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SAK-TC397XP-256F300SBD

Infineon Technologies

SAK-TC397XP-256F300SBD by Infineon Technologies

Infineon's SAK-TC397XP-256F300SBD microcontroller features 32-bit architecture, 8KB cache, and 1179648 bytes of data EEPROM. With a max clock frequency of 40MHz, it is ideal for applications requiring CAN, I2C, LIN connectivity and ISO 26262 compliance in automotive systems.

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AZTECH Wire

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Overview

Upgrade your projects with the cutting-edge SAK-TC397XP-256F300SBD microcontroller from Infineon Technologies. This high-quality device offers unparalleled performance and reliability, making it ideal for a wide range of applications. With advanced features and a robust design, this microcontroller delivers exceptional value and efficiency to customers. Experience the advantages of seamless connectivity, low power consumption, and top-notch performance in a compact package. Trust Infineon Technologies to provide you with the best-in-class solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making it ideal for a wide range of applications.

Integrated Cache: YES

Integrated cache helps improve overall performance by reducing memory access times and increasing data retrieval speed.

Maximum Supply Voltage: 1.375 V

Higher supply voltage allows for greater flexibility in power management and improved performance under varying load conditions.

On Chip Data RAM Width: 8

Having a wider data RAM width enables faster data processing and manipulation, leading to improved overall system performance.

Address Bus Width: 16

A wider address bus allows for accessing a larger memory space, which is crucial for handling complex calculations and data-intensive tasks.

Screening Level: ISO 26262

Compliance with ISO 26262 ensures a high level of functional safety and reliability in safety-critical applications.

Package Shape: SQUARE

Square packages offer better thermal performance and efficient use of board space, making the product suitable for compact designs.

Bit Size: 32

Having a 32-bit architecture provides high processing power and allows for handling of complex instructions, making the product suitable for demanding applications.

No. of Terminals: 292

A higher number of terminals allow for more connectivity options and expansion capabilities on the board, making it versatile for different applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers excellent mechanical strength, low profile for space-constrained designs, and fine pitch for high pin density, making it a versatile choice for various applications.

Minimum Supply Voltage: 1.125 V

Having a lower minimum supply voltage helps in reducing power consumption and enabling operation in low-power modes, leading to energy efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can function reliably in harsh environments and under extreme conditions without compromising performance.

CPU Family: TC39X

Belonging to a specific CPU family ensures compatibility with existing systems and software, making it easier to integrate into various applications.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures ensures reliability in cold environments, making the product suitable for a wide range of operating conditions.

Terminal Finish: Tin/Silver (Sn/Ag)

Tin/silver terminal finish provides good solderability, corrosion resistance, and conductivity, ensuring reliable connections and long-term performance.

ADC Channels: YES

Having analog-to-digital converter channels enables the product to interface with analog sensors and devices, expanding its compatibility and functionality.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfers without CPU intervention, improving system performance and throughput.

Terminal Position: BOTTOM

Bottom terminal position facilitates ease of PCB layout and assembly, reducing signal distortion and improving overall reliability.

ROM Words: 16777216

With a large ROM capacity, the product can store a vast amount of program code and data, enabling complex algorithms and applications to run smoothly.

Maximum Seated Height: 1.7 mm

Low seated height allows for slim and compact designs, making the product suitable for space-constrained applications such as portable devices.

Width: 17 mm

Compact width dimensions enable efficient usage of board space and easy integration into tight layouts, enhancing design flexibility and versatility.

Data EEPROM Size: 1179648

Large EEPROM size allows for non-volatile data storage, configuration settings, and program data retention, enhancing system reliability and customization options.

Boundary Scan: YES

Boundary scan support enables easier debugging, testing, and programming of the product, simplifying development and maintenance processes.

External Data Bus Width: 32

Having a wide external data bus width allows for faster data transfers between peripherals and memory, improving overall system performance and responsiveness.

Peripherals: DMA(128), POR, TIMER(8), WDT

A wide range of peripherals such as DMA, timers, and watchdog timers enhance system functionality, flexibility, and real-time performance in various applications.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast execution of instructions and improves system responsiveness, making the product suitable for real-time processing and high-speed applications.

Length: 17 mm

Compact length dimensions offer design flexibility and space savings, allowing the product to be used in applications with size constraints and layout limitations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates CPU, memory, and I/O peripherals on a single chip, providing a cost-effective and space-efficient solution for embedded systems.

No. of Timers: 8

Multiple timers offer precise timing control for various functions and tasks, enhancing system performance, reliability, and synchronization capabilities.

RAM Bytes: 2883584

Large RAM capacity enables efficient data storage, processing, and multitasking, improving system performance and responsiveness in memory-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various voltage levels, making the product energy-efficient and versatile for different applications.

Terminal Form: BALL

Ball terminal form facilitates high-density mounting and reliable solder connections, ensuring robust PCB attachment and electrical performance.

Analog To Digital Convertors: 76-Ch 12-Bit

Multiple high-resolution ADC channels enable accurate analog signal conversion for sensor interfacing, data acquisition, and control applications.

Maximum Supply Current: 300 mA

With a maximum supply current of 300 mA, the product can operate reliably within specified power limits, ensuring stable performance and longevity.

Nominal Supply Voltage: 1.25 V

A stable nominal supply voltage of 1.25 V provides consistent power delivery to the product, supporting reliable operation under varying load conditions.

No. of DMA Channels: 128

The availability of 128 DMA channels allows for efficient data transfer and management, reducing CPU overhead and improving system performance.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of digital signals and motor speed, making the product suitable for applications requiring accurate pulse generation and modulation.

Connectivity: CAN(12), I2C(2), LIN(12), MMC, PSI(6), SD, QSPI(4)

Versatile connectivity options such as CAN, I2C, LIN, and SD allow for seamless integration with external devices, networks, and peripherals, expanding the product's compatibility and functionality.

ROM Programmability: FLASH

Flash ROM programmability enables on-the-fly firmware updates, configuration changes, and code storage, enhancing system flexibility and adaptability in dynamic environments.

Terminal Pitch: 0.8 mm

Having a fine terminal pitch of 0.8 mm allows for high-density mounting and efficient use of board space, making the product suitable for compact designs and miniaturized applications.

Format: FLOATING-POINT

Support for floating-point format enables high-precision numerical calculations and complex mathematical operations, enhancing the product's computational capabilities for scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, prompting appropriate handling and storage procedures to prevent moisture-related damage and ensure product reliability.

Speed: 300 rpm

With a speed rating of 300 rpm, the product can process data and execute instructions at a fast pace, making it suitable for real

Technical Specifications

Microcontrollers SAK-TC397XP-256F300SBD attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC39X

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

292

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

2883584

ROM Words:

16777216

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

1.375 V

Minimum Supply Voltage:

1.125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver (Sn/Ag)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

1179648

Connectivity:

CAN(12), I2C(2), LIN(12), MMC, PSI(6), SD, QSPI(4)

Peripherals:

DMA(128), POR, TIMER(8), WDT

Analog To Digital Convertors:

76-Ch 12-Bit

Trade Compliance

SAK-TC397XP-256F300SBD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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