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SAK-TC277TP-64F200SCA

Infineon Technologies

SAK-TC277TP-64F200SCA by Infineon Technologies

SAK-TC277TP-64F200SCA by Infineon is a 32-bit microcontroller with 292 terminals, 384K Data EEPROM, and 483328 RAM Bytes. Ideal for automotive applications, it offers 60-Ch ADC, CAN connectivity, and operates at up to 40 MHz clock frequency.

Median Price

$20.580

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rutronik

Germany . 6,000 parts In-Stock

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$20.580

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6,000

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$20.580

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Vyrian

USA . 316 parts In-Stock

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316

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Digiode

USA . 150 parts In-Stock

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150

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 451 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

451

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 698 parts In-Stock

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$14.091

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698

$14.091

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Modulus Dynamics

Lithuania . 2,174 parts In-Stock

1+ parts

$15.383

100+ parts

$14.768

1k+ parts

$14.152

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2,174

$15.383

$14.768

$14.152

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Ampacity Inc.

Singapore . 489 parts In-Stock

1+ parts

$34.000

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489

$34.000

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Corohmni

South Africa . 594 parts In-Stock

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$41.998

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594

$41.998

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Bastille Electronics

Australia . 3,267 parts In-Stock

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3,267

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Argo Parts USA

USA . 586 parts In-Stock

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586

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Corphita

USA . 414 parts In-Stock

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414

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Continental Prestige Electronics

USA . 316 parts In-Stock

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316

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Overview

Unlock the power of cutting-edge technology with the SAK-TC277TP-64F200SCA microcontroller by Infineon Technologies. Designed for automotive applications, this high-quality device offers unparalleled performance and reliability. With a wide range of peripherals and advanced features such as DMA channels and ADC channels, this microcontroller provides exceptional value and flexibility for your projects. Trust in the expertise of Infineon Technologies to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this microcontroller can operate in various environments without any issues.

ADC Channels: YES

The presence of Analog to Digital Converters allows for the conversion of analog signals into digital data, providing versatile input options.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables fast processing speeds, making the microcontroller suitable for tasks requiring quick execution.

Data EEPROM Size: 384K

Having a large data EEPROM size allows for ample storage space for program and configuration data, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers SAK-TC277TP-64F200SCA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT IS ALSO HAVING 6-CH DELTA-SIGMA ADC

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

No. of I/O Lines:

150

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

483328

ROM Words:

4194304

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

384K

Connectivity:

ASCLIN(4), CAN(4), ETHERNET, HSSL, I2C, MSC(2), PSI5(4), QSPI(4), SENT(10)

Peripherals:

DMA(64), POR, TEMPERATURE SENSOR, TIMER(30)

Analog To Digital Convertors:

60-Ch 12-Bit

Trade Compliance

SAK-TC277TP-64F200SCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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