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SAK-TC377TP-96F300SAA

Infineon Technologies

SAK-TC377TP-96F300SAA by Infineon Technologies

SAK-TC377TP-96F300SAA by Infineon: 32-bit RISC microcontroller with 1163264 bytes RAM, 6291456 ROM words, and 128 DMA channels. Ideal for automotive applications due to ISO 26262 screening, featuring peripherals like PWM, TIMER(5), ASCLIN(12), CAN(12), I2C, I2S, SENT(15), SPI(5). Operates at up to 40 MHz clock frequency in a low-profile grid array package.

Median Price

$22.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Rutronik

Germany . 13,000 parts In-Stock

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Vyrian

USA . 1,133 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Digiode

USA . 149 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 155 parts In-Stock

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$16.000

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$16.000

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AZTECH Wire

Italy . 505 parts In-Stock

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$18.484

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Corohmni

South Africa . 254 parts In-Stock

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$21.372

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Modulus Dynamics

Lithuania . 374 parts In-Stock

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$27.008

100+ parts

$25.928

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$24.847

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374

$27.008

$25.928

$24.847

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,457 parts In-Stock

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Argo Parts USA

USA . 2,084 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Formix International (Excess)

India . 1,000 parts In-Stock

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Bastille Electronics

Australia . 113 parts In-Stock

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ChipstoGo Electronic ltd

UK . 98 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Corphita

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Overview

Experience unmatched performance and reliability with the SAK-TC377TP-96F300SAA microcontroller by Infineon Technologies. As a leader in the industry, Infineon delivers cutting-edge technology that ensures top-notch quality and precision. Ideal for automotive applications, this microcontroller offers advanced features such as integrated cache, low power mode, and a wide range of connectivity options. Trust in Infineon to provide you with the best-in-class solutions for your next project. Elevate your designs with the SAK-TC377TP-96F300SAA and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between cost and durability, making the product cost-effective and reliable.

Integrated Cache: YES

The integrated cache helps improve the overall performance of the microcontroller by reducing memory access times.

Maximum Supply Voltage: 1.375 V

The higher maximum supply voltage allows for more versatility in power supply options.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in various environments, making it suitable for automotive applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and efficiency in executing instructions.

Connectivity: ASCLIN(12), CAN(12), I2C, I2S, SENT(15), SPI(5)

The variety of communication interfaces allows for seamless connectivity with different devices and systems.

Low Power Mode: YES

The low power mode helps in conserving energy and extending the battery life of the product.

Technical Specifications

Microcontrollers SAK-TC377TP-96F300SAA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO SUPPORTS FLOATING POINT

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC37

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of External Interrupts:

0

No. of Serial I/Os:

26

No. of Terminals:

292

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

1163264

ROM Words:

6291456

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.375 V

Minimum Supply Voltage:

1.125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASCLIN(12), CAN(12), I2C, I2S, SENT(15), SPI(5)

Peripherals:

DMA(128), PWM, TIMER(5)

Trade Compliance

SAK-TC377TP-96F300SAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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