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SAK-TC1796-256F150E

Infineon Technologies

SAK-TC1796-256F150E by Infineon Technologies

Infineon's SAK-TC1796-256F150E microcontroller features 32-bit architecture, 8KB cache, and 24-bit address bus width. Ideal for automotive applications with ADC channels, 16 DMA channels, and connectivity options like CAN and SSC. Operating at up to 40MHz with low power mode support.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 5,373 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Chip Stock

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Digiode

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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ComSIT USA

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AZTECH Wire

Italy . 666 parts In-Stock

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$6.032

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Ampacity Inc.

Singapore . 1,062 parts In-Stock

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$10.000

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Aztec Data Supply Inc.

USA . 4,577 parts In-Stock

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$15.360

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Corohmni

South Africa . 1,065 parts In-Stock

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Modulus Dynamics

Lithuania . 2,415 parts In-Stock

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$40.820

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$39.187

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$37.554

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Andel Nordic

Denmark . 4,473 parts In-Stock

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$43.040

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Lixinc

USA . 17,186 parts In-Stock

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Argo Parts USA

USA . 3,407 parts In-Stock

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Continental Prestige Electronics

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Corphita

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A-Z Elektronik GmbH

Germany . 165 parts In-Stock

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Aranea Global

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Overview

Unleash the power of innovation with the SAK-TC1796-256F150E microcontroller from Infineon Technologies. Designed for automotive applications, this cutting-edge device offers unmatched performance and reliability. With integrated cache and a wide range of peripherals, this microcontroller provides customers with exceptional value and endless possibilities for customization. Trust Infineon's expertise and take your projects to the next level with the SAK-TC1796-256F150E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures lightweight and durability, making the product suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making the product a good choice for tasks requiring quick data access.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.58 V

Having a high maximum supply voltage gives flexibility in power supply options, making the product versatile for different power requirements.

Address Bus Width: 24

A wide address bus width allows for efficient memory addressing, enhancing the product's capability to handle large amounts of data.

Technical Specifications

Microcontrollers SAK-TC1796-256F150E attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC1M

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B416

Length:

27 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

123

No. of Serial I/Os:

6

No. of Terminals:

416

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.5,2.5/3.3,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

2.5 mm

Speed:

150 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

700 mA

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ASC(2), CAN(4), MLI(2), MSC(2), SSC(2)

Peripherals:

DMA(16), POR, TIMER(3), WDT

Analog To Digital Convertors:

44-Ch 10-Bit

Trade Compliance

SAK-TC1796-256F150E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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