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LMH0024MAE

Texas Instruments

LMH0024MAE by Texas Instruments

LMH0024MAE by Texas Instruments is a BICMOS technology IC with 16 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and max current of 77mA, suitable for telecom interfaces in industrial applications. The package is small outline, surface mountable, with Gull Wing terminals.

Median Price

$14.900

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$11.920

1k+ parts

$10.670

10k+ parts

$10.040

8,000

-

$11.920

$10.670

$10.040

DigiKey

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$15.690

1k+ parts

-

10k+ parts

-

8,000

-

$15.690

-

-

Verical

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$14.900

1k+ parts

$13.338

10k+ parts

$12.550

8,000

-

$14.900

$13.338

$12.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,073 parts In-Stock

1+ parts

$12.588

100+ parts

-

1k+ parts

-

10k+ parts

-

5,073

$12.588

-

-

-

Vyrian

USA . 3,421 parts In-Stock

1+ parts

$13.250

100+ parts

-

1k+ parts

-

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3,421

$13.250

-

-

-

Anansix

USA . 153 parts In-Stock

1+ parts

-

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-

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153

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,786 parts In-Stock

1+ parts

$11.598

100+ parts

-

1k+ parts

$11.997

10k+ parts

-

1,786

$11.598

-

$11.997

-

Corphita

USA . 4,815 parts In-Stock

1+ parts

$11.925

100+ parts

-

1k+ parts

-

10k+ parts

-

4,815

$11.925

-

-

-

Vigor

Singapore . 8,000 parts In-Stock

1+ parts

$12.720

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

$12.720

-

-

-

DigiPath Technology Company

USA . 2,376 parts In-Stock

1+ parts

$12.771

100+ parts

-

1k+ parts

-

10k+ parts

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2,376

$12.771

-

-

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ChromeModa Solutions

Germany . 1,807 parts In-Stock

1+ parts

$13.032

100+ parts

$10.686

1k+ parts

-

10k+ parts

-

1,807

$13.032

$10.686

-

-

IDEA Electronic Components Group

UK . 34 parts In-Stock

1+ parts

$13.032

100+ parts

$12.380

1k+ parts

$11.729

10k+ parts

-

34

$13.032

$12.380

$11.729

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Component Stockers USA

USA . 7,107 parts In-Stock

1+ parts

$13.660

100+ parts

$12.850

1k+ parts

$11.620

10k+ parts

-

7,107

$13.660

$12.850

$11.620

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Microchip USA

USA . 2,813 parts In-Stock

1+ parts

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2,813

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Perfect Parts

USA . 448 parts In-Stock

1+ parts

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448

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Overview

Unlock the potential of your telecom interface systems with the LMH0024MAE by Texas Instruments. Known for its superior quality and reliability, Texas Instruments brings you a product that is sure to exceed your expectations. This versatile IC is perfect for a wide range of applications, offering unmatched value and benefits to customers looking for seamless integration and high-performance solutions. Trust in Texas Instruments to deliver cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the IC, ensuring reliable performance over time.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

Power Supplies (V): 3.3

Operating at a low voltage of 3.3V, this IC is suitable for use in various telecom applications where power efficiency is key.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: BICMOS

The BICMOS technology used in this IC combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Other Function Telecom Interface ICs LMH0024MAE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

77 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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