Loading...

TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
STA2500DCTR by STMicroelectronics

STA2500DCTR

STMicroelectronics

STA2500DCTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates at a nominal voltage of 2.75V, with a temperature range from -40 °C to 85 °C. This compact 48-terminal device features a square grid array package for efficient surface mounting.

S-PBGA-B48

6 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

NOT SPECIFIED

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

6 mm

STA2500DC by STMicroelectronics

STA2500DC

STMicroelectronics

STA2500DC by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates within -40 °C to 85 °C, features a compact 6mm x 6mm grid array package, and requires a nominal voltage of 2.75V. Ideal for reliable telecom solutions, it supports surface mount technology with 48 terminals.

S-PBGA-B48

6 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

NOT SPECIFIED

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

6 mm

STA2500DTR by STMicroelectronics

STA2500DTR

STMicroelectronics

STA2500DTR by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 48-terminal grid array with a nominal voltage of 2.75V and peak reflow temp of 260 °C. Ideal for reliable performance in demanding environments.

S-PBGA-B48

e1

6 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

260

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

6 mm

STA2500D by STMicroelectronics

STA2500D

STMicroelectronics

STA2500D by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 48-terminal grid array with a nominal voltage of 2.75V and supports surface mount technology. Ideal for robust telecom systems, it ensures reliable performance in demanding environments.

S-PBGA-B48

e1

6 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

260

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

6 mm

TLK1521IPAPG4 by Texas Instruments

TLK1521IPAPG4

Texas Instruments

TLK1521IPAPG4 by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and peak reflow temperature of 260°C. Ideal for telecom circuits, it features a quad terminal position in a square package style.

S-PQFP-G64

e4

10 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1.2 mm

Other Telecom ICs

2.5 V

YES

TTL

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

10 mm

TLK2521IPAPG4 by Texas Instruments

TLK2521IPAPG4

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE;

S-PQFP-G64

e4

10 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1.2 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

10 mm

UCC3750DWTRG4 by Texas Instruments

UCC3750DWTRG4

Texas Instruments

UCC3750DWTRG4 by Texas Instruments is a BICMOS technology Telecom IC with 28 terminals in a small outline package. It operates b/w 0-70°C, has a nominal voltage of 5V, and can withstand peak reflow temperature of 260°C. Ideal for telecom circuit applications due to its dual terminal position and gull wing form factor.

R-PDSO-G28

e4

17.9 mm

2

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

2.65 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

30

7.5 mm

ATA8402C-6AQY-66 by Microchip Technology

ATA8402C-6AQY-66

Microchip Technology

ATA8402C-6AQY-66 by Microchip Technology is a telecom interface IC with 8 terminals, operating at 3V. It has a small outline package style and operates in industrial temperature range (-40 to 85 °C). Ideal for telecom circuits, it features matte tin terminal finish and low supply current of 0.0116 mA.

S-PDSO-G8

e3

3 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP8,.19

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3

Not Qualified

1.05 mm

Other Telecom ICs

.0116 mA

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

3 mm

NEO-M8U-0-10 by U-blox Ag

NEO-M8U-0-10

U-blox Ag

NEO-M8U-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its compact MICROELECTRONIC ASSEMBLY package makes it ideal for industrial applications requiring a 3V supply voltage. AEC-Q100 and TS 16949 screening ensure high reliability in automotive and telecom systems.

R-XDMA-N24

16 mm

4

1

24

85 Cel

-40 Cel

UNSPECIFIED

DMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

AEC-Q100; TS 16949

2.6 mm

3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

NOT SPECIFIED

12.2 mm

AX5031-1-TW30 by Onsemi

AX5031-1-TW30

Onsemi

AX5031-1-TW30 by Onsemi is a CMOS telecom IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a peak reflow temperature of 260°C. Ideal for industrial applications requiring a 3V supply voltage and very thin profile design.

