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TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
RN4678APL-V/RM122 by Microchip Technology

RN4678APL-V/RM122

Microchip Technology

RN4678APL-V/RM122 by Microchip Tech is a surface mount IC with 33 terminals, operating temp range of -20 to 70°C. Telecom circuit type with nominal voltage of 1.9V. Ideal for telecom interfaces due to its compact rectangular package style and no-lead terminal form.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

RN4678-V/RM122 by Microchip Technology

RN4678-V/RM122

Microchip Technology

RN4678-V/RM122 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20°C to 70°C. It has a supply voltage of 1.9V and compact dimensions of 12mm width, 22mm length, and 2.46mm height. Ideal for surface mount applications in telecom circuits due to its no-lead terminal form and rectangular package style.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

BGS13SL9E6327XTSA1 by Infineon Technologies

BGS13SL9E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 9; Package Code: BCC; Package Shape: SQUARE;

S-XBCC-B9

1.15 mm

1

9

85 Cel

-30 Cel

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

.32 mm

3 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

1.15 mm

AD6674BCPZ-1000 by Analog Devices

AD6674BCPZ-1000

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZ-500 by Analog Devices

AD6674BCPZ-500

Analog Devices

AD6674BCPZ-500 by Analog Devices is a 64-terminal telecom IC with a square shape and 0.5mm terminal pitch. Operating b/w -40 to 85°C, it has a nominal voltage of 1.25V and matte tin finish. Ideal for industrial applications requiring very thin profile package style and no lead terminal form.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZ-750 by Analog Devices

AD6674BCPZ-750

Analog Devices

AD6674BCPZ-750 by Analog Devices is a 64-terminal telecom IC with a nominal voltage of 1.25V. It operates in industrial temperature range (-40 to 85 °C) and features matte tin terminal finish. This square-shaped chip carrier is suitable for telecom circuit applications requiring surface mount technology.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZRL7-1000 by Analog Devices

AD6674BCPZRL7-1000

Analog Devices

AD6674BCPZRL7-1000 by Analog Devices is a 64-terminal telecom IC with a square package shape and matte tin finish. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 1.25V, it is ideal for telecom circuit applications requiring a very thin profile design.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZRL7-500 by Analog Devices

AD6674BCPZRL7-500

Analog Devices

AD6674BCPZRL7-500 by Analog Devices is a 64-terminal telecom IC with a square package style. It operates b/w -40 to 85 °C, suitable for industrial applications. With a nominal voltage of 1.25V, it is designed for telecom circuit interfaces in compact spaces.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

AD6674BCPZRL7-750 by Analog Devices

AD6674BCPZRL7-750

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

9 mm

WL1807MODGIMOCT by Texas Instruments

WL1807MODGIMOCT

Texas Instruments

WL1807MODGIMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -40 to 85°C, it has a nominal voltage of 3.7V and supports data rates up to 100 Mbps. Ideal for industrial applications requiring high-speed telecommunications functionality.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

XWL1837MODGIMOC by Texas Instruments

XWL1837MODGIMOC

Texas Instruments

XWL1837MODGIMOC by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates b/w -40°C to 85°C, with a supply voltage of 3.7V. Ideal for telecom circuit applications due to its compact rectangular shape and surface-mount compatibility.

R-PBGA-N100

13.4 mm

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

3.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.7 mm

BOTTOM

13.3 mm

NCV7428MW3R2G by Onsemi

NCV7428MW3R2G

Onsemi

NCV7428MW3R2G by Onsemi is an 8-terminal telecom interface IC with a small outline, heat sink package. It operates b/w -40 to 125 °C and has a nominal voltage of 12V. Ideal for automotive applications requiring a compact, surface-mount solution with dual terminal position.

S-PDSO-N8

e3

3 mm

1

1

8

125 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

12 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

MATTE TIN

NO LEAD

.65 mm

DUAL

30

3 mm

STA020DJTR by STMicroelectronics

STA020DJTR

STMicroelectronics

STA020DJTR by STMicroelectronics is a telecom interface IC designed for commercial applications. It features a 3.3V nominal voltage, operates b/w 0 °C to 70 °C, and has a compact 24-terminal gull-wing package. Ideal for surface mount technology in telecom devices.

