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TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
LMH0318RTWR by Texas Instruments

LMH0318RTWR

Texas Instruments

Texas Instruments LMH0318RTWR is a 24-terminal telecom IC with data rate of 2970 Mbps. Operating temperature range from -40 to 85°C, suitable for industrial applications. Package style is chip carrier with matte tin finish, ideal for surface mount assembly.

2970 Mbps

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

LMH0318RTWT by Texas Instruments

LMH0318RTWT

Texas Instruments

LMH0318RTWT by Texas Instruments is a telecom IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, supports data rates up to 2970 Mbps, and has a nominal voltage of 2.5V. Ideal for telecom circuits, this IC is designed for industrial applications requiring high-speed data transmission in compact form factors.

2970 Mbps

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

GS2971-IBE3 by Semtech

GS2971-IBE3

Semtech

Semtech's GS2971-IBE3 is a telecom IC with 100 terminals in a square grid array package. Operating temp range -20 to 85°C, terminal pitch of 1mm, and nominal voltage of 1.2V make it ideal for telecom circuit applications. The low-profile design with tin silver copper finish and ball terminal form ensures reliable performance.

S-PBGA-B100

e1

11 mm

1

1

100

85 Cel

-20 Cel

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

260

1.7 mm

1.2 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

11 mm

WT41-E-AI4 by Silicon Labs

WT41-E-AI4

Silicon Labs

Silicon Labs' WT41-E-AI4 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 57 terminals, operating from -40 to 85 °C. It's an INDUSTRIAL-grade TELECOM CIRCUIT IC with 3.3V supply voltage, ideal for telecom interface applications due to its compact size and surface mount capability.

R-XQMA-N57

35.55 mm

1

57

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

3.35 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.5 mm

QUAD

NOT SPECIFIED

14.5 mm

WF111-E-V1 by Silicon Labs

WF111-E-V1

Silicon Labs

WF111-E-V1 by Silicon Labs is a telecom IC with 33 terminals in a rectangular package. It operates at -40 to 85°C, supports data rates up to 72.2 Mbps, and has a supply voltage of 1.5V. Ideal for industrial applications requiring high-speed communication in compact form factors.

72.2 Mbps

R-XQMA-N33

19 mm

3

1

33

85 Cel

-40 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

2.3 mm

1.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.27 mm

QUAD

40

12 mm

SI21822-B60-GM/R by Silicon Labs

SI21822-B60-GM/R

Silicon Labs

SI21822-B60-GM/R by Silicon Labs is a telecom IC with 68 terminals in a square chip carrier package. Operating temperature ranges from -10°C to 75°C, suitable for commercial extended applications. Nominal voltage is 1.2V, making it ideal for telecom circuit interfaces.

S-XQCC-N68

1

68

75 Cel

-10 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.2 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

QUAD

TB6865AFG by Toshiba

TB6865AFG

Toshiba

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G100

14 mm

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.7 mm

3.3 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

14 mm

WT41-A-AI4 by Silicon Labs

WT41-A-AI4

Silicon Labs

WT41-A-AI4 by Silicon Labs is a telecom IC with 59 terminals, operating temperature range of -40 to 85°C. It has a rectangular shape, no-lead terminal form, and nominal voltage of 3.3V. Ideal for industrial applications requiring telecom circuit interfaces in compact microelectronic assemblies.

R-XQMA-N59

35.55 mm

1

59

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

5.65 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.5 mm

QUAD

NOT SPECIFIED

14.5 mm

PN5180A0ET/C1,151 by NXP Semiconductors

PN5180A0ET/C1,151

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B64

e1

5.5 mm

1

1

64

85 Cel

-30 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.15 mm

1.8 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

5.5 mm

PN5180A0HN/C1,551 by NXP Semiconductors

PN5180A0HN/C1,551

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N40

6 mm

1

40

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.8 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

6 mm

ADF5901WCCPZ by Analog Devices

ADF5901WCCPZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

e3

5 mm

3

1

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

BM78SPP05MC2-0002AA by Microchip Technology

BM78SPP05MC2-0002AA

Microchip Technology

BM78SPP05MC2-0002AA by Microchip Technology is a telecom IC with 30 terminals, operating b/w -20 to 70°C. It has a supply voltage of 1.9V and peak reflow temperature of 255°C. This rectangular package is ideal for telecom circuit applications due to its gold over nickel terminal finish and no-lead terminal form.

