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SAK-TC233LP-32F200FAB

Infineon Technologies

SAK-TC233LP-32F200FAB by Infineon Technologies

SAK-TC233LP-32F200FAB by Infineon is a 32-bit microcontroller with 100 terminals, operating at up to 200 MHz. Ideal for automotive applications, it features ADC and DMA channels, PWM support, and flash ROM programmability. With a temperature range of -40 to 125°C, this CMOS technology chip offers high performance in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,509 parts In-Stock

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Digiode

USA . 442 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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Ampacity Inc.

Singapore . 135 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 409 parts In-Stock

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$13.898

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Modulus Dynamics

Lithuania . 3,791 parts In-Stock

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$72.398

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$69.502

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$66.606

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Bastille Electronics

Australia . 2,772 parts In-Stock

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Argo Parts USA

USA . 1,907 parts In-Stock

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Continental Prestige Electronics

USA . 1,458 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Corphita

USA . 831 parts In-Stock

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Metaverse IC Inc.

Canada . 310 parts In-Stock

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A-Z Elektronik GmbH

Germany . 285 parts In-Stock

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Overview

Unleash the power of innovation with the SAK-TC233LP-32F200FAB by Infineon Technologies. This cutting-edge microcontroller offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From automotive to industrial automation, this product delivers exceptional performance and efficiency. With advanced features like ADC channels, PWM channels, and DMA channels, the SAK-TC233LP-32F200FAB provides unmatched value and versatility. Trust in Infineon Technologies to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and saves space, making the product more compact and efficient.

Bit Size: 32

32-bit architecture enables high-performance computing and more advanced functions in the microcontroller.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh conditions and prolonged use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in cold environments.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to process analog signals, expanding its functionality.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer and multitasking capabilities in the microcontroller.

Maximum Clock Frequency: 200 MHz

A high maximum clock frequency ensures fast processing speeds, making the microcontroller suitable for demanding applications.

Temperature Grade: AUTOMOTIVE

Being automotive grade means the microcontroller meets stringent quality standards for automotive applications, ensuring reliability and performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Nominal Supply Voltage: 3.3 V

Having a 3.3V supply voltage makes the microcontroller compatible with a wide range of standard power sources.

ROM Programmability: FLASH

Flash programmability enables easy firmware updates and customization, enhancing the flexibility and versatility of the microcontroller.

Technical Specifications

Microcontrollers SAK-TC233LP-32F200FAB attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

200 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

12 mm

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Speed:

200 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Trade Compliance

SAK-TC233LP-32F200FAB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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