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SAK-TC1796-256F150EBE

Infineon Technologies

SAK-TC1796-256F150EBE by Infineon Technologies

Infineon Technologies' SAK-TC1796-256F150EBE is a 32-bit microcontroller with a max clock frequency of 40 MHz. It features 24 address bus width, 416 terminals, and flash ROM programmability. This microcontroller is commonly used in applications requiring high-speed processing and extensive I/O capabilities.

Median Price

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5

In-Stock Inventory

1k+

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J2 Sourcing AB

Sweden . 2,108 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 409 parts In-Stock

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Digiode

USA . 70 parts In-Stock

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70

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Aztec Data Supply Inc.

USA . 3,191 parts In-Stock

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$16.730

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$16.730

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Semicontronic

India . 434 parts In-Stock

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$18.000

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$17.550

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$17.460

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434

$18.000

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$17.460

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AZTECH Wire

Italy . 462 parts In-Stock

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$19.843

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462

$19.843

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Ampacity Inc.

Singapore . 1,348 parts In-Stock

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$20.000

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Andel Nordic

Denmark . 3,818 parts In-Stock

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$32.650

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$22.856

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$22.856

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$22.856

$22.856

Modulus Dynamics

Lithuania . 1,014 parts In-Stock

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$46.636

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$44.771

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$42.905

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Authorized Procurement Solutions

USA . 14,000 parts In-Stock

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Lixinc

USA . 7,782 parts In-Stock

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Perfect Parts

USA . 6,738 parts In-Stock

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Continental Prestige Electronics

USA . 5,511 parts In-Stock

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Microchip USA

USA . 2,517 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,921 parts In-Stock

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Bastille Electronics

Australia . 1,255 parts In-Stock

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Formix International (Excess)

India . 1,000 parts In-Stock

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Corphita

USA . 506 parts In-Stock

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A-Z Elektronik GmbH

Germany . 161 parts In-Stock

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Advanced Electronics

New Zealand . 42 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 11 parts In-Stock

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Overview

Discover the cutting-edge SAK-TC1796-256F150EBE microcontroller by Infineon Technologies. Renowned for its exceptional quality, Infineon Technologies is a leading manufacturer in the industry. This powerful microcontroller is the perfect choice for various applications, offering unparalleled value and benefits to customers. With its advanced features like ADC and DMA channels, it delivers optimal performance while minimizing power consumption. Whether you're working on automotive electronics, industrial automation, or consumer electronics, the SAK-TC1796-256F150EBE will exceed your expectations. Stay ahead of the competition with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the microcontroller, making it a reliable and long-lasting choice.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, simplifying the manufacturing process and saving time and effort.

Maximum Supply Voltage: 1.58 V

With a maximum supply voltage of 1.58 V, this microcontroller is designed to operate efficiently even at lower voltage levels, resulting in energy savings and reducing the risk of overheating.

Address Bus Width: 24

The 24-bit address bus width provides a large address space, enabling the microcontroller to support complex memory addressing, making it suitable for applications that require extensive data storage and transfer.

Package Shape: SQUARE

The square package shape allows for efficient utilization of space on circuit boards, contributing to a compact and streamlined design for electronic devices.

Bit Size: 32

With a bit size of 32, this microcontroller offers ample processing power and the capability to handle and manipulate large amounts of data quickly, making it suitable for high-performance applications.

Power Supplies (V): 1.5,2.5/3.3,3.3

The availability of multiple power supply options allows for flexibility in various operating conditions, ensuring compatibility and adaptability to diverse electronic systems.

No. of Terminals: 416

The large number of terminals provides numerous connectivity options and interfaces, allowing for the integration of various external devices and peripherals, making it versatile and suitable for complex applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and improved electrical performance, enhancing the reliability and thermal management of the microcontroller.