S-XQCC-N20

e3

4 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

AX-SFEU-API-1-01-TB05 by Onsemi

AX-SFEU-API-1-01-TB05

Onsemi

AX-SFEU-API-1-01-TB05 by Onsemi is a Telecom Interface IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. Features Ni/Pd/Au terminal finish, 3V supply voltage, and 0.5mm terminal pitch for telecom circuit applications.

R-PQCC-N40

e4

7 mm

1

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.27,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

PN5180A0ET/C1QL by NXP Semiconductors

PN5180A0ET/C1QL

NXP Semiconductors

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;

e1

1

260

TELECOM CIRCUIT

TIN SILVER COPPER

30

PN5180A0ET/C2QL by NXP Semiconductors

PN5180A0ET/C2QL

NXP Semiconductors

TELECOM CIRCUIT; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;

e1

1

260

TELECOM CIRCUIT

TIN SILVER COPPER

30

ADRV9009BBCZ-REEL by Analog Devices

ADRV9009BBCZ-REEL

Analog Devices

ADRV9009BBCZ-REEL by Analog Devices is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

12 mm

MWCT1012VLF by NXP Semiconductors

MWCT1012VLF

NXP Semiconductors

TELECOM CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

e3

3

260

TELECOM CIRCUIT

TIN

40

ODIN-W260-05B by U-blox Ag

ODIN-W260-05B

U-blox Ag

ODIN-W260-05B by U-blox Ag is a surface mount telecom IC with 52 terminals, operating at -40 to 85°C. With a compact size of 14.8mm x 22.3mm and terminal pitch of 1.2mm, it's ideal for industrial applications requiring a nominal voltage of 3.3V.

R-XQMA-N52

22.3 mm

1

52

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

QUAD

14.8 mm

NINA-B311-00B by U-blox Ag

NINA-B311-00B

U-blox Ag

TELECOM CIRCUIT;

TELECOM CIRCUIT

451-00001C by Laird Technologies

451-00001C

Laird Technologies

Laird Technologies' 451-00001C is a surface mount telecom IC with 71 terminals. Operating temp range: -40 to 85°C. Features include data rate of 2 Mbps, nominal voltage of 3.3 V, and compact rectangular package suitable for telecom circuit applications.

2 Mbps

R-XXMA-N71

15 mm

1

71

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.35 mm

3.3 V

YES

TELECOM CIRCUIT

NO LEAD

UNSPECIFIED

NOT SPECIFIED

10 mm

451-00002C by Laird Technologies

451-00002C

Laird Technologies

Laird Technologies 451-00002C is a surface mount telecom IC with 71 terminals. It operates at temperatures ranging from -40 to 85°C and has a seated height of 2.35mm. With a data rate of 2 Mbps, it is suitable for various telecom circuit applications.

2 Mbps

R-XXMA-N71

15 mm

1

71

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.35 mm

3.3 V

YES

TELECOM CIRCUIT

NO LEAD

UNSPECIFIED

NOT SPECIFIED

10 mm

ADRV9008BBCZ-1REEL by Analog Devices

ADRV9008BBCZ-1REEL

Analog Devices

Analog Devices ADRV9008BBCZ-1REEL is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuit applications requiring fine pitch and bottom terminal position.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-2REEL by Analog Devices

ADRV9008BBCZ-2REEL

Analog Devices

Analog Devices ADRV9008BBCZ-2REEL is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

VSC8484YJP by Microchip Technology

VSC8484YJP

Microchip Technology

VSC8484YJP by Microchip Technology is a telecom IC with 324 terminals in a square grid array package. It operates b/w -40°C to 105°C, suitable for industrial use. With a nominal voltage of 1.2V, it is designed for telecom circuit applications.

S-PBGA-B324

18.6 mm

1

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.74 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

1 mm

BOTTOM

18.6 mm

ADF5902WCCPZ-RL7 by Analog Devices

ADF5902WCCPZ-RL7

Analog Devices

ADF5902WCCPZ-RL7 by Analog Devices is a telecom IC with 32 terminals, operating at -40 to 105 °C. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm. This chip carrier package with very thin profile is ideal for industrial applications requiring high temperature tolerance.

