Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF-HDT-AJLS-G1 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. It operates b/w -40°C to 85°C, making it suitable for various temperature environments. With a terminal position of upper and no-lead terminal form, it is ideal for telecommunications applications.
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Surface mount technology allows for easy and efficient assembly, making this product suitable for mass production and integration into various electronic devices.
The unencased chip design provides flexibility in terms of mounting options and allows for a smaller footprint, making it suitable for compact and space-constrained applications.
With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in demanding industrial settings.
The low minimum operating temperature range allows this product to function effectively in both extreme cold and hot environments, ensuring its suitability for a wide range of applications.
The upper terminal position facilitates easy connection and integration with other components, streamlining the overall assembly process and enhancing the product's usability.
The industrial temperature grade ensures that this product can operate reliably in rugged industrial environments and critical applications where temperature fluctuations are common.
The no-lead terminal form eliminates the risk of solder-related issues and enhances the product's reliability and durability, making it a preferred choice for applications where robustness is essential.
Designed specifically for telecom applications, this IC type offers advanced features and functionalities tailored to meet the unique requirements of telecommunications systems, making it a reliable and efficient solution for communication needs.
Other Function Telecom Interface ICs RF-HDT-AJLS-G1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments
JESD-30 Code:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Position:
RF-HDT-AJLS-G1 Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Changzhou Galaxy Century Microelectronics
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWR
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
LM358DR2G
Onsemi
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Diotec Electronics
Won-top Electronics
HMC773ALC3BTR
Analog Devices
Analog Devices' HMC773ALC3BTR is a telecom IC with 12 terminals in a square chip carrier package. Operating from -40 to 85°C, it features gold over nickel terminal finish and 0.5mm pitch. Ideal for industrial applications requiring very thin profile components.
AD73311ARS-REEL
AD73311ARS-REEL by Analog Devices is a 16-bit linear coding telecom IC with 20 terminals in a small outline package. Operating b/w -40 to 85°C, it has a supply voltage of 3V and max gain tolerance of 1dB. Ideal for telecom circuits, this CMOS technology IC features a filter and tin lead terminal finish.
CY7B923-JXCT
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
BT121-A-V2
Silicon Labs
BT121-A-V2 by Silicon Labs is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1mm. This surface-mount IC is ideal for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages.
TMS3705DDRQ1
TMS3705DDRQ1 by Texas Instruments is a telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and terminal pitch of 1.27mm. This AEC-Q100 compliant IC is ideal for industrial applications requiring small outline packages and dual terminal positions.
ESP32-D2WD
Espressif Systems (Shanghai)
ESP32-D2WD by Espressif Systems is a 48-terminal IC with CMOS technology. Operating from -40 to 105°C, it has a supply voltage of 3.3V. Ideal for telecom circuits, this chip carrier is surface-mountable and features a very thin profile for industrial applications.
ISL32275EFVZ-T
Intersil
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
BM78SPPS5NC2-0002AA
Microchip Technology
BM78SPPS5NC2-0002AA by Microchip Tech is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 33 terminals. Operating temp: -20 to 70°C, peak reflow temp: 255°C. Used in telecom circuits, it has a nominal voltage of 1.9V and terminal pitch of 1.1mm for commercial applications.
451-00002
Laird Technologies
Laird Technologies' 451-00002 is a surface mount telecom IC with 71 terminals. Operating b/w -40 to 85°C, it has a seated height of 2.35mm and nominal voltage of 3.3V. Ideal for telecom circuits, it offers data rates up to 2 Mbps in microelectronic assemblies.
NEO-M8J-0
U-blox Ag
TELECOM CIRCUIT;
LBEE5KL1DX-883
Murata Manufacturing
Murata Manufacturing's LBEE5KL1DX-883 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 46 terminals. Operating from -30 to 70°C, it has a seated height of 1.1mm and nominal voltage of 3.6V. Ideal for TELECOM CIRCUITS, this Telecom Interface IC is surface mountable and suited for various telecom applications.
CC2564BYFVR-XI
CC2564BYFVR-XI by Texas Instruments is a 54-terminal IC with a package style of GRID ARRAY. It operates at -40 to 85°C, has a data rate of 4 Mbps, and requires a nominal voltage of 3.6 V. Ideal for telecom circuits, this IC is surface mountable and features TIN SILVER COPPER terminal finish.
HT12D(18DIP)
Holtek Semiconductor
HT12D(18DIP) by Holtek Semiconductor is a CMOS telecom IC with 18 terminals. It operates at temperatures from -20°C to 70°C and supports power supplies of 2.4V to 12V. This rectangular, plastic package is ideal for telecom circuit applications.
RN4871-V/RM130
RN4871-V/RM130 by Microchip Technology is a telecom IC with 16 terminals, operating at -20 to 70°C. It has a supply voltage of 3.3V and data rate of 0.01 Mbps. This surface-mount IC is ideal for telecom applications requiring TS 16949 screening and operates in commercial temperature grade.
RN42-I/RM615
RN42-I/RM615 by Microchip Technology is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps, operates at 3.3V, and is ideal for industrial applications requiring a surface-mount rectangular package with gold over nickel terminal finish.
HTRC11001T/02EE,11
NXP Semiconductors
NXP Semiconductors' HTRC11001T/02EE,11 is a telecom interface IC with 14 terminals and 5V supply voltage. It operates b/w -40 to 85°C, suitable for industrial applications. The package style is small outline, surface mountable, with nickel palladium gold finish.
BT840X
Fanstel
BT840X by Fanstel is a surface mount telecom IC with 61 terminals. It operates b/w -40°C to 85°C, has a nominal voltage of 3.3V, and supports data rates up to 2 Mbps. Ideal for applications requiring high-speed telecommunications in compact electronic assemblies.
A2235-H
Lantronix
The Lantronix A2235-H is an industrial-grade telecom circuit IC with a nominal voltage of 3.3V. It operates b/w -40°C to 85°C, making it suitable for harsh environments. Packaged in a rectangular microelectronic assembly, it is ideal for telecom interface applications.
U2270B-MFPY
Atmel
U2270B-MFPY by Atmel is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates in temperatures ranging from -40 to 105 °C. It is commonly used in telecom circuits for various applications.
BMD-340-A-R-00
BMD-340-A-R-00 by U-blox Ag is a surface mount telecom interface IC with 1 function. It has a rectangular package shape, 68 terminals, and a max seated height of 1.9 mm. With a data rate of 2 Mbps, it is suitable for industrial applications requiring reliable communication at temperatures ranging from -40 to 85 °C.
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DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
RF-HDT-AJLC-G0
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -40 Cel;
RF-HDT-AJLE-G1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER;
RF-HDT-DVBB-N1
TELECOM CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Qualification: Not Qualified; No. of Functions: 1; Maximum Operating Temperature: 90 Cel;
RF-HDT-DVBB-N2
TELECOM CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Maximum Operating Temperature: 90 Cel; Qualification: Not Qualified;
RF-HDT-DVBE-N0
TELECOM CIRCUIT; Temperature Grade: OTHER; Qualification: Not Qualified; Minimum Operating Temperature: -25 Cel; Maximum Operating Temperature: 90 Cel; No. of Functions: 1;
RF-HDT-DVBE-N2
TELECOM CIRCUIT; Temperature Grade: OTHER; No. of Functions: 1; Qualification: Not Qualified; Maximum Operating Temperature: 90 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
RF-HDT-SJLC-G0
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
RF-HDT-SJLE-G1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED;
RF-HDT-SJLS-G1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES;
RF-HDT-SNLE-G1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
RF-HDT-WNMC-M0
RF-HDT-WNME-M0
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