R-XXMA-N30

e4

15 mm

1

30

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,30LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

255

1.86 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

GOLD OVER NICKEL

NO LEAD

1.1 mm

UNSPECIFIED

40

12 mm

BM78SPPS5MC2-0002AA by Microchip Technology

BM78SPPS5MC2-0002AA

Microchip Technology

BM78SPPS5MC2-0002AA by Microchip Tech is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 33 terminals. Operating temp: -20 to 70°C, peak reflow temp: 255°C. Used in telecom circuits, it has a nominal voltage of 1.9V and terminal pitch of 1.1mm for commercial applications.

R-XXMA-N33

e4

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

255

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

GOLD OVER NICKEL

NO LEAD

1.1 mm

UNSPECIFIED

40

12 mm

CYBLE-222005-00 by Cypress Semiconductor

CYBLE-222005-00

Cypress Semiconductor

CYBLE-222005-00 by Cypress: Telecom IC with 22 terminals, 3.3V supply voltage, -40 to 85°C operating temp. Ideal for telecom circuits in industrial applications due to its compact square package and surface mount capability.

S-XXMA-N22

10 mm

1

22

85 Cel

-40 Cel

UNSPECIFIED

SQUARE

MICROELECTRONIC ASSEMBLY

1.6 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UNSPECIFIED

10 mm

TCP-4112UB-DT by Onsemi

TCP-4112UB-DT

Onsemi

TCP-4112UB-DT by Onsemi is a Telecom IC with 4 terminals in a grid array package. It operates b/w -30 °C to 85°C, with terminal finish in nickel gold. With a very thin profile of 0.345mm, it is suitable for telecom circuit applications.

R-PBGA-B4

e4

.626 mm

1

1

4

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.345 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL GOLD

BALL

.42 mm

BOTTOM

.609 mm

STHVDAC-256MTGF3 by STMicroelectronics

STHVDAC-256MTGF3

STMicroelectronics

STHVDAC-256MTGF3 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C to 85 °C, with a nominal voltage of 3.3V and features a very thin profile in a 20-terminal grid array package. Ideal for compact telecom systems, it ensures efficient signal processing.

R-PBGA-B20

2.23 mm

1

20

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.64 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

NOT SPECIFIED

1.94 mm

TCP-4182UB-DT by Onsemi

TCP-4182UB-DT

Onsemi

TCP-4182UB-DT by Onsemi is a telecom IC with 4 terminals, nickel gold finish, and very thin profile. It operates b/w -30 to 85 °C, suitable for telecom circuit applications requiring fine pitch grid array packaging.

R-PBGA-B4

e4

1.009 mm

1

1

4

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.345 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL GOLD

BALL

.42 mm

BOTTOM

.609 mm

AD9671KBCZ by Analog Devices

AD9671KBCZ

Analog Devices

AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.

S-PBGA-B144

10 mm

3

1

144

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.4 V

YES

TELECOM CIRCUIT

OTHER

BALL

.8 mm

BOTTOM

30

10 mm

AD9670BBCZ by Analog Devices

AD9670BBCZ

Analog Devices

AD9670BBCZ by Analog Devices is a 144-terminal telecom IC with a 1.4V supply voltage. It features a low profile grid array package, operates b/w 0-85°C, and has a peak reflow temperature of 260°C. Ideal for telecom circuit applications requiring fine pitch components in a compact form factor.

