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TELECOM CIRCUIT Other Function Telecom Interface ICs 1,221

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
MGM12P22F1024GA-V4 by Silicon Labs

MGM12P22F1024GA-V4

Silicon Labs

Silicon Labs' MGM12P22F1024GA-V4 is a rectangular-shaped telecom IC with 1 Mbps data rate, operating from -40 to 85°C. It operates at 3.3V and measures 12.9mm in width and 17.8mm in length, suitable for telecom circuit applications.

1 Mbps

R-XXMA-X

17.8 mm

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

SPECIAL SHAPE

3.3 V

NO

TELECOM CIRCUIT

UNSPECIFIED

UNSPECIFIED

12.9 mm

MGM12P32F1024GA-V4R by Silicon Labs

MGM12P32F1024GA-V4R

Silicon Labs

Silicon Labs' MGM12P32F1024GA-V4R is a Telecom IC with 1 Mbps data rate, operating from -40 to 85°C. It has a nominal voltage of 3.3V and comes in a rectangular package measuring 12.9mm x 17.8mm. Ideal for telecom applications requiring specialized interface ICs.

1 Mbps

R-XXMA-X

17.8 mm

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

SPECIAL SHAPE

3.3 V

NO

TELECOM CIRCUIT

UNSPECIFIED

UNSPECIFIED

12.9 mm

MGM12P32F1024GA-V4 by Silicon Labs

MGM12P32F1024GA-V4

Silicon Labs

Silicon Labs' MGM12P32F1024GA-V4 is a TELECOM CIRCUIT IC with 3.3V supply voltage, 1 Mbps data rate, and operating temperatures from -40 to 85 °C. Its RECTANGULAR package shape makes it ideal for telecom interface applications.

1 Mbps

R-XXMA-X

17.8 mm

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

SPECIAL SHAPE

3.3 V

NO

TELECOM CIRCUIT

UNSPECIFIED

UNSPECIFIED

12.9 mm

MGM12P32F1024GE-V4R by Silicon Labs

MGM12P32F1024GE-V4R

Silicon Labs

Silicon Labs' MGM12P32F1024GE-V4R is a TELECOM CIRCUIT IC with 1 Mbps Data Rate and 3.3 V Nominal Voltage. Operating b/w -40 to 85 °C, it's ideal for telecom applications requiring high-speed data transmission in a compact RECTANGULAR package of 12.9 mm width and 17.8 mm length.

1 Mbps

R-XXMA-X

17.8 mm

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

SPECIAL SHAPE

3.3 V

NO

TELECOM CIRCUIT

UNSPECIFIED

UNSPECIFIED

12.9 mm

MGM12P32F1024GE-V4 by Silicon Labs

MGM12P32F1024GE-V4

Silicon Labs

Silicon Labs' MGM12P32F1024GE-V4 is a Telecom IC with 1 Mbps data rate, operating from -40 to 85°C. It has a rectangular package of 12.9mm width and 17.8mm length. Ideal for telecom circuit applications at a nominal voltage of 3.3V.

1 Mbps

R-XXMA-X

17.8 mm

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

SPECIAL SHAPE

3.3 V

NO

TELECOM CIRCUIT

UNSPECIFIED

UNSPECIFIED

12.9 mm

MWCT1013VLHSTR by NXP Semiconductors

MWCT1013VLHSTR

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G64

10 mm

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.6 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

QUAD

10 mm

MWCT1013VLHST by NXP Semiconductors

MWCT1013VLHST

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G64

10 mm

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.6 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

QUAD

10 mm

MWCT1R24ZVHT by NXP Semiconductors

MWCT1R24ZVHT

NXP Semiconductors

TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL GOLD; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40;

e4

3

260

TELECOM CIRCUIT

NICKEL GOLD

40

TEF6657HN/V102Y by NXP Semiconductors

TEF6657HN/V102Y

NXP Semiconductors

TELECOM CIRCUIT; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD;

e4

3

260

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

30

TEF6659HN/V102K by NXP Semiconductors

TEF6659HN/V102K

NXP Semiconductors

TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD;

e4

3

260

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

30

TEF6659HN/V102Y by NXP Semiconductors

TEF6659HN/V102Y

NXP Semiconductors

TELECOM CIRCUIT; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;

e4

3

260

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

30

MGM210P022JIA2 by Silicon Labs

MGM210P022JIA2

Silicon Labs

TELECOM CIRCUIT;

