Loading...

RF-HDT-SJLE-G1

Texas Instruments

RF-HDT-SJLE-G1 by Texas Instruments

RF-HDT-SJLE-G1 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. Operating temperature range from -40°C to 85°C, making it suitable for various applications. Featuring a lead-free terminal form and uncased chip package style, ideal for telecom interface functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,531

-

-

-

-

Digiode

USA . 3,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,311

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 725 parts In-Stock

1+ parts

$12.326

100+ parts

$1,144.702

1k+ parts

$11.094

10k+ parts

-

725

$12.326

$1,144.702

$11.094

-

DigiPath Technology Company

USA . 2,115 parts In-Stock

1+ parts

$13.573

100+ parts

$12.487

1k+ parts

-

10k+ parts

-

2,115

$13.573

$12.487

-

-

ChromeModa Solutions

Germany . 4,629 parts In-Stock

1+ parts

$13.850

100+ parts

$11.357

1k+ parts

-

10k+ parts

-

4,629

$13.850

$11.357

-

-

IDEA Electronic Components Group

UK . 505 parts In-Stock

1+ parts

$13.850

100+ parts

$13.158

1k+ parts

$12.465

10k+ parts

-

505

$13.850

$13.158

$12.465

-

AZTECH Wire

Italy . 382 parts In-Stock

1+ parts

$15.478

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$15.478

-

-

-

One Stop Electronics

USA . 1,532 parts In-Stock

1+ parts

$473.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,532

$473.000

-

-

-

Corphita

USA . 3,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,383

-

-

-

-

Overview

Elevate your telecom interface systems with the RF-HDT-SJLE-G1 by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers unmatched performance in the field of Other Function Telecom Interface ICs. This surface mount chip offers industrial-grade reliability with a wide temperature range, making it ideal for various telecommunications applications. Experience seamless connectivity and enhanced efficiency with this advanced telecom circuit, providing value and benefits that exceed customer expectations. Upgrade your systems today with the RF-HDT-SJLE-G1 and stay ahead in the fast-paced world of communication technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production and integration into various telecom devices.

Package Style (Meter): UNCASED CHIP

The unencased chip package style provides compact and space-saving design, making it ideal for applications where size and weight are critical factors.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding thermal conditions, ensuring reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in extreme cold environments without compromising functionality.

Terminal Position: UPPER

Having terminals positioned at the top makes it easier for PCB layout and connection, enhancing the overall ease of integration.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures that this product can operate in harsh industrial environments without performance degradation.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and offers better electrical performance, making it a more environmentally friendly and reliable choice.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type offers optimized functionality and performance for telecommunications systems, making it a perfect fit for telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs RF-HDT-SJLE-G1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 12