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RF-HDT-AJLS-G1

Texas Instruments

RF-HDT-AJLS-G1 by Texas Instruments

RF-HDT-AJLS-G1 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. It operates b/w -40°C to 85°C, making it suitable for various temperature environments. With a terminal position of upper and no-lead terminal form, it is ideal for telecommunications applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,470 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,470

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-

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Digiode

USA . 1,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,538

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$6.974

100+ parts

-

1k+ parts

-

10k+ parts

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623

$6.974

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-

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Parana Technologies

USA . 352 parts In-Stock

1+ parts

$11.928

100+ parts

-

1k+ parts

$12.331

10k+ parts

-

352

$11.928

-

$12.331

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DigiPath Technology Company

USA . 121 parts In-Stock

1+ parts

$13.134

100+ parts

-

1k+ parts

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10k+ parts

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121

$13.134

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IDEA Electronic Components Group

UK . 2,225 parts In-Stock

1+ parts

$13.402

100+ parts

$12.732

1k+ parts

$12.062

10k+ parts

-

2,225

$13.402

$12.732

$12.062

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ChromeModa Solutions

Germany . 1,988 parts In-Stock

1+ parts

$13.402

100+ parts

$10.990

1k+ parts

-

10k+ parts

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1,988

$13.402

$10.990

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One Stop Electronics

USA . 797 parts In-Stock

1+ parts

$587.000

100+ parts

-

1k+ parts

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10k+ parts

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797

$587.000

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Corphita

USA . 1,725 parts In-Stock

1+ parts

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100+ parts

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1,725

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Overview

Unleash the power of seamless communication with the RF-HDT-AJLS-G1 by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unrivaled quality and reliability. From industrial to consumer applications, this versatile product provides a seamless connection for your projects. Experience the value of superior performance and efficiency, as well as the benefits of a trusted manufacturer. Elevate your designs with the RF-HDT-AJLS-G1 and revolutionize the way you communicate.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product suitable for mass production and integration into various electronic devices.

Package Style: UNCASED CHIP

The unencased chip design provides flexibility in terms of mounting options and allows for a smaller footprint, making it suitable for compact and space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in demanding industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows this product to function effectively in both extreme cold and hot environments, ensuring its suitability for a wide range of applications.

Terminal Position: UPPER

The upper terminal position facilitates easy connection and integration with other components, streamlining the overall assembly process and enhancing the product's usability.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this product can operate reliably in rugged industrial environments and critical applications where temperature fluctuations are common.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder-related issues and enhances the product's reliability and durability, making it a preferred choice for applications where robustness is essential.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type offers advanced features and functionalities tailored to meet the unique requirements of telecommunications systems, making it a reliable and efficient solution for communication needs.

Technical Specifications

Other Function Telecom Interface ICs RF-HDT-AJLS-G1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

RF-HDT-AJLS-G1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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