TELECOM CIRCUIT

EYSKDNZWB by Taiyo Yuden

EYSKDNZWB

Taiyo Yuden

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

NOT SPECIFIED

TELECOM CIRCUIT

NOT SPECIFIED

PN5120A0ET/C2,151 by NXP Semiconductors

PN5120A0ET/C2,151

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B64

5.5 mm

1

64

85 Cel

-30 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

AEC-Q100

1.15 mm

3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.65 mm

BOTTOM

5.5 mm

PT5010A0HN/C1,151 by NXP Semiconductors

PT5010A0HN/C1,151

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

32

85 Cel

-30 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

1 mm

3 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

5 mm

TEF6657HN/V101,518 by NXP Semiconductors

TEF6657HN/V101,518

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;

S-PQCC-N32

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER

AEC-Q100

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QUAD

AFE7700IABJ by Texas Instruments

AFE7700IABJ

Texas Instruments

AFE7700IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for industrial telecom circuits, it features fine pitch (0.8mm) ball terminals and moisture sensitivity level of MSL3.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

ADRV9026BBCZ-REEL by Analog Devices

ADRV9026BBCZ-REEL

Analog Devices

Analog Devices' ADRV9026BBCZ-REEL is a telecom IC with 4 functions, operating b/w -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and peak reflow temperature of 260°C.

ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE

S-PBGA-B289

e1

14 mm

3

4

289

110 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.46 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

14 mm

ADRV9026BBCZ by Analog Devices

ADRV9026BBCZ

Analog Devices

Analog Devices ADRV9026BBCZ is a telecom IC with 4 functions, operating at -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and terminal pitch of 0.8mm.

ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE

S-PBGA-B289

e1

14 mm

3

4

289

110 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.46 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

14 mm

ATSAMW25H18-MR210PB1952 by Microchip Technology

ATSAMW25H18-MR210PB1952

Microchip Technology

Microchip's ATSAMW25H18-MR210PB1952 is a telecom IC with 51 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm. This rectangular package is ideal for industrial applications requiring reliable telecom circuit interfaces in compact spaces.

R-XXMA-N51

33.864 mm

1

51

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.138 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

14.908 mm

ATSAMW25H18-MR210PB1954 by Microchip Technology

ATSAMW25H18-MR210PB1954

Microchip Technology

Microchip Technology's ATSAMW25H18-MR210PB1954 is a telecom IC with 51 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm, suitable for industrial applications requiring compact surface-mount telecom interface ICs.

R-XXMA-N51

33.864 mm

1

51

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.138 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

14.908 mm

ATSAMW25H18-MR210PB1961 by Microchip Technology

ATSAMW25H18-MR210PB1961

Microchip Technology

Microchip ATSAMW25H18-MR210PB1961 is a telecom IC with 51 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm. Ideal for industrial applications requiring compact surface-mount telecom interface ICs.

R-XXMA-N51

33.864 mm

1

51

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.138 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

14.908 mm

BM70BLE01FC2-0B04AA by Microchip Technology

BM70BLE01FC2-0B04AA

Microchip Technology

The Microchip Technology BM70BLE01FC2-0B04AA is a telecom IC with 30 terminals, operating temperature range of -40 to 85°C, and data rate of 0.0086 Mbps. It is designed for industrial applications requiring a nominal voltage of 3V, such as wireless communication systems.

.0086 Mbps

R-XXMA-N30

15 mm

1

30

85 Cel

-40 Cel

UNSPECIFIED

XMA

MODULE,30LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

.66 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

MRF24J40ME-I/RM by Microchip Technology

MRF24J40ME-I/RM

Microchip Technology

MRF24J40ME-I/RM by Microchip Technology is a telecom interface IC with 12 terminals and a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 3.3V. This IC is commonly used in telecom circuits for various applications.

R-XDMA-N12

33.02 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

3.48 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2.54 mm

DUAL

22.86 mm

MRF24J40MET-I/RM by Microchip Technology

MRF24J40MET-I/RM

Microchip Technology

MRF24J40MET-I/RM by Microchip: Telecom IC with 12 terminals, 3.3V supply voltage, and -40 to 85°C operating temp. Ideal for industrial telecom applications due to TS 16949 screening level and no-lead terminal form. Compact rectangular package style with dual terminal position.

R-XDMA-N12

33.02 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

3.48 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2.54 mm

DUAL

22.86 mm

MRF24WN0MA-I/RM100 by Microchip Technology

MRF24WN0MA-I/RM100

Microchip Technology

Microchip Technology's MRF24WN0MA-I/RM100 is a telecom IC with 37 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable. Ideal for industrial applications requiring reliable telecom circuit interfaces.

R-XXMA-N37

26.67 mm

1

37

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.286 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UNSPECIFIED

17.78 mm

RN4677-V/RM100 by Microchip Technology

RN4677-V/RM100

Microchip Technology

RN4677-V/RM100 by Microchip Tech is a telecom IC with 33 terminals, operating at -20 to 70°C. It has a data rate of 0.4 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for telecom applications requiring high-speed data transmission in commercial temperature grades.

