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BM23SPKA1NB9-0B02AA

Microchip Technology

BM23SPKA1NB9-0B02AA by Microchip Technology

BM23SPKA1NB9-0B02AA by Microchip Technology is a telecom IC with 43 terminals, operating at -20 to 70°C. It has a nominal voltage of 3.7V and terminal pitch of 1.2mm. This rectangular surface-mount IC is ideal for telecom circuit applications due to its compact size and commercial temperature grade suitability.

Median Price

$10.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 499 parts In-Stock

1+ parts

$10.270

100+ parts

$9.390

1k+ parts

-

10k+ parts

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499

$10.270

$9.390

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DigiKey

USA . 126 parts In-Stock

1+ parts

$10.270

100+ parts

$9.400

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-

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126

$10.270

$9.400

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 77 parts In-Stock

1+ parts

$9.848

100+ parts

-

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77

$9.848

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NAC Semi

USA . 1,953 parts In-Stock

1+ parts

$11.060

100+ parts

$10.030

1k+ parts

$9.170

10k+ parts

-

1,953

$11.060

$10.030

$9.170

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Vyrian

USA . 3,327 parts In-Stock

1+ parts

-

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3,327

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VNN

France . 743 parts In-Stock

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743

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,533 parts In-Stock

1+ parts

$9.848

100+ parts

-

1k+ parts

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10k+ parts

$9.651

6,533

$9.848

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-

$9.651

Ampacity Inc.

Singapore . 1,934 parts In-Stock

1+ parts

$19.000

100+ parts

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1,934

$19.000

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West Coast Incorporated

USA . 6,587 parts In-Stock

1+ parts

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6,587

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Argo Parts USA

USA . 1,280 parts In-Stock

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1,280

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Overview

Enhance your telecommunications systems with the BM23SPKA1NB9-0B02AA by Microchip Technology. This high-quality telecom interface IC offers seamless integration and reliable performance, thanks to Microchip's reputation for excellence in manufacturing. Ideal for a wide range of applications in the telecom industry, this product provides unparalleled value, benefits, and advantages to customers looking to streamline their operations and enhance connectivity. Upgrade your systems today with the BM23SPKA1NB9-0B02AA and experience the difference Microchip Technology can make.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor, making it compatible with a wide range of equipment and systems.

No. of Terminals: 43

Having a high number of terminals allows for more connectivity options and flexibility in designing complex telecom interfaces.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand higher temperature environments without compromising performance.

Minimum Operating Temperature: -20 °C

The ability to operate at low temperatures ensures reliable functionality even in cold conditions.

Width: 15 mm

Compact width dimension enables efficient use of space on the circuit board, ideal for applications with limited space.

Length: 29 mm

Optimal length dimension provides a balanced form factor for compatibility with various electronic systems.

Nominal Supply Voltage: 3.7 V

The specified supply voltage ensures stable and consistent power delivery, enhancing the reliability of the product.

Technical Specifications

Other Function Telecom Interface ICs BM23SPKA1NB9-0B02AA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N43

Length:

29 mm

No. of Functions:

1

No. of Terminals:

43

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,43LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

1.9 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.2 mm

Terminal Position:

UNSPECIFIED

Width:

15 mm

Trade Compliance

BM23SPKA1NB9-0B02AA Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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