S-PBGA-B144

10 mm

3

1

144

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.4 V

YES

TELECOM CIRCUIT

OTHER

BALL

.8 mm

BOTTOM

30

10 mm

HMC8200LP5ME by Analog Devices

HMC8200LP5ME

Analog Devices

Analog Devices' HMC8200LP5ME is a 32-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a square chip carrier package style, suitable for industrial applications requiring a very thin profile and nickel palladium gold terminal finish.

S-XQCC-N32

e4

5 mm

3

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

5 mm

WGM110A1MV2R by Silicon Labs

WGM110A1MV2R

Silicon Labs

WGM110A1MV2R by Silicon Labs is a telecom IC with 40 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.25mm. Ideal for industrial applications requiring compact surface-mount telecom interface ICs.

R-XXMA-N40

21 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.25 mm

UNSPECIFIED

14.4 mm

WGM110A1MV2 by Silicon Labs

WGM110A1MV2

Silicon Labs

Silicon Labs' WGM110A1MV2 is a telecom IC with 40 terminals, operating at -40 to 85°C. With a supply voltage of 3.3V, it's ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package style. The surface-mountable RECTANGULAR device measures 14.4mm x 21mm with a low seated height of 2.1mm, making it suitable for space-constrained designs.

R-XXMA-N40

21 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.25 mm

UNSPECIFIED

14.4 mm

ENW89835A1KF by Panasonic

ENW89835A1KF

Panasonic

Panasonic ENW89835A1KF is a telecom IC with 3.3V supply voltage, -40 to 85°C operating temp range, and 15.6mm length. It's a surface-mount rectangular package suitable for industrial applications requiring telecom circuit interfaces in microelectronic assemblies.

R-XXMA-N

15.6 mm

1

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

250

2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UNSPECIFIED

50

8.7 mm

ENW89835A3KF by Panasonic

ENW89835A3KF

Panasonic

ENW89835A3KF by Panasonic is a surface mount telecom interface IC with a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 3.3V. This IC is suitable for various telecom circuit applications.

R-XXMA-N

15.6 mm

1

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

250

2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UNSPECIFIED

10

8.7 mm

RF-HDT-AJLC-G0 by Texas Instruments

RF-HDT-AJLC-G0

Texas Instruments

RF-HDT-AJLC-G0 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. Operating temperature range from -40°C to 85°C, making it suitable for various applications. Its uncased chip package style and no-lead terminal form offer flexibility in design and integration.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

RF-HDT-AJLE-G1 by Texas Instruments

RF-HDT-AJLE-G1

Texas Instruments

Texas Instruments RF-HDT-AJLE-G1 is an industrial-grade telecom circuit IC with surface mount capability. Operating temperature ranges from -40°C to 85°C. Its uncased chip package style and no-lead terminal form make it suitable for various telecom interface applications.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

RF-HDT-AJLS-G1 by Texas Instruments

RF-HDT-AJLS-G1

Texas Instruments

RF-HDT-AJLS-G1 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. It operates b/w -40°C to 85°C, making it suitable for various temperature environments. With a terminal position of upper and no-lead terminal form, it is ideal for telecommunications applications.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

RF-HDT-SJLC-G0 by Texas Instruments

RF-HDT-SJLC-G0

Texas Instruments

RF-HDT-SJLC-G0 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. It operates b/w -40°C to 85°C, making it suitable for various temperature environments. With a terminal position of upper and no-lead terminal form, it is ideal for telecom interface applications.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

RF-HDT-WNMC-M0 by Texas Instruments

RF-HDT-WNMC-M0

Texas Instruments

Texas Instruments RF-HDT-WNMC-M0 is an industrial-grade telecom circuit IC with surface mount capability. Operating temperature ranges from -40°C to 85°C. It features a terminal position of upper and comes in unencased chip package style, suitable for various telecom interface applications.