.4 Mbps

R-XXMA-N33

e4

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.46 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

GOLD OVER NICKEL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

RN4677-V/RM112 by Microchip Technology

RN4677-V/RM112

Microchip Technology

RN4677-V/RM112 by Microchip Technology is a telecom IC with 33 terminals, operating at -20 to 70°C. It has a data rate of 0.4 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for telecom applications requiring high-speed data transmission in commercial temperature environments.

.4 Mbps

R-XXMA-N33

e4

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.46 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

GOLD OVER NICKEL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

RN4678-V/RM111 by Microchip Technology

RN4678-V/RM111

Microchip Technology

RN4678-V/RM111 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -20 to 70°C, and supply voltage of 1.9V. It is designed for surface mount applications in telecom circuits, meeting TS 16949 screening standards. With a compact rectangular package style and no-lead terminal form, it is ideal for commercial use in various electronic devices.

R-XXMA-N33

22 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.46 mm

1.9 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

RN42-I/RM630 by Microchip Technology

RN42-I/RM630

Microchip Technology

Microchip Technology's RN42-I/RM630 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for industrial applications requiring high-speed data transmission in compact spaces.

3 Mbps

R-XXMA-N32

e4

25.8 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

XMA

MODULE,32LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

1 mm

UNSPECIFIED

13.4 mm

RN42APL-I/RM550 by Microchip Technology

RN42APL-I/RM550

Microchip Technology

RN42APL-I/RM550 by Microchip Tech is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps, nominal voltage of 3.3V, and terminal pitch of 1mm. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

3 Mbps

R-XXMA-N32

e4

25.8 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

XMA

MODULE,32LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

1 mm

UNSPECIFIED

13.4 mm

RN41-I/RM630 by Microchip Technology

RN41-I/RM630

Microchip Technology

Microchip Technology's RN41-I/RM630 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and gold over nickel terminal finish. Suitable for industrial applications, it comes in a rectangular package style with surface mount capability.

R-XXMA-N32

e4

25.8 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

UNSPECIFIED

13.2 mm

RN41SM-I/RM by Microchip Technology

RN41SM-I/RM

Microchip Technology

Microchip Technology's RN41SM-I/RM is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and gold over nickel terminal finish. This rectangular package is ideal for industrial applications requiring reliable telecom circuit interfaces.

R-XXMA-N32

e4

25.8 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

UNSPECIFIED

13.2 mm

RN42-I/RM477 by Microchip Technology

RN42-I/RM477

Microchip Technology

RN42-I/RM477 by Microchip Tech is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps, nominal voltage of 3.3 V, and terminal pitch of 1 mm. Ideal for industrial applications requiring high-speed data transmission in compact form factors.

3 Mbps

R-XXMA-N32

e4

25.8 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

XMA

MODULE,32LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

1 mm

UNSPECIFIED

13.4 mm

RN42HCI-I/RM by Microchip Technology

RN42HCI-I/RM

Microchip Technology

Microchip Technology's RN42HCI-I/RM is a telecom IC with 35 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps and operates at 3.3V. This surface-mount IC is ideal for industrial applications requiring high-speed wireless communication in compact spaces.

3 Mbps

R-XXMA-N35

25.6 mm

1

35

85 Cel

-40 Cel

UNSPECIFIED

XMA

MODULE,35LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

NOT SPECIFIED

13.4 mm

RN42HID-I/RM by Microchip Technology

RN42HID-I/RM

Microchip Technology

Microchip Technology's RN42HID-I/RM is a telecom IC with 32 terminals, operating at 3.3V. It offers a data rate of 3 Mbps and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed wireless communication.

3 Mbps

R-XXMA-N32

e4

25.8 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

XMA

MODULE,32LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

1 mm

UNSPECIFIED

13.4 mm

RN42N-I/RM477 by Microchip Technology

RN42N-I/RM477

Microchip Technology

RN42N-I/RM477 by Microchip Technology is a telecom IC with 32 terminals, operating temperature range of -40 to 85°C, and supply voltage of 3.3V. It is ideal for industrial applications requiring a surface-mount rectangular package with gold over nickel terminal finish.

R-XXMA-N32

e4

20.5 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

UNSPECIFIED

13.4 mm

RN42SM-I/RM by Microchip Technology

RN42SM-I/RM

Microchip Technology

Microchip Technology's RN42SM-I/RM is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and gold over nickel terminal finish. This surface-mount IC is ideal for industrial applications requiring reliable telecom circuitry in a compact rectangular package.

