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RF-HDT-AJLC-G0

Texas Instruments

RF-HDT-AJLC-G0 by Texas Instruments

RF-HDT-AJLC-G0 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. Operating temperature range from -40°C to 85°C, making it suitable for various applications. Its uncased chip package style and no-lead terminal form offer flexibility in design and integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,982 parts In-Stock

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8,982

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Digiode

USA . 187 parts In-Stock

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187

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 950 parts In-Stock

1+ parts

$5.467

100+ parts

-

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$6.192

10k+ parts

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950

$5.467

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$6.192

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DigiPath Technology Company

USA . 1,652 parts In-Stock

1+ parts

$6.020

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1,652

$6.020

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ChromeModa Solutions

Germany . 2,092 parts In-Stock

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$6.143

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$5.037

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2,092

$6.143

$5.037

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IDEA Electronic Components Group

UK . 468 parts In-Stock

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$6.143

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$5.529

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468

$6.143

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$5.529

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AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$8.587

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634

$8.587

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Semicontronic

India . 754 parts In-Stock

1+ parts

$388.000

100+ parts

$378.300

1k+ parts

$376.360

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754

$388.000

$378.300

$376.360

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One Stop Electronics

USA . 1,030 parts In-Stock

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$738.000

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1,030

$738.000

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Ampacity Inc.

Singapore . 790 parts In-Stock

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$826.000

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790

$826.000

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Lixinc

USA . 1,183 parts In-Stock

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Corphita

USA . 623 parts In-Stock

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623

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Corohmni

South Africa . 284 parts In-Stock

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284

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Overview

Enhance your telecom interface systems with the RF-HDT-AJLC-G0 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for various applications in the telecom industry. This uncased chip offers a wide operating temperature range, making it ideal for industrial settings. With no lead terminal form and a surface mount design, this telecom circuit IC provides seamless integration and exceptional performance. Upgrade your systems today with the RF-HDT-AJLC-G0 and experience enhanced efficiency and reliability like never before.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, making installation and assembly more efficient.

Package Style (Meter): UNCASED CHIP

The compact unencased chip design saves space and reduces weight, ideal for applications where size and weight are critical factors.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without the risk of performance issues.

Terminal Position: UPPER

The upper terminal position facilitates easy connectivity and integration into existing systems or circuits.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions, ensuring durability and longevity in demanding environments.

Terminal Form: NO LEAD

The absence of leads simplifies installation and reduces the risk of soldering errors, improving the overall reliability of the product.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and compatibility with telecom systems and protocols.

Technical Specifications

Other Function Telecom Interface ICs RF-HDT-AJLC-G0 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

RF-HDT-AJLC-G0 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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