X-XUUC-N

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

RI-I11-114A-01 by Texas Instruments

RI-I11-114A-01

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; Terminal Position: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

S-XXSS-X

1

70 Cel

-25 Cel

UNSPECIFIED

SQUARE

SPECIAL SHAPE

NOT SPECIFIED

NO

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

RI-STU-251B-01 by Texas Instruments

RI-STU-251B-01

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Terminal Position: UNSPECIFIED;

R-XXSS-X

1

70 Cel

-20 Cel

UNSPECIFIED

RECTANGULAR

SPECIAL SHAPE

NO

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

RI-STU-251B-30 by Texas Instruments

RI-STU-251B-30

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Surface Mount: NO; Terminal Position: UNSPECIFIED;

R-XXSS-X

1

70 Cel

-20 Cel

UNSPECIFIED

RECTANGULAR

SPECIAL SHAPE

NO

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

RI-TRP-RFOB-30 by Texas Instruments

RI-TRP-RFOB-30

Texas Instruments

RI-TRP-RFOB-30 by Texas Instruments is an industrial-grade telecom IC with temp range -40 to 85°C. It features a special shape plastic/epoxy package, tin silver copper terminal finish. Ideal for telecom circuits, this IC ensures reliable performance in various applications.

X-PXSS-X

e1

1

85 Cel

-40 Cel

PLASTIC/EPOXY

UNSPECIFIED

SPECIAL SHAPE

NO

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

UNSPECIFIED

UNSPECIFIED

RI-TRP-WFOB-30 by Texas Instruments

RI-TRP-WFOB-30

Texas Instruments

RI-TRP-WFOB-30 by Texas Instruments is an industrial-grade telecom IC with a temperature range of -40 to 85°C. It features a special shape plastic/epoxy package and terminal finish of tin silver copper. Ideal for telecom circuits, this IC offers reliable performance in various applications.

X-PXSS-X

e1

1

85 Cel

-40 Cel

PLASTIC/EPOXY

UNSPECIFIED

SPECIAL SHAPE

NO

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

UNSPECIFIED

UNSPECIFIED

TMS37145TEAIE by Texas Instruments

TMS37145TEAIE

Texas Instruments

TMS37145TEAIE by Texas Instruments is an industrial-grade telecom circuit IC with a max operating temp of 85°C and min of -40°C. It comes in a special shape plastic/epoxy package, measuring 12mm in width and 6mm in length. Ideal for telecom interface applications requiring high-temperature performance.

X-PXSS-X

6 mm

1

1

85 Cel

-40 Cel

PLASTIC/EPOXY

UNSPECIFIED

SPECIAL SHAPE

260

NO

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

30

12 mm

ADF5904ACPZ by Analog Devices

ADF5904ACPZ

Analog Devices

Analog Devices ADF5904ACPZ is a 32-terminal telecom IC with a nominal voltage of 3.3V, operating b/w -40 to 105 °C. It features a square chip carrier package style, matte tin terminal finish, and very thin profile for industrial applications in telecom circuits.

S-XQCC-N32

e3

5 mm

3

1

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

ADF5904WCCPZ by Analog Devices

ADF5904WCCPZ

Analog Devices

Analog Devices ADF5904WCCPZ is a 32-terminal telecom IC with 3.3V supply voltage, operating from -40 to 105°C. It features a square chip carrier package style, matte tin terminal finish, and AEC-Q100 screening level for industrial applications. The IC is surface-mountable and has a very thin profile suitable for various telecom interface functions.

S-XQCC-N32

e3

5 mm

3

1

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

BGM113A256V1 by Silicon Labs

BGM113A256V1

Silicon Labs

Silicon Labs' BGM113A256V1 is a telecom IC with 36 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mountable IC in a rectangular package is ideal for industrial applications requiring telecom circuit functionality.

R-XXMA-N36

15.73 mm

1

36

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.09 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.8 mm

UNSPECIFIED

9.15 mm

MFRC52302HN1,151 by NXP Semiconductors

MFRC52302HN1,151

NXP Semiconductors

NXP Semiconductors' MFRC52302HN1,151 is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for applications requiring a very thin profile and surface mount compatibility.