S-XQCC-N32

5 mm

3

1

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

FIDO5100CBCZ by Analog Devices

FIDO5100CBCZ

Analog Devices

FIDO5100CBCZ by Analog Devices is a telecom IC with 144 terminals in a square grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With a low profile of 1.24mm and CMOS technology, it has a nominal voltage of 1.2V for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5200CBCZ by Analog Devices

FIDO5200CBCZ

Analog Devices

FIDO5200CBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With CMOS technology and a nominal voltage of 1.2V, it is ideal for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

450-0106C by Laird Technologies

450-0106C

Laird Technologies

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

NOT SPECIFIED

TELECOM CIRCUIT

NOT SPECIFIED

ADS58J64IRRHT by Texas Instruments

ADS58J64IRRHT

Texas Instruments

Texas Instruments ADS58J64IRRHT is a 72-terminal telecom IC with max analog input of 2V. Operating b/w -40 to 85°C, it's ideal for industrial applications requiring a nominal voltage of 1.15V. This surface-mount chip carrier supports quad terminal position and nickel palladium gold finish.

2 V

R-XQCC-N72

e4

3

1

72

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

260

1.15 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

QUAD

30

RN4678APL-V/RM113 by Microchip Technology

RN4678APL-V/RM113

Microchip Technology

RN4678APL-V/RM113 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20 to 70°C. It has a compact rectangular package measuring 12mm in width and 22mm in length, suitable for surface mount applications. With a nominal voltage of 1.9V, it is ideal for commercial temperature grade telecom circuit designs.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

BM78SPPS5MC2-0004AA by Microchip Technology

BM78SPPS5MC2-0004AA

Microchip Technology

BM78SPPS5MC2-0004AA by Microchip Technology is a surface mount telecom interface IC with 1 function and 33 terminals. It operates at temperatures ranging from -20 to 70 °C and has a nominal voltage of 1.9 V. This IC is commonly used in telecom circuits for various applications.

R-XXMA-N33

e4

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

255

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

GOLD OVER NICKEL

NO LEAD

1.1 mm

UNSPECIFIED

40

12 mm

EFR32BG13P532F512GM32-D by Silicon Labs

EFR32BG13P532F512GM32-D

Silicon Labs

EFR32BG13P532F512GM32-D by Silicon Labs is a telecom IC with 32 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and MSL level of 3, suitable for industrial applications requiring a compact chip carrier package with no lead terminals.

S-XQCC-N32

5 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

5 mm

EFR32BG13P632F512GM32-D by Silicon Labs

EFR32BG13P632F512GM32-D

Silicon Labs

EFR32BG13P632F512GM32-D by Silicon Labs is a Telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and package style of CHIP CARRIER. Ideal for telecom applications due to its industrial temperature grade and no-lead terminal form.

S-XQCC-N32

5 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

5 mm

MGM210P032JIA2 by Silicon Labs

MGM210P032JIA2

Silicon Labs

TELECOM CIRCUIT;

TELECOM CIRCUIT

SA636DK/02J by NXP Semiconductors

SA636DK/02J

NXP Semiconductors

SA636DK/02J by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold terminal finish, 3V supply voltage, and peak reflow temperature of 260°C.

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

SSOP20,.25

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

WF111-E-V1-ETSI by Silicon Labs

WF111-E-V1-ETSI

Silicon Labs

TELECOM CIRCUIT;

TELECOM CIRCUIT

FIDO5110BBCZ by Analog Devices

FIDO5110BBCZ

Analog Devices

FIDO5110BBCZ by Analog Devices is a Telecom Circuit IC with 144 terminals in a low profile, fine pitch grid array package. Operating temperature range from -40 to 85 °C makes it suitable for industrial applications. It operates at a nominal voltage of 1.2V and utilizes CMOS technology for efficient performance.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5110CBCZ by Analog Devices

FIDO5110CBCZ

Analog Devices

FIDO5110CBCZ by Analog Devices is a telecom IC with 144 terminals in a square grid array package. Operating temperature ranges from -40 to 105 °C, suitable for industrial use. It features CMOS technology, 1.2V supply voltage, and 0.8mm terminal pitch, ideal for telecom circuit applications.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5210BBCZ by Analog Devices

