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SAK-TC367DP-64F300SAA

Infineon Technologies

SAK-TC367DP-64F300SAA by Infineon Technologies

SAK-TC367DP-64F300SAA by Infineon: 32-bit microcontroller with 160 MHz clock, 292 terminals, and automotive-grade temp. Ideal for applications requiring ADC/DMA channels, PWM support, and flash ROM programmability. Package style is grid array with low profile and fine pitch.

Median Price

$22.475

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

SAK-TC367DP-64F300SAA by Infineon Technologies
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 31,000 parts In-Stock

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TME

Poland . 46,000 parts In-Stock

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$25.090

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Vyrian

USA . 30,637 parts In-Stock

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Rutronik

Germany . 4,000 parts In-Stock

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$19.860

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4,000

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ComSIT Distribution GmbH

Germany . 283 parts In-Stock

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283

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Digiode

USA . 154 parts In-Stock

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154

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 30,682 parts In-Stock

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$30.000

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Corohmni

South Africa . 1,063 parts In-Stock

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$52.361

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Modulus Dynamics

Lithuania . 3,426 parts In-Stock

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$60.480

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$58.061

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$55.642

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3,426

$60.480

$58.061

$55.642

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Bastille Electronics

Australia . 3,325 parts In-Stock

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Authorized Procurement Solutions

USA . 3,300 parts In-Stock

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Argo Parts USA

USA . 1,578 parts In-Stock

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Glotronic Ltd.

UK . 900 parts In-Stock

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900

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Corphita

USA . 793 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Continental Prestige Electronics

USA . 75 parts In-Stock

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Overview

Elevate your projects with the cutting-edge SAK-TC367DP-64F300SAA microcontroller from Infineon Technologies. Designed with the highest quality materials and advanced technology, this device offers unparalleled performance and reliability in a compact package. Ideal for automotive applications, this microcontroller boasts a wide range of features including ADC channels, PWM channels, and DMA channels to meet all your needs. Experience the value and benefits of Infineon's top-of-the-line product and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the microcontroller.

Maximum Supply Voltage: 3.63 V

Allows for flexibility in powering the microcontroller without risking damage.

Bit Size: 32

32-bit architecture allows for handling of larger data sets and more complex operations efficiently.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities, providing versatility in applications.

Maximum Clock Frequency: 160 MHz

High clock frequency allows for fast processing speeds, making the microcontroller suitable for demanding tasks.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog signals, useful in various applications such as motor control and LED brightness.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, enabling flexibility in updating firmware and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Technical Specifications

Microcontrollers SAK-TC367DP-64F300SAA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 5V NOM SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e4

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

SAK-TC367DP-64F300SAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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