Loading...

RF-HDT-SJLC-G0

Texas Instruments

RF-HDT-SJLC-G0 by Texas Instruments

RF-HDT-SJLC-G0 by Texas Instruments is an industrial-grade telecom circuit IC with surface mount capability. It operates b/w -40°C to 85°C, making it suitable for various temperature environments. With a terminal position of upper and no-lead terminal form, it is ideal for telecom interface applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,691

-

-

-

-

Digiode

USA . 4,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,171

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,355 parts In-Stock

1+ parts

$6.695

100+ parts

-

1k+ parts

$7.388

10k+ parts

-

1,355

$6.695

-

$7.388

-

DigiPath Technology Company

USA . 1,870 parts In-Stock

1+ parts

$7.372

100+ parts

-

1k+ parts

-

10k+ parts

-

1,870

$7.372

-

-

-

ChromeModa Solutions

Germany . 4,877 parts In-Stock

1+ parts

$7.522

100+ parts

$6.168

1k+ parts

-

10k+ parts

-

4,877

$7.522

$6.168

-

-

IDEA Electronic Components Group

UK . 527 parts In-Stock

1+ parts

$7.522

100+ parts

-

1k+ parts

$6.770

10k+ parts

-

527

$7.522

-

$6.770

-

AZTECH Wire

Italy . 706 parts In-Stock

1+ parts

$12.562

100+ parts

-

1k+ parts

-

10k+ parts

-

706

$12.562

-

-

-

One Stop Electronics

USA . 963 parts In-Stock

1+ parts

$410.000

100+ parts

-

1k+ parts

-

10k+ parts

-

963

$410.000

-

-

-

Corphita

USA . 4,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,421

-

-

-

-

Overview

Elevate your communication systems with the RF-HDT-SJLC-G0 by Texas Instruments. With a reputation for excellence in manufacturing, this telecom interface IC offers unparalleled quality and reliability. Whether you're looking to enhance your telecommunication devices or improve connectivity in industrial settings, this product delivers exceptional performance. Experience seamless integration, durability, and efficiency with the RF-HDT-SJLC-G0, setting a new standard in telecom circuit technology. Upgrade your systems today and see the difference for yourself.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and secure placement on circuit boards, saving space and reducing assembly time.

Package Style (Meter): UNCASED CHIP

The unencased chip package style is compact and cost-effective, making it suitable for applications where space is limited.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, ensuring reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows for functionality in both extreme hot and cold conditions, making it versatile for various applications.

Terminal Position: UPPER

The terminal position being upper makes it easier for connections and reduces the risk of interference with other components on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments with fluctuating temperature levels.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and is environmentally friendly, making it compliant with RoHS regulations.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and compatibility for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs RF-HDT-SJLC-G0 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 12