FIDO5210BBCZ

Analog Devices

FIDO5210BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With a nominal voltage of 1.2V and CMOS technology, it's ideal for telecom circuit interfaces.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5210CBCZ by Analog Devices

FIDO5210CBCZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

MFRC52302HN1,157 by NXP Semiconductors

MFRC52302HN1,157

NXP Semiconductors

TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;

e4

1

260

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

30

RN4020BCN-V/RM120 by Microchip Technology

RN4020BCN-V/RM120

Microchip Technology

RN4020BCN-V/RM120 by Microchip Technology is a telecom IC with 24 terminals, operating at -30 to 85°C. It has a data rate of 1 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for telecom circuit applications due to its TS16949 screening level and compact rectangular package design.

1 Mbps

R-XXMA-N24

e4

19.5 mm

1

24

85 Cel

-30 Cel

UNSPECIFIED

XMA

MODULE,24LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.38 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

GOLD OVER NICKEL

NO LEAD

1.2 mm

UNSPECIFIED

11.5 mm

RN4678APL-V/RM120 by Microchip Technology

RN4678APL-V/RM120

Microchip Technology

RN4678APL-V/RM120 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20 to 70°C. It has a supply voltage of 1.9V and terminal pitch of 1.1mm. This surface-mount rectangular package is ideal for telecom circuit applications due to its compact size and commercial temperature grade suitability.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

AD9082BBPZ-4D2AC by Analog Devices

AD9082BBPZ-4D2AC

Analog Devices

AD9082BBPZ-4D2AC by Analog Devices is a telecom IC with 324 terminals in a grid array package. It operates b/w -40 to 85 °C, with a peak reflow temperature of 260°C. Ideal for telecom circuits, it has a nominal voltage of 1V and terminal pitch of 0.8mm.

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

S-PBGA-B324

15 mm

3

1

324

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.72 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

15 mm

AD9082BBPZRL-4D2AC by Analog Devices

AD9082BBPZRL-4D2AC

Analog Devices

AD9082BBPZRL-4D2AC by Analog Devices is a telecom IC with 324 terminals, operating temperature range of -40 to 85 °C. It features a grid array package style, ball terminal form, and nominal voltage of 1V. Ideal for telecom circuits, this IC is designed for industrial applications requiring fine pitch surface mount technology.

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

S-PBGA-B324

15 mm

3

1

324

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.72 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

15 mm

PN7150B0HN/C11004E by NXP Semiconductors

PN7150B0HN/C11004E

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N40

6 mm

1

40

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

2.75 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

6 mm

PN7150B0HN/C11004Y by NXP Semiconductors

PN7150B0HN/C11004Y

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N40

6 mm

1

40

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

2.75 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

6 mm

ESP32-WROVER-B(M213DH6464PH3Q0) by Espressif Systems (Shanghai)

ESP32-WROVER-B(M213DH6464PH3Q0)

Espressif Systems (Shanghai)

ESP32-WROVER-B by Espressif Systems is a telecom IC with 39 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm. Ideal for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages with surface mount capability.

R-XXMA-N39

31.4 mm

1

39

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

3.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.27 mm

UNSPECIFIED

NOT SPECIFIED

18 mm

AX5051-1-TA05 by Onsemi

AX5051-1-TA05

Onsemi

TELECOM CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;

e4

1

260

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

30

BM71BLES1FC2-0B05BA by Microchip Technology

BM71BLES1FC2-0B05BA

Microchip Technology

BM71BLES1FC2-0B05BA by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates at temperatures ranging from -40 to 85 °C and has a max seated height of 2.1 mm. With a data rate of 0.0086 Mbps, it is suitable for various telecom circuit applications.

.0086 Mbps

R-XXMA-X16

11.5 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.1 mm

3 V

YES

TELECOM CIRCUIT

NO LEAD

UNSPECIFIED

9 mm