Minimum Supply Voltage: 1.42 V

The minimum supply voltage of 1.42 V ensures stable operation of the microcontroller even under low voltage conditions, making it suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125°C ensures the microcontroller's ability to withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -10 °C

The microcontroller's ability to operate efficiently at low temperatures down to -10°C makes it ideal for use in cold climates or refrigerated environments.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish ensures excellent electrical conductivity, corrosion resistance, and solderability, ensuring a reliable and long-lasting connection between the microcontroller and external components.

ADC Channels: YES

The inclusion of ADC channels allows the microcontroller to convert analog signals into digital data, making it suitable for applications that require accurate and precise measurement of real-world quantities.

DMA Channels: YES

With DMA channels, the microcontroller can efficiently transfer large volumes of data between peripherals and memory without consuming excessive CPU resources, improving overall system performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and convenient PCB assembly, reducing the complexity and time required for manufacturing, and making it a cost-effective and preferred choice.

ROM Words: 2097152

The microcontroller's large ROM capacity of 2097152 words enables it to store substantial amounts of program instructions and data, accommodating complex algorithms and applications.

Maximum Seated Height: 2.5 mm

The microcontroller's low profile, with a maximum seated height of 2.5 mm, allows for compact and space-efficient designs, making it suitable for slim devices and applications with size constraints.

Width: 27 mm

With a width of 27 mm, the microcontroller provides a compact form factor, allowing for integration into small electronic devices and systems.

External Data Bus Width: 32

The 32-bit external data bus width facilitates fast data transfer between the microcontroller and external memory, ensuring efficient and high-speed operation, making it ideal for data-intensive applications.

Maximum Clock Frequency: 40 MHz

The microcontroller's high maximum clock frequency of 40 MHz enables rapid execution of instructions, ensuring smooth operation and faster response times in demanding applications.

Peak Reflow Temperature °C: 250

The microcontroller's ability to withstand a peak reflow temperature of 250°C makes it suitable for lead-free soldering processes, ensuring reliable and robust solder joints.

Length: 27 mm

With a length of 27 mm, the microcontroller offers a compact physical footprint, allowing it to fit within space-constrained electronic devices and systems.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product combines a processor, memory, and peripherals on a single integrated circuit, offering a cost-effective and all-in-one solution for various embedded system applications.

RAM Bytes: 65536

With a generous RAM capacity of 65536 bytes, the microcontroller can efficiently store and manipulate data during program execution, enabling multitasking and supporting memory-intensive operations.

Technology: CMOS

Utilizing CMOS technology, the microcontroller achieves low power consumption while maintaining high performance, making it a suitable choice for battery-powered or energy-efficient applications.

Terminal Form: BALL

The ball terminal form provides a reliable and robust electrical connection, ensuring efficient signal transmission and ease of soldering during the manufacturing process.

Maximum Supply Current: 700 mA

The microcontroller's maximum supply current of 700 mA ensures it can deliver sufficient power to various peripherals and components, supporting the demanding power requirements of complex systems.

Nominal Supply Voltage: 1.5 V

With a nominal supply voltage of 1.5 V, the microcontroller operates within a standard voltage range, ensuring compatibility with a wide range of power sources and electronic systems.

ROM Programmability: FLASH

The microcontroller's programmable ROM (Read-Only Memory) in flash technology allows for easy firmware updates and modifications, offering flexibility and scalability to adapt to evolving project requirements.

Terminal Pitch: 1 mm

The 1 mm terminal pitch simplifies the PCB layout and assembly process, allowing for high-density and compact circuit designs, making it suitable for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring reliability and preventing damage.

Speed: 150 rpm

This microcontroller operates at a speed of 150 revolutions per minute, making it suitable for controlling devices or systems that require precise motion control or rotational speed regulation.

No. of I/O Lines: 127

With 127 input/output lines, the microcontroller offers ample connectivity options for interfacing with peripheral devices, enabling versatile and expandable system integration.

Technical Specifications

Microcontrollers SAK-TC1796-256F150EBE attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e4

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

127

No. of Terminals:

416

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-10 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Power Supplies (V):

1.5,2.5/3.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

2.5 mm

Speed:

150 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

700 mA

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SAK-TC1796-256F150EBE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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