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RI-TRP-WFOB-30

Texas Instruments

RI-TRP-WFOB-30 by Texas Instruments

RI-TRP-WFOB-30 by Texas Instruments is an industrial-grade telecom IC with a temperature range of -40 to 85°C. It features a special shape plastic/epoxy package and terminal finish of tin silver copper. Ideal for telecom circuits, this IC offers reliable performance in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

8,466

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-

-

-

Digiode

USA . 3,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,496

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,362 parts In-Stock

1+ parts

$6.545

100+ parts

-

1k+ parts

$7.286

10k+ parts

-

1,362

$6.545

-

$7.286

-

ChromeModa Solutions

Germany . 5,928 parts In-Stock

1+ parts

$7.354

100+ parts

$6.030

1k+ parts

-

10k+ parts

-

5,928

$7.354

$6.030

-

-

IDEA Electronic Components Group

UK . 1,267 parts In-Stock

1+ parts

$7.354

100+ parts

-

1k+ parts

$6.619

10k+ parts

-

1,267

$7.354

-

$6.619

-

AZTECH Wire

Italy . 408 parts In-Stock

1+ parts

$9.384

100+ parts

-

1k+ parts

-

10k+ parts

-

408

$9.384

-

-

-

One Stop Electronics

USA . 605 parts In-Stock

1+ parts

$866.000

100+ parts

-

1k+ parts

-

10k+ parts

-

605

$866.000

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-

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DigiPath Technology Company

USA . 2,375 parts In-Stock

1+ parts

-

100+ parts

$6.630

1k+ parts

-

10k+ parts

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2,375

-

$6.630

-

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Corphita

USA . 1,741 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,741

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Overview

Elevate your telecom projects to new heights with the RI-TRP-WFOB-30 by Texas Instruments. Designed with precision and reliability in mind, this telecom interface IC offers unmatched quality and performance. Whether you're working on telecommunications equipment or networking devices, this innovative product delivers exceptional value and benefits. Trust Texas Instruments, a leader in the industry, to provide you with the tools you need to succeed. Unlock the potential of your projects with the RI-TRP-WFOB-30 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ensuring long-term reliability in various operating conditions.

Package Style (Meter): SPECIAL SHAPE

The special shape of the package style allows for better integration and layout optimization in telecom interface applications, improving overall performance and functionality.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand higher temperature environments, making it suitable for industrial applications where heat resistance is critical.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures the product's functionality in cold environments, adding versatility to its use in various telecom interface setups.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission and durability in telecom interface circuits.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of the product indicates its robust performance and reliability in harsh industrial settings, making it a suitable choice for telecom interface IC applications that require high durability.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuit applications, this product offers optimized performance, compatibility, and functionality in telecom interface setups, ensuring seamless operation and communication capabilities.

Technical Specifications

Other Function Telecom Interface ICs RI-TRP-WFOB-30 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-PXSS-X

JESD-609 Code:

e1

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SPECIAL SHAPE

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

RI-TRP-WFOB-30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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