R-PDSO-G24

e4

15.4 mm

3

1

24

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

2.65 mm

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

7.5 mm

STA8088G by STMicroelectronics

STA8088G

STMicroelectronics

STA8088G by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a max operating temp of 85 °C and a min of -40 °C. It has a compact 7x7 mm size with 56 terminals and operates at a nominal voltage of 1.2V. Ideal for automotive and telecom systems, it meets AEC-Q100 standards.

S-XQCC-N56

7 mm

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

QUAD

7 mm

450-0064R by Ls Research

450-0064R

Ls Research

LS Research's 450-0064R is a telecom IC with 52 terminals, operating b/w -40 to 85°C. Its compact rectangular package measures 13x18mm, with a low seated height of 1.9mm. Ideal for industrial applications requiring a 3.6V supply voltage and surface mount compatibility.

R-XQMA-N52

18 mm

4

1

52

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1 mm

QUAD

13 mm

450-0064 by Ls Research

450-0064

Ls Research

LS Research 450-0064 is a telecom IC with 52 terminals in a rectangular microelectronic assembly. Operating at -40 to 85°C, it has a nominal voltage of 3.6V and terminal pitch of 1mm. Ideal for telecom interface applications due to its industrial temperature grade and no lead terminal form.

R-XQMA-N52

18 mm

4

1

52

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1 mm

QUAD

13 mm

ADN2882A-DF by Analog Devices

ADN2882A-DF

Analog Devices

ADN2882A-DF by Analog Devices is a telecom IC with 17 terminals, operating temp. range of -40 to 95 °C, and supply voltage of 3.3V. It's used in industrial applications for telecom circuits requiring surface mount rectangular package style.

R-XUUC-N17

1.2 mm

1

17

95 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

.25 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

.7 mm

LNBH26LSPQR by STMicroelectronics

LNBH26LSPQR

STMicroelectronics

STMicroelectronics LNBH26LSPQR is a 24-terminal telecom IC with 12V supply voltage. It features a square chip carrier package, 1mm seated height, and 0.5mm terminal pitch. Ideal for telecom circuits, this IC is surface mountable and has a quad terminal position for compact applications.

S-XQCC-N24

4 mm

1

1

24

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

12 V

YES

TELECOM CIRCUIT

NO LEAD

.5 mm

QUAD

4 mm

BGU8004X by NXP Semiconductors

BGU8004X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

.65 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.32 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.22 mm

BOTTOM

.44 mm

BGU8004Z by NXP Semiconductors

BGU8004Z

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

.65 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.32 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.22 mm

BOTTOM

.44 mm

BGX7221HN/1,518 by NXP Semiconductors

BGX7221HN/1,518

NXP Semiconductors

TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE; No. of Functions: 1;

S-PQCC-N36

6 mm

3

1

36

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

TELECOM CIRCUIT

NO LEAD

.5 mm

QUAD

6 mm

OL2300NHN/F,118 by NXP Semiconductors

OL2300NHN/F,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N16

e4

3 mm

1

1

16

85 Cel

-25 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.12SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.7

Not Qualified

1 mm

Other Telecom ICs

19 mA

2.7 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

OL2311AHN/C0B,515 by NXP Semiconductors

OL2311AHN/C0B,515

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

2A

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.7

Not Qualified

.85 mm

Other Telecom ICs

21.5 mA

2.7 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

5 mm

OL2381AHN/C0B,515 by NXP Semiconductors

OL2381AHN/C0B,515

NXP Semiconductors

OL2381AHN/C0B,515 by NXP Semiconductors is a telecom interface IC with 32 terminals in a square chip carrier package. Operating at 2.7V, it has a temperature range of -25 to 85°C and low supply current of 0.0012mA. Ideal for telecom circuits, this IC is surface mountable and features a very thin profile for compact applications.

S-PQCC-N32

5 mm

2A

1

32

85 Cel

-25 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.7

Not Qualified

.85 mm

Other Telecom ICs

.0012 mA

2.7 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

5 mm

SA616BS,115 by NXP Semiconductors

SA616BS,115

NXP Semiconductors

SA616BS,115 by NXP Semiconductors is a Telecom Interface IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Nominal voltage of 3V and terminal pitch of 0.5mm make it ideal for telecom circuits.

S-PQCC-N20

4 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

4 mm

SA636BS,115 by NXP Semiconductors

SA636BS,115

NXP Semiconductors

SA636BS,115 by NXP Semiconductors is a telecom interface IC with 1 function. It has a package style of CHIP CARRIER and a very thin profile. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications.

S-PQCC-N20

4 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

4 mm

SL2S1502FTBX by NXP Semiconductors

SL2S1502FTBX

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;

R-PDSO-N3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

260

.5 mm

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.55 mm

DUAL

1 mm

SL2S2002FUD,003 by NXP Semiconductors

SL2S2002FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S2102FTB,115 by NXP Semiconductors

SL2S2102FTB,115

NXP Semiconductors

SL2S2102FTB,115 by NXP Semiconductors is a telecom interface IC with 3 terminals. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. This CMOS technology IC is ideal for industrial telecom circuits due to its small outline and thin profile package style.

R-PDSO-N3

e3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

260

.5 mm

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.55 mm

DUAL

30

1 mm

SL2S2102FUD,003 by NXP Semiconductors

SL2S2102FUD,003

NXP Semiconductors

SL2S2102FUD,003 by NXP Semiconductors is a CMOS telecom IC with 4 terminals. It operates in industrial temperature range (-40 to 85°C) and is surface mountable. Ideal for telecom circuit applications due to its uncased chip package style.

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5002FUD,003 by NXP Semiconductors

SL2S5002FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5102FUD,003 by NXP Semiconductors

SL2S5102FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;

X-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5302FUD,003 by NXP Semiconductors

SL2S5302FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL2S5402FUD,003 by NXP Semiconductors

SL2S5402FUD,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

NOT SPECIFIED

SL3S1001FTT,118 by NXP Semiconductors

SL3S1001FTT,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G8

e4

3 mm

1

1

8

80 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

1.1 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

3 mm

SL3S1003FTB0,115 by NXP Semiconductors

SL3S1003FTB0,115

NXP Semiconductors

NXP Semiconductors' SL3S1003FTB0,115 is a Telecom Interface IC with 6 terminals. It operates in temperatures ranging from -40 to 85°C and features CMOS technology. This small outline IC is ideal for telecom circuit applications due to its thin profile and no-lead terminal form.

R-PDSO-N6

1.45 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

DUAL

1 mm

SL3S1202FTB1,115 by NXP Semiconductors

SL3S1202FTB1,115

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;

R-PBCC-B3

e3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

BCC

LCC3(UNSPEC)

RECTANGULAR

CHIP CARRIER

260

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

BUTT

.55 mm

BOTTOM

30

1 mm

SL3S1202FTT,118 by NXP Semiconductors

SL3S1202FTT,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G8

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP8,.19

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

Not Qualified

1.1 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

30

3 mm

SL3S1203FUF,003 by NXP Semiconductors

SL3S1203FUF,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

1.8

Not Qualified

Other Telecom ICs

.265 mA

1.8 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

SL3S1213FTB0,115 by NXP Semiconductors

SL3S1213FTB0,115

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

R-PDSO-N6

e3

1.45 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

SOLCC6,.04,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

260

1.8

Not Qualified

.5 mm

Other Telecom ICs

.265 mA

1.8 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

DUAL

30

1 mm

SL3S1213FUF,003 by NXP Semiconductors

SL3S1213FUF,003

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N4

1

4

85 Cel

-40 Cel

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

1.8

Not Qualified

Other Telecom ICs

.265 mA

1.8 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UPPER

TFF1007HN/N1,115 by NXP Semiconductors

TFF1007HN/N1,115

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF1007HN/N1,118 by NXP Semiconductors

TFF1007HN/N1,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11086HN/N1,111 by NXP Semiconductors

TFF11086HN/N1,111

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11086HN/N1X by NXP Semiconductors

TFF11086HN/N1X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11092HN/N1X by NXP Semiconductors

TFF11092HN/N1X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

e4

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TFF11092HN/N1 by NXP Semiconductors

TFF11092HN/N1

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm

TFF11101HN/N1,118 by NXP Semiconductors

TFF11101HN/N1,118

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N24

4 mm

1

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

4 mm