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BM78SPP05MC2-0006AA

Microchip Technology

BM78SPP05MC2-0006AA by Microchip Technology

BM78SPP05MC2-0006AA by Microchip Technology is a rectangular telecom IC with 30 terminals. Operating b/w -20°C to 70°C, it has a nominal voltage of 1.9V. This surface-mount IC is ideal for telecom circuit applications due to its compact size and no-lead terminal form.

Median Price

$10.080

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 512 parts In-Stock

1+ parts

$10.080

100+ parts

$9.230

1k+ parts

$9.220

10k+ parts

-

512

$10.080

$9.230

$9.220

-

DigiKey

USA . 91 parts In-Stock

1+ parts

$10.080

100+ parts

$9.225

1k+ parts

-

10k+ parts

-

91

$10.080

$9.225

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Montano Global Distributors

Canada . 7,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,615

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-

-

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LMD Electronica

Estonia . 4,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,820

-

-

-

-

Ledger Components

France . 3,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,896

-

-

-

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LOOK Integrated Logistics

Peru . 2,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,909

-

-

-

-

NIA Electronics

USA . 2,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,633

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Overview

Upgrade your telecom devices with the BM78SPP05MC2-0006AA by Microchip Technology. Known for their high-quality products, Microchip Technology continues to lead the market in Other Function Telecom Interface ICs. With its compact rectangular design and 30 terminals, this product offers seamless integration and reliable performance. Whether you're looking to enhance connectivity in your IoT devices or streamline communication in your smart home appliances, the BM78SPP05MC2-0006AA delivers unparalleled value, benefits, and advantages to customers seeking cutting-edge solutions. Experience the difference with Microchip Technology today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this product suitable for high-volume manufacturing and compact designs.

Package Shape: RECTANGULAR

The rectangular package shape provides easy handling and placement on the circuit board, ensuring compatibility with standard mounting techniques.

No. of Terminals: 30

With a high number of terminals, this product offers flexibility in connection options for various telecommunication interfaces or functions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance even in demanding environments, ensuring product longevity and stability.

Nominal Supply Voltage: 1.9 V

The low nominal supply voltage contributes to energy efficiency and helps reduce power consumption, making this product a cost-effective choice for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs BM78SPP05MC2-0006AA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N30

Length:

15 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

1.8 mm

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

12 mm

Trade Compliance

BM78SPP05MC2-0006AA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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