technical Specifications

Microcontrollers SAK-TC1796-256F150EBC attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

127

No. of Terminals:

416

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-10 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Power Supplies (V):

1.5,2.5/3.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

2.5 mm

Speed:

150 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SAK-TC1796-256F150EBC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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