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SAK-TC1796-256F150EBD

Infineon Technologies

SAK-TC1796-256F150EBD by Infineon Technologies

Infineon's SAK-TC1796-256F150EBD microcontroller features 32-bit architecture, 24-bit address bus, and 40 MHz clock frequency. Ideal for automotive applications due to its FLASH ROM programmability, 127 I/O lines, and ADC/DMA channels for efficient data processing. Package style is a grid array with a compact size of 27mm x 27mm and low power consumption at max supply current of 700mA.

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Vyrian

USA . 5,465 parts In-Stock

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Digiode

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Nova Conductors

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Singapore . 1,204 parts In-Stock

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AZTECH Wire

Italy . 763 parts In-Stock

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Corohmni

South Africa . 313 parts In-Stock

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Modulus Dynamics

Lithuania . 3,506 parts In-Stock

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Aztec Data Supply Inc.

USA . 5,983 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SAK-TC1796-256F150EBD microcontroller by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality products that are reliable and efficient. This microcontroller is perfect for a wide range of applications, offering customers unmatched value and benefits. With its advanced features and high performance, the SAK-TC1796-256F150EBD is the ideal choice for your next project. Experience the difference with Infineon.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

This feature allows for easy and secure installation on PCBs, making the integration process smooth and efficient.

Maximum Supply Voltage: 1.58 V

With a higher maximum supply voltage, this microcontroller can handle a wider range of power inputs, increasing its versatility.

Address Bus Width: 24

The wide address bus width allows for efficient data processing and storage, making this microcontroller suitable for complex tasks.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the PCB and enabling sleek product designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle large amounts of data and complex calculations, making it suitable for high-performance tasks.

Power Supplies (V): 1.5,2.5/3.3,3.3

The multiple power supply options cater to different voltage requirements, offering flexibility in various applications.

No. of Terminals: 416

The abundance of terminals allows for multiple connections and peripherals to be integrated, enhancing the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY

The grid array package style offers secure connections and reliable performance, ensuring the stability of the microcontroller in operation.

Minimum Supply Voltage: 1.42 V

With a low minimum supply voltage, this microcontroller is efficient in power consumption and suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

The high operating temperature range makes this microcontroller suitable for industrial applications where temperature fluctuations may occur.

Minimum Operating Temperature: -10 °C

With a low minimum operating temperature, this microcontroller can withstand cold environments, making it versatile in various settings.

ADC Channels: YES

The availability of ADC channels enables analog signal conversion, expanding the sensor compatibility and functionality of the microcontroller.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer and processing, enhancing the performance speed of the microcontroller.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and connection process, offering convenience in the assembly of the microcontroller.

ROM Words: 2097152

With a large ROM capacity, this microcontroller can store extensive program data, making it suitable for complex applications with large codebases.

Maximum Seated Height: 2.5 mm

The low seated height allows for compact product designs, making this microcontroller ideal for space-constrained applications.

Width: 27 mm

The moderate width of this microcontroller offers a balanced size for integration on PCBs, ensuring compatibility with standard board sizes.

External Data Bus Width: 32

The wide external data bus width enables efficient data transfer with external devices, enhancing the communication capabilities of the microcontroller.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency, this microcontroller can process data quickly and efficiently, making it suitable for real-time applications.

Length: 27 mm

The moderate length of this microcontroller complements its width, offering a square form factor for easy integration in various product designs.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller itself, this product acts as a central processing unit for peripherals, simplifying system design and operation.

RAM Bytes: 65536

The generous RAM capacity allows for efficient data storage and processing, facilitating multitasking and high-speed operations.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection, ensuring stable performance in challenging environments.

Maximum Supply Current: 700 mA

With a high maximum supply current, this microcontroller can power multiple peripherals and components, enhancing its functionality.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage ensures stable operation and compatibility with standard power sources, making it a reliable choice for various applications.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and flexible updating of firmware, ensuring adaptability and longevity of the microcontroller.

Terminal Pitch: 1 mm

The tight terminal pitch enables compact PCB designs and efficient signal routing, optimizing the space utilization and performance of the microcontroller.

Speed: 150 rpm

With a high speed rating, this microcontroller can process data quickly and respond to inputs promptly, making it suitable for time-sensitive applications.

No. of I/O Lines: 127

The abundance of I/O lines allows for versatile connectivity and interfacing with external devices, expanding the functionality and compatibility of the microcontroller.

Technical Specifications

Microcontrollers SAK-TC1796-256F150EBD attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

Length:

27 mm

No. of I/O Lines:

127

No. of Terminals:

416

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-10 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5,2.5/3.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

2.5 mm

Speed:

150 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

700 mA

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SAK-TC1796-256F150EBD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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