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LMH0318RTWR

Texas Instruments

LMH0318RTWR by Texas Instruments

Texas Instruments LMH0318RTWR is a 24-terminal telecom IC with data rate of 2970 Mbps. Operating temperature range from -40 to 85°C, suitable for industrial applications. Package style is chip carrier with matte tin finish, ideal for surface mount assembly.

Median Price

$20.584

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,018 parts In-Stock

1+ parts

$17.908

100+ parts

$9.680

1k+ parts

-

10k+ parts

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22,018

$17.908

$9.680

-

-

DigiKey

USA . 72 parts In-Stock

1+ parts

$23.260

100+ parts

$16.235

1k+ parts

$15.269

10k+ parts

$14.601

72

$23.260

$16.235

$15.269

$14.601

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,076 parts In-Stock

1+ parts

$17.013

100+ parts

-

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3,076

$17.013

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Vyrian

USA . 3,092 parts In-Stock

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-

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3,092

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Chip Stock

USA . 1,013 parts In-Stock

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1,013

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,688 parts In-Stock

1+ parts

$11.348

100+ parts

-

1k+ parts

$11.776

10k+ parts

-

1,688

$11.348

-

$11.776

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DigiPath Technology Company

USA . 1,716 parts In-Stock

1+ parts

$12.495

100+ parts

$11.495

1k+ parts

-

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1,716

$12.495

$11.495

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ChromeModa Solutions

Germany . 2,407 parts In-Stock

1+ parts

$12.750

100+ parts

$10.455

1k+ parts

-

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2,407

$12.750

$10.455

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IDEA Electronic Components Group

UK . 744 parts In-Stock

1+ parts

$12.750

100+ parts

$12.112

1k+ parts

$11.475

10k+ parts

-

744

$12.750

$12.112

$11.475

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Ampacity Inc.

Singapore . 11,626 parts In-Stock

1+ parts

$15.220

100+ parts

-

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11,626

$15.220

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Semicontronic

India . 11,587 parts In-Stock

1+ parts

$15.220

100+ parts

$14.840

1k+ parts

$14.763

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11,587

$15.220

$14.840

$14.763

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Corphita

USA . 4,382 parts In-Stock

1+ parts

$16.117

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4,382

$16.117

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Corohmni

South Africa . 317 parts In-Stock

1+ parts

$17.908

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317

$17.908

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Lixinc

USA . 18,713 parts In-Stock

1+ parts

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18,713

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Upgrade your telecom systems with the LMH0318RTWR by Texas Instruments. Trusted for its quality, this telecom interface IC offers unrivaled performance and reliability. With a wide range of applications in telecommunications, the LMH0318RTWR is a versatile choice for your projects. From its surface mount design to its industrial-grade temperature rating, this chip carrier package delivers exceptional value. Experience the benefits of seamless connectivity and high-speed data transfer with the LMH0318RTWR, setting new standards in telecom interface ICs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides a compact design, enabling more components to be packed closely together for higher density layouts.

No. of Terminals: 24

With a sufficient number of terminals, this product offers versatile connectivity options for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding operating conditions, ensuring reliable performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V indicates compatibility with standard power sources, making integration easier for designers.

Data Rate: 2970 Mbps

With a high data rate of 2970 Mbps, this product offers fast and efficient data transmission for telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs LMH0318RTWR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

2970 Mbps

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH0318RTWR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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