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SAK-TC1782N-320F180HRBA

Infineon Technologies

SAK-TC1782N-320F180HRBA by Infineon Technologies

Infineon's SAK-TC1782N-320F180HRBA microcontroller features 32-bit architecture, 40 MHz clock frequency, and 86 I/O lines. Ideal for automotive applications, it offers ADC and DMA channels with a low-profile square package style. Operating at voltages b/w 1.235V to 1.365V, this CMOS technology-based device is designed for high-speed processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 509 parts In-Stock

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509

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Bristol Electronics

USA . 500 parts In-Stock

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500

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Digiode

USA . 230 parts In-Stock

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230

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Nova Conductors

Japan . 10 parts In-Stock

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Semicontronic

India . 566 parts In-Stock

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$8.000

100+ parts

$7.800

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$7.760

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566

$8.000

$7.800

$7.760

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AZTECH Wire

Italy . 819 parts In-Stock

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$9.514

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$9.514

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Ampacity Inc.

Singapore . 1,454 parts In-Stock

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$23.000

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$23.000

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Corohmni

South Africa . 77 parts In-Stock

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$75.276

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77

$75.276

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Modulus Dynamics

Lithuania . 2,962 parts In-Stock

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$75.625

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$72.600

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$69.575

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2,962

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$69.575

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Continental Prestige Electronics

USA . 6,168 parts In-Stock

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Bastille Electronics

Australia . 3,058 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,270 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Corphita

USA . 276 parts In-Stock

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Kepictronics

USA . 67 parts In-Stock

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Overview

Experience top-notch performance and reliability with the SAK-TC1782N-320F180HRBA microcontroller by industry leader Infineon Technologies. This cutting-edge device offers unparalleled precision and efficiency for a wide range of applications, all while providing exceptional value and benefits to customers. With advanced features such as ADC channels, DMA channels, and a maximum clock frequency of 40 MHz, this microcontroller is the ideal choice for those seeking high-quality performance in a compact package. Trust in Infineon Technologies to deliver exceptional products that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.365 V

Provides a stable power source for reliable performance in various applications.

Package Shape: SQUARE

Ideal for compact designs and efficient use of space in electronic devices.

Bit Size: 32

Offers high processing power and capability for handling complex tasks efficiently.

No. of Terminals: 176

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers versatile mounting options to suit different design requirements.

Minimum Supply Voltage: 1.235 V

Ensures compatibility with a wide range of power sources for flexibility in usage.

ADC Channels: YES

Enables analog-to-digital conversion for accurate sensor readings and data processing.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Simplifies routing and connection of terminals for easier board layout planning.

Width: 24 mm

Compact form factor ideal for space-constrained applications and designs.

Maximum Clock Frequency: 40 MHz

Allows for high-speed processing and performance in demanding tasks.

Length: 24 mm

Symmetrical dimensions for uniformity in placement on circuit boards.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a robust instruction set and architecture for optimized performance.

Technology: CMOS

Offers low power consumption and reliable operation in various environments.

Terminal Form: GULL WING

Ensures secure and reliable solder connections for long-term durability.

Nominal Supply Voltage: 1.3 V

Provides a standard voltage level for consistent and stable operation.

Terminal Pitch: 0.5 mm

Allows for precise and compact arrangement of terminals for efficient board design.

Speed: 133 rpm

Offers fast data processing capabilities for real-time applications and smooth operation.

No. of I/O Lines: 86

Provides ample input/output options for versatile connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers SAK-TC1782N-320F180HRBA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

24 mm

No. of I/O Lines:

86

No. of Terminals:

176

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Speed:

133 rpm

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SAK-TC1782N-320F180HRBA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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