S-PQCC-N32

e4

5 mm

1

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

5 mm

STA8090GATR by STMicroelectronics

STA8090GATR

STMicroelectronics

STA8090GATR by STMicroelectronics is a 56-terminal IC with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a package style of CHIP CARRIER and very thin profile, it offers a nominal voltage of 1.2V.

S-XQCC-N56

e3

8 mm

3

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

250

.9 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

8 mm

STA8090GA by STMicroelectronics

STA8090GA

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N56

8 mm

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.9 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

8 mm

WT11I-A-AI4 by Silicon Labs

WT11I-A-AI4

Silicon Labs

Silicon Labs' WT11I-A-AI4 is a telecom IC with 28 terminals, operating at -40 to 85°C. With a supply voltage of 3.3V, it's ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package and DUAL terminal position.

R-XDMA-N28

35.75 mm

1

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.86 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.5 mm

DUAL

14.5 mm

WT11I-E-AI5 by Silicon Labs

WT11I-E-AI5

Silicon Labs

Silicon Labs' WT11I-E-AI5 is a telecom IC with 28 terminals, operating b/w -40°C to 85°C. With a nominal voltage of 3.3V, it features a rectangular package style measuring 14.5mm in width and 35.75mm in length. Ideal for industrial applications requiring telecom circuit interfaces at a terminal pitch of 1.5mm.

R-XDMA-N28

35.75 mm

1

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.86 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.5 mm

DUAL

14.5 mm

WT41-A-AI5 by Silicon Labs

WT41-A-AI5

Silicon Labs

Silicon Labs' WT41-A-AI5 is a telecom IC with 59 terminals, operating at -40 to 85°C. Its compact rectangular package measures 14mm in width and 35.3mm in length, suitable for industrial applications requiring a 3.3V supply voltage and surface mount installation.

R-XXMA-N59

35.3 mm

1

59

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

5.65 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.5 mm

UNSPECIFIED

14 mm

HMC773ALC3BTR by Analog Devices

HMC773ALC3BTR

Analog Devices

Analog Devices' HMC773ALC3BTR is a telecom IC with 12 terminals in a square chip carrier package. Operating from -40 to 85°C, it features gold over nickel terminal finish and 0.5mm pitch. Ideal for industrial applications requiring very thin profile components.

S-CQCC-N12

e4

3 mm

3

1

12

85 Cel

-40 Cel

CERAMIC, METAL-SEALED COFIRED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.92 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

.5 mm

QUAD

3 mm

HMC773ALC3B by Analog Devices

HMC773ALC3B

Analog Devices

Analog Devices' HMC773ALC3B is a telecom IC with 12 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with TUNGSTEN NICKEL GOLD finish and 0.5mm terminal pitch. Ideal for industrial applications requiring very thin profile and surface mount compatibility.

S-CQCC-N12

3 mm

3

1

12

85 Cel

-40 Cel

CERAMIC, METAL-SEALED COFIRED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.92 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

TUNGSTEN NICKEL GOLD

NO LEAD

.5 mm

QUAD

3 mm

BLE112-A-V1 by Silicon Labs

BLE112-A-V1

Silicon Labs

BLE112-A-V1 by Silicon Labs is a surface mount telecom IC with 31 terminals. It operates in industrial temperature range (-40 to 85°C) and has a compact package style (12.05mm x 18.1mm). Ideal for applications requiring low-power wireless communication.

R-XXMA-N31

18.1 mm

1

31

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.3 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.25 mm

UNSPECIFIED

12.05 mm

BLE112-E-V1 by Silicon Labs

BLE112-E-V1

Silicon Labs

BLE112-E-V1 by Silicon Labs is a surface-mount telecom IC with 31 terminals. It operates in industrial temperature range (-40 to 85°C) and has a compact rectangular package (12.05mm x 18.1mm). Ideal for telecom circuits, it offers a terminal pitch of 1.25mm for various applications.

R-XXMA-N31

18.1 mm

1

31

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.3 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.25 mm

UNSPECIFIED

12.05 mm