R-XXMA-N32

e4

25.8 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD OVER NICKEL

NO LEAD

UNSPECIFIED

13.4 mm

RN42U-I/RM by Microchip Technology

RN42U-I/RM

Microchip Technology

Microchip Technology's RN42U-I/RM is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and is surface-mountable. Ideal for industrial applications requiring reliable telecom circuit interfaces in compact spaces.

R-XXMA-N32

25.8 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

TS 16949

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

13.4 mm

MRF24WG0MART-I/RM by Microchip Technology

MRF24WG0MART-I/RM

Microchip Technology

MRF24WG0MART-I/RM by Microchip offers TS 16949 screening, operates b/w -40 to 85 °C, and requires 3.3 V supply voltage. Ideal for telecom circuits, this IC has a rectangular package with 36 terminals and is suitable for industrial temperature-grade applications.

R-XDMA-N36

31 mm

1

36

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.7 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

21 mm

BM23SPKA1NB9-0001AA by Microchip Technology

BM23SPKA1NB9-0001AA

Microchip Technology

BM23SPKA1NB9-0001AA by Microchip Technology is a surface mount telecom interface IC with 43 terminals. It operates at temperatures ranging from -20 to 70 °C and has a seated height of 1.9 mm. This IC is commonly used in telecom circuits with a nominal voltage of 3.7 V.

R-XXMA-N43

29 mm

1

43

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,43LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

15 mm

BM23SPKA1NB9-0B02AA by Microchip Technology

BM23SPKA1NB9-0B02AA

Microchip Technology

BM23SPKA1NB9-0B02AA by Microchip Technology is a telecom IC with 43 terminals, operating at -20 to 70°C. It has a nominal voltage of 3.7V and terminal pitch of 1.2mm. This rectangular surface-mount IC is ideal for telecom circuit applications due to its compact size and commercial temperature grade suitability.

R-XXMA-N43

29 mm

1

43

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,43LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

15 mm

BM23SPKS1NB9-0001AA by Microchip Technology

BM23SPKS1NB9-0001AA

Microchip Technology

BM23SPKS1NB9-0001AA by Microchip is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 43 terminals. It operates b/w -20 to 70 °C and has a seated height of 1.9 mm. This TELECOM CIRCUIT IC has a supply voltage of 3.7 V, making it ideal for telecom interface applications.

R-XXMA-N43

29 mm

1

43

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,43LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

15 mm

BM23SPKS1NB9-0B02AA by Microchip Technology

BM23SPKS1NB9-0B02AA

Microchip Technology

BM23SPKS1NB9-0B02AA by Microchip Technology is a Telecom IC with 43 terminals, operating at -20 to 70°C. It has a rectangular package style, measuring 15mm in width and 29mm in length. Ideal for telecom applications requiring a nominal voltage of 3.7V and terminal pitch of 1.2mm.

R-XXMA-N43

29 mm

1

43

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,43LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.9 mm

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

15 mm

WFM200SS22XNA2 by Silicon Labs

WFM200SS22XNA2

Silicon Labs

Silicon Labs' WFM200SS22XNA2 is a Telecom IC with 52 terminals in a square grid array package. Operating from -40 to 105°C, it supports data rates up to 72.2 Mbps. Ideal for telecom applications requiring a compact design and low power consumption.

72.2 Mbps

S-XLGA-N52

6.5 mm

3

1

52

105 Cel

-40 Cel

UNSPECIFIED

LGA

LGA52(UNSPEC)

SQUARE

GRID ARRAY

260

1.4 mm

1.8 V

YES

TELECOM CIRCUIT

NO LEAD

.5 mm

BOTTOM

40

6.5 mm

PM5440B-FEI by Microchip Technology

PM5440B-FEI

Microchip Technology

PM5440B-FEI by Microchip Technology is a grid array package with 1894 terminals. It is a telecom circuit IC designed for telecom interface applications. The package body material is plastic/epoxy, and it features surface mount technology with bottom terminal position in a square shape.

S-PBGA-B1894

1

1894

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5980B-FEI by Microchip Technology

PM5980B-FEI

Microchip Technology

PM5980B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals. It is a TELECOM CIRCUIT IC for telecom applications, featuring PLASTIC/EPOXY material and BOTTOM terminal position. Suitable for surface mount assembly, it offers high functionality in a compact SQUARE package shape.

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5981B-FEI by Microchip Technology

PM5981B-FEI

Microchip Technology

PM5981B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals in PLASTIC/EPOXY material. It is a TELECOM CIRCUIT IC designed for telecom interfaces, featuring surface mount capability and ball-shaped bottom terminals.

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM