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SAK-TC1766-192F80HLBDTR

Infineon Technologies

SAK-TC1766-192F80HLBDTR by Infineon Technologies

SAK-TC1766-192F80HLBDTR by Infineon: 32-bit microcontroller with 1540096 ROM words, 81920 RAM bytes. Automotive grade for ADC(32-Ch), DMA(8), CAN(2) connectivity. Operates at -40 to 125 °C, clocked at max 25 MHz for automotive applications.

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Modulus Dynamics

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Overview

Unleash the power of innovation with the SAK-TC1766-192F80HLBDTR microcontroller by Infineon Technologies. Crafted with precision and expertise, this cutting-edge device is designed to exceed expectations in various applications. From automotive systems to industrial automation, this microcontroller offers unparalleled performance and reliability. With advanced features like DMA channels, ADC channels, and a wide range of peripherals, customers can expect seamless integration and optimal functionality. Elevate your projects to new heights with the SAK-TC1766-192F80HLBDTR microcontroller - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, reducing assembly time and complexity.

Maximum Supply Voltage: 1.58 V

The high maximum supply voltage ensures stable operation and compatibility with a wide range of power sources.

Package Shape: SQUARE

The square shape of the package provides easy mounting and alignment on circuit boards.

Bit Size: 32

A 32-bit architecture allows for faster processing and handling of complex instructions and data.

No. of Terminals: 176

The large number of terminals enables connectivity to a wide range of external devices and peripherals.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design with low profile and fine pitch for space-constrained applications.

Minimum Supply Voltage: 1.42 V

The low minimum supply voltage ensures efficient power usage and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in cold environments or during startup.

ADC Channels: YES

The presence of Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and inputs.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce the load on the CPU for enhanced performance.

Terminal Position: QUAD

Quad-terminal position facilitates easy soldering and connection to external components in a compact layout.

ROM Words: 1540096

Large ROM capacity allows for storing complex programs and data, making the microcontroller suitable for versatile applications.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a compact design and facilitates integration into slim devices or assemblies.

Width: 24 mm

The moderate width of the microcontroller offers a balance between space efficiency and ease of handling during assembly.

Data EEPROM Size: 4K

The EEPROM size allows for storing critical data that requires non-volatile memory retention for various applications.

Peripherals: DMA(8), POR, TIMER(2), WDT

The presence of multiple peripherals such as DMA, POR, timers, and Watchdog Timer enhances the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables fast data processing and execution of instructions for efficient operation.

Length: 24 mm

The moderate length of the microcontroller offers a balance between form factor and functionality in various applications.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in automotive and industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller IC type ensures optimized performance and tailored features for specific control and processing tasks.

RAM Bytes: 81920

Large RAM capacity allows for efficient data storage and manipulation during program execution for enhanced performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable and efficient operation in various applications.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering during assembly on circuit boards.

Analog To Digital Convertors: 32-Ch 12-Bit, 2-Ch 10-Bit

Multiple ADC channels with high resolution allow for precise analog signal conversion, supporting a wide range of sensor inputs.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage ensures stable operation and compatibility with standard power sources for consistent performance.

Connectivity: ASC(2), CAN(2), MLI(2), SSC(2)

Multiple connectivity options such as ASC, CAN, MLI, and SSC facilitate communication with external devices and networks for versatile applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and updating of firmware, enhancing flexibility and customization of the microcontroller.

Terminal Pitch: 0.5 mm

The small terminal pitch enables dense packing of terminals for compact designs and efficient use of board space.

Speed: 80 rpm

The high speed capability of 80 rpm allows for fast data processing and execution, suitable for time-critical applications.

On Chip Program ROM Width: 8

The on-chip programmable ROM width of 8 bits enables efficient storage and retrieval of program instructions for seamless execution.

No. of I/O Lines: 81

The abundant number of I/O lines provides ample connectivity options for interfacing with external devices and peripherals in diverse applications.

Technical Specifications

Microcontrollers SAK-TC1766-192F80HLBDTR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of I/O Lines:

81

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

81920

ROM Words:

1540096

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

ASC(2), CAN(2), MLI(2), SSC(2)

Peripherals:

DMA(8), POR, TIMER(2), WDT

Analog To Digital Convertors:

32-Ch 12-Bit, 2-Ch 10-Bit

Trade Compliance

SAK-TC1766-192F80HLBDTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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