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BM23SPKA1NB9-0001AA

Microchip Technology

BM23SPKA1NB9-0001AA by Microchip Technology

BM23SPKA1NB9-0001AA by Microchip Technology is a surface mount telecom interface IC with 43 terminals. It operates at temperatures ranging from -20 to 70 °C and has a seated height of 1.9 mm. This IC is commonly used in telecom circuits with a nominal voltage of 3.7 V.

Median Price

$13.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 52 parts In-Stock

1+ parts

$13.200

100+ parts

$7.920

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52

$13.200

$7.920

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Vyrian

USA . 5,143 parts In-Stock

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VNN

France . 1,872 parts In-Stock

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1,872

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Nova Conductors

Japan . 150 parts In-Stock

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150

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ACDS - Activité Composants Distribution Service

France . 52 parts In-Stock

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Dan-Mar Components

USA . 52 parts In-Stock

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52

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Distributors (Availability)

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AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$17.548

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324

$17.548

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Ampacity Inc.

Singapore . 1,535 parts In-Stock

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$716.000

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1,535

$716.000

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Lixinc

USA . 17,446 parts In-Stock

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RC Electronics

USA . 7,618 parts In-Stock

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$6.290

1k+ parts

$5.740

10k+ parts

$5.570

7,618

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$6.290

$5.740

$5.570

Fulton Briggs Corp.

USA . 7,409 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,675 parts In-Stock

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6,675

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Alle Elektronik GmbH

Germany . 4,450 parts In-Stock

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4,450

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Continental Prestige Electronics

USA . 2,738 parts In-Stock

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Argo Parts USA

USA . 1,556 parts In-Stock

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Kepictronics

USA . 126 parts In-Stock

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126

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the BM23SPKA1NB9-0001AA by Microchip Technology - a game-changer in the world of Other Function Telecom Interface ICs! With its superior quality and innovative design, this product is set to revolutionize telecommunication applications. Experience seamless connectivity, enhanced performance, and unrivaled reliability with Microchip's cutting-edge technology. Say hello to efficient communication systems and say goodbye to limitations. Whether you're a professional or an enthusiast, the BM23SPKA1NB9-0001AA is here to take your experience to new heights. Join the future of telecom and unlock limitless possibilities today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing manufacturing costs and improving product reliability.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact design, saving space on the PCB and making it suitable for tight layout constraints.

No. of Terminals: 43

With a high number of terminals, this product offers versatility in connecting various components and interfaces, enhancing its functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environments, making it suitable for industrial applications.

Nominal Supply Voltage: 3.7 V

The nominal supply voltage of 3.7V is commonly used in portable electronic devices, making this product compatible with a wide range of applications.

Technical Specifications

Other Function Telecom Interface ICs BM23SPKA1NB9-0001AA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N43

Length:

29 mm

No. of Functions:

1

No. of Terminals:

43

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,43LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

1.9 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.2 mm

Terminal Position:

UNSPECIFIED

Width:

15 mm

Trade Compliance

BM23SPKA1NB9-0001AA Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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