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SAK-TC1724N-192F80HRAB

Infineon Technologies

SAK-TC1724N-192F80HRAB by Infineon Technologies

Infineon's SAK-TC1724N-192F80HRAB is a 32-bit microcontroller with 95 I/O lines, 40 MHz clock frequency, and ADC/DMA channels. Ideal for automotive applications due to its low profile, square package shape, and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Vyrian

USA . 669 parts In-Stock

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Digiode

USA . 139 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 669 parts In-Stock

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$14.297

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669

$14.297

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Semicontronic

India . 689 parts In-Stock

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$17.000

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$16.575

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$16.490

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689

$17.000

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$16.490

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Ampacity Inc.

Singapore . 695 parts In-Stock

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$18.000

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695

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Corohmni

South Africa . 421 parts In-Stock

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$24.051

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421

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Modulus Dynamics

Lithuania . 3,238 parts In-Stock

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$56.079

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$53.836

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$51.593

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$51.593

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Continental Prestige Electronics

USA . 2,929 parts In-Stock

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Bastille Electronics

Australia . 2,760 parts In-Stock

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Argo Parts USA

USA . 2,114 parts In-Stock

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Metaverse IC Inc.

Canada . 336 parts In-Stock

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Corphita

USA . 278 parts In-Stock

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Overview

Elevate your projects with the cutting-edge SAK-TC1724N-192F80HRAB microcontroller by Infineon Technologies. Designed with precision and expertise, this powerful device offers unmatched performance and reliability for a wide range of applications. With its advanced features and top-notch quality, this microcontroller ensures seamless operation and enhanced functionality. Experience the difference with the SAK-TC1724N-192F80HRAB and unlock endless possibilities for your next project.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort in production.

Maximum Supply Voltage: 1.43 V

Provides a higher voltage ceiling for more robust performance and flexibility in power supply options.

Package Shape: SQUARE

Square shape can help in efficient space utilization on the circuit board.

Bit Size: 32

32-bit architecture allows for handling larger data sizes and more complex operations, suitable for advanced applications.

No. of Terminals: 144

Ample number of terminals allow for connecting various peripherals and expanding functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer flexibility in design and integration based on specific requirements.

Minimum Supply Voltage: 1.17 V

Low minimum supply voltage helps in reducing power consumption and improving efficiency.

ADC Channels: YES

Presence of ADC channels enables analog-to-digital conversion, essential for interfacing with analog sensors and signals.

DMA Channels: YES

DMA channels enhance data transfer speeds and offload the CPU for improved performance.

Terminal Position: QUAD

Quad terminal position facilitates easy and organized connections on the circuit board.

Width: 20 mm

Compact width allows for space-efficient placement on the board.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing and operation, suitable for applications requiring real-time performance.

Length: 20 mm

Balanced length dimension complements the width for a square form factor.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller type make it suitable for embedded systems and IoT applications, offering efficient processing.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages.

Terminal Form: GULL WING

Gull wing terminals make soldering easier and offer good mechanical strength for reliable connections.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with common power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging, ideal for miniaturized designs and space-constrained applications.

Speed: 80 rpm

RPM value in this context is not applicable or relevant for a microcontroller.

No. of I/O Lines: 95

Abundance of I/O lines provides versatility for interfacing with external devices and peripherals, enhancing functionality.

Technical Specifications

Microcontrollers SAK-TC1724N-192F80HRAB attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

20 mm

No. of I/O Lines:

95

No. of Terminals:

144

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Speed:

80 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SAK-TC1724N-192F80HRAB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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