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BM78SPP05MC2-0002AA

Microchip Technology

BM78SPP05MC2-0002AA by Microchip Technology

BM78SPP05MC2-0002AA by Microchip Technology is a telecom IC with 30 terminals, operating b/w -20 to 70°C. It has a supply voltage of 1.9V and peak reflow temperature of 255°C. This rectangular package is ideal for telecom circuit applications due to its gold over nickel terminal finish and no-lead terminal form.

Median Price

$10.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 179 parts In-Stock

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$10.080

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$9.230

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$9.220

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Microchip Technology

USA . 136 parts In-Stock

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$10.080

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$8.700

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136

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DigiKey

USA . 118 parts In-Stock

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$10.080

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$9.225

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118

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Nova Conductors

Japan . 800 parts In-Stock

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$9.460

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800

$9.460

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NAC Semi

USA . 272 parts In-Stock

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$10.850

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$9.840

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$9.000

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Vyrian

USA . 3,524 parts In-Stock

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VNN

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Ampacity Inc.

Singapore . 164 parts In-Stock

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$8.570

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Netroflash

USA . 2,000 parts In-Stock

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$9.460

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$8.987

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$8.798

2,000

$9.460

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$8.987

$8.798

Corohmni

South Africa . 533 parts In-Stock

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$10.017

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Aztec Data Supply Inc.

USA . 25,376 parts In-Stock

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AZTECH Wire

Italy . 779 parts In-Stock

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Lixinc

USA . 16,067 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 6,061 parts In-Stock

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Argo Parts USA

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RGB Technical Solutions

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Overview

Elevate your connectivity with the BM78SPP05MC2-0002AA by Microchip Technology. Designed with precision and reliability in mind, this telecom interface IC offers seamless integration for a wide range of applications. From its surface mount capability to its commercial temperature grade, this product is built to deliver exceptional performance in any setting. Unlock new possibilities and enhance your projects with the quality and value that only Microchip Technology can provide. Experience the difference with the BM78SPP05MC2-0002AA.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient PCB assembly, saving time and effort in production processes.

Package Shape: RECTANGULAR

The rectangular shape of the package offers a good balance between compact size and ease of handling.

No. of Terminals: 30

With a sufficient number of terminals, this IC can accommodate complex telecom interface requirements.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly style ensures precise placement and secure mounting on the PCB.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance even in demanding environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures functionality in a wide range of operating conditions.

Terminal Finish: GOLD OVER NICKEL

The gold over nickel terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Maximum Seated Height: 1.86 mm

The low profile design with a maximum seated height of 1.86 mm saves space and allows for compact device designs.

Width: 12 mm

The 12 mm width offers compatibility with standard PCB layouts and facilitates integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and component integrity during assembly.

Peak Reflow Temperature °C: 255

The high peak reflow temperature of 255°C enables reliable solder joints and robust mechanical connections.

Length: 15 mm

The 15 mm length provides a balanced form factor that fits well within space-constrained applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating conditions in commercial applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and eliminates the risk of lead contamination.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers optimized performance and functionality for telecom interfaces.

Nominal Supply Voltage: 1.9 V

The nominal supply voltage of 1.9 V is well-suited for telecom applications, providing stable power delivery for consistent operation.

Terminal Pitch: 1.1 mm

The tight terminal pitch of 1.1 mm allows for high-density mounting and efficient use of PCB space.

Technical Specifications

Other Function Telecom Interface ICs BM78SPP05MC2-0002AA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N30

JESD-609 Code:

e4

Length:

15 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,30LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

255

Maximum Seated Height:

1.86 mm

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

1.1 mm

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Trade Compliance

BM78SPP05MC